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1. 发明申请

WO2014096303A1 PLASMA ENHANCED DEPOSITION ARRANGEMENT FOR EVAPORATION OF DIELECTRIC MATERIALS, DEPOSITION APPARATUS AND METHODS OF OPERATING THEREOF 审中-公开
标题翻译：用于电介质材料蒸发的等离子体增强沉积装置，沉积装置及其操作方法
公开(公告)号：WO2014096303A1
公开(公告)日：2014-06-26
申请号：PCT/EP2013/077575
申请日：2013-12-20
申请人： APPLIED MATERIALS, INC. , KELLER, Stefan , BANGERT, Stefan , KWAK BYUNG-SUNG, Leo
发明人： KELLER, Stefan , BANGERT, Stefan , KWAK BYUNG-SUNG, Leo
IPC分类号： H01J37/32 , H01M4/04 , H01M10/04
CPC分类号： C23C14/243 , C23C14/0676 , C23C14/246 , C23C14/30 , C23C14/32 , C23C14/50 , H01J37/32091 , H01J37/32357 , H01J37/3244 , H01M4/0428 , H01M4/1391 , H01M10/052 , H01M10/0562
摘要： A depositing arrangement for evaporation of a dielectric material onto a substrate is described. The deposition arrangement a vapor distribution showerhead, a holder for providing the dielectric material in the vapor distribution showerhead, wherein the holder has a feeding unit for feeding the dielectric material into the vapor distribution showerhead, an energy source configured for melting and evaporating the dielectric material in the vapor distribution showerhead or sublimating the dielectric material in the vapor distribution showerhead, wherein the vapor distribution showerhead has one or more outlets for directing the vaporized dielectric material towards a substrate, and particularly wherein the energy source emits electrons or photons, wherein the electrons or photons melt and evaporate the dielectric material or sublimate the dielectric material. The arrangement further includes a plasma source configured for providing a plasma between the vapor distribution showerhead and the substrate.
摘要翻译：描述了用于将电介质材料蒸发到基底上的沉积布置。沉积装置包括蒸气分配喷头，用于在蒸气分配喷头中提供电介质材料的保持器，其中保持器具有用于将电介质材料馈送到蒸气分配喷头中的馈送单元，被配置用于熔化和蒸发介电材料的能量源在蒸气分配淋浴喷头中或升华蒸气分配淋浴喷头中的介电材料，其中蒸气分配喷头具有一个或多个出口，用于将蒸发的介电材料引向基板，特别是其中能量源发射电子或光子，其中电子或光子熔化和蒸发电介质材料或使电介质材料升华。该装置还包括等离子体源，其构造成在蒸气分配喷头和衬底之间提供等离子体。

2. 发明申请

WO2013106082A2 MASK-LESS FABRICATION OF THIN FILM BATTERIES 审中-公开
标题翻译：薄膜电池的无掩模制造
公开(公告)号：WO2013106082A2
公开(公告)日：2013-07-18
申请号：PCT/US2012/042523
申请日：2012-06-14
申请人： APPLIED MATERIALS, INC. , SONG, Daoying , JIANG, Chong , KWAK, Byung Sung, Leo
发明人： SONG, Daoying , JIANG, Chong , KWAK, Byung Sung, Leo
IPC分类号： H01M2/10 , H01M10/36
CPC分类号： H01M6/40 , B01J19/121 , B01J2219/0879 , B01J2219/12 , C01B21/097 , C01G51/42 , C01P2006/40 , H01M2/026 , H01M2/0277 , H01M2/26 , H01M4/04 , H01M4/0426 , H01M4/139 , H01M4/1395 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/185 , H01M6/186 , H01M10/0404 , H01M10/0436 , H01M10/052 , H01M10/0562 , H01M10/0585 , H01M2220/30 , H01M2300/0068 , Y10T29/49108
摘要： Thin film batteries (TFB) are fabricated by a process which eliminates and/or minimizes the use of shadow masks. A selective laser ablation process, where the laser patterning process removes a layer or stack of layers while leaving layer(s) below intact, is used to meet certain or all of the patterning requirements. For die patterning from the substrate side, where the laser beam passes through the substrate before reaching the deposited layers, a die patterning assistance layer, such as an amorphous silicon layer or a microcrystalline silicon layer, may be used to achieve thermal stress mismatch induced laser ablation, which greatly reduces the laser energy required to remove material.
摘要翻译：薄膜电池（TFB）通过消除和/或最小化使用荫罩的方法来制造。选择性激光烧蚀工艺用于满足某些或全部图案化要求，其中激光图案化工艺去除一层或多层的层而使层保持完好。对于激光束在到达沉积层之前穿过衬底的衬底侧的图案化，可以使用诸如非晶硅层或微晶硅层的管芯图案辅助层来实现热应力失配引起的激光器消融，这大大降低了去除材料所需的激光能量。

3. 发明申请

WO2013036953A3 MULTIPLE FREQUENCY SPUTTERING FOR ENHANCEMENT IN DEPOSITION RATE AND GROWTH KINETICS DIELECTRIC MATERIALS 审中-公开
标题翻译：用于增加沉积速率和生长动力学电介质材料的多频率溅射
公开(公告)号：WO2013036953A3
公开(公告)日：2013-05-02
申请号：PCT/US2012054501
申请日：2012-09-10
申请人： APPLIED MATERIALS INC , JIANG CHONG , KWAK BYUNG SUNG LEO , STOWELL MICHAEL , ARMSTRONG KARL
发明人： JIANG CHONG , KWAK BYUNG SUNG LEO , STOWELL MICHAEL , ARMSTRONG KARL
IPC分类号： H01L21/203 , H01L21/31
CPC分类号： C23C14/345 , C23C14/00 , C23C14/3471 , H01J37/32165 , H01J37/3405
摘要： A method of sputter depositing dielectric thin films may comprise: providing a substrate on a substrate pedestal in a process chamber, the substrate being positioned facing a sputter target; simultaneously applying a first RF frequency from a first power supply and a second RF frequency from a second power supply to the sputter target; and forming a plasma in the process chamber between the substrate and the sputter target, for sputtering the target; wherein the first RF frequency is less than the second RF frequency, the first RF frequency is chosen to control the ion energy of the plasma and the second RF frequency is chosen to control the ion density of the plasma. The self-bias of surfaces within said process chamber may be selected; this is enabled by connecting a blocking capacitor between the substrate pedestal and ground.
摘要翻译：溅射沉积电介质薄膜的方法可以包括：在处理室中的衬底基座上提供衬底，所述衬底被定位成面对溅射靶; 同时将来自第一电源的第一RF频率和来自第二电源的第二RF频率施加到溅射靶; 以及在所述基板和所述溅射靶之间的所述处理室中形成等离子体，用于溅射所述靶; 其中所述第一RF频率小于所述第二RF频率，选择所述第一RF频率以控制所述等离子体的离子能量，并且选择所述第二RF频率以控制所述等离子体的离子密度。可以选择所述处理室内的表面的自偏压; 这可以通过在衬底基座和接地之间连接隔离电容器来实现。

4. 发明申请

WO2013036953A2 MULTIPLE FREQUENCY SPUTTERING FOR ENHANCEMENT IN DEPOSITION RATE AND GROWTH KINETICS DIELECTRIC MATERIALS 审中-公开
标题翻译：用于增强沉积速率和增长动力学电介质材料的多频率溅射
公开(公告)号：WO2013036953A2
公开(公告)日：2013-03-14
申请号：PCT/US2012/054501
申请日：2012-09-10
申请人： APPLIED MATERIALS, INC. , JIANG, Chong , KWAK, Byung, Sung Leo , STOWELL, Michael , ARMSTRONG, Karl
发明人： JIANG, Chong , KWAK, Byung, Sung Leo , STOWELL, Michael , ARMSTRONG, Karl
IPC分类号： H01L21/203
CPC分类号： C23C14/345 , C23C14/00 , C23C14/3471 , H01J37/32165 , H01J37/3405
摘要： A method of sputter depositing dielectric thin films may comprise: providing a substrate on a substrate pedestal in a process chamber, the substrate being positioned facing a sputter target; simultaneously applying a first RF frequency from a first power supply and a second RF frequency from a second power supply to the sputter target; and forming a plasma in the process chamber between the substrate and the sputter target, for sputtering the target; wherein the first RF frequency is less than the second RF frequency, the first RF frequency is chosen to control the ion energy of the plasma and the second RF frequency is chosen to control the ion density of the plasma. The self-bias of surfaces within said process chamber may be selected; this is enabled by connecting a blocking capacitor between the substrate pedestal and ground.
摘要翻译：溅射沉积电介质薄膜的方法可以包括：在处理室中的衬底基座上提供衬底，衬底定位成面对溅射靶; 同时将来自第一电源的第一RF频率和来自第二电源的第二RF频率施加到所述溅射靶; 以及在衬底和溅射靶之间的处理室中形成等离子体，用于溅射靶; 其中所述第一RF频率小于所述第二RF频率，选择所述第一RF频率来控制所述等离子体的离子能量，并且选择所述第二RF频率来控制所述等离子体的离子密度。所述处理室内的表面的自偏置可以被选择; 这是通过在衬底基座和地之间连接一个阻塞电容来实现的。

5. 发明申请

WO2012109113A3 METHOD FOR ENCAPSULATING AN ORGANIC LIGHT EMITTING DIODE 审中-公开
标题翻译：用于封装有机发光二极管的方法
公开(公告)号：WO2012109113A3
公开(公告)日：2012-11-29
申请号：PCT/US2012023853
申请日：2012-02-03
申请人： APPLIED MATERIALS INC , HAAS DIETER , WHITE JOHN M , KWAK BYUNG-SUNG LEO , CHOI SOO YOUNG , CHEN JRJYAN JERRY , DIEGUEZ-CAMPO JOSE MANUEL
发明人： HAAS DIETER , WHITE JOHN M , KWAK BYUNG-SUNG LEO , CHOI SOO YOUNG , CHEN JRJYAN JERRY , DIEGUEZ-CAMPO JOSE MANUEL
IPC分类号： H01L51/50 , H01L51/56 , H05B33/04
CPC分类号： H01L51/0014 , H01L51/5253
摘要： Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process.
摘要翻译：提供了使用软/聚合物掩模技术封装设置在基板上的OLED结构的方法。与常规硬掩模图案化技术相比，软/聚合物掩模技术可以有效地提供简单且低成本的OLED封装方法。软/聚合物掩模技术可以利用单一聚合物掩模以低成本完成整个封装工艺，并且在使用常规金属掩模时不存在对准问题。不是使用软/聚合物掩模，而是可以将封装层消隐沉积，然后激光烧蚀，使得在封装过程中不使用掩模。

6. 发明申请

WO2011056403A3 SHADOW MASK ALIGNMENT AND MANAGEMENT SYSTEM 审中-公开
标题翻译：阴影遮罩对齐和管理系统
公开(公告)号：WO2011056403A3
公开(公告)日：2011-09-29
申请号：PCT/US2010053067
申请日：2010-10-18
申请人： APPLIED MATERIALS INC , KWAK BYUNG-SUNG LEO , BANGERT STEFAN , HOFMANN RALF , KOENIG MICHAEL
发明人： KWAK BYUNG-SUNG LEO , BANGERT STEFAN , HOFMANN RALF , KOENIG MICHAEL
IPC分类号： H01M10/04 , H01G9/025 , H01M6/18 , H01M10/0562
CPC分类号： H01M6/40 , C23C14/042 , H01M4/02 , H01M4/13 , H01M4/139 , H01M4/5825 , H01M4/621 , H01M4/623 , H01M4/663 , H01M2004/028 , Y02E60/122 , Y10T29/49002 , Y10T29/5313
摘要： A magnetic handling assembly for thin-film processing of a substrate, a system and method for assembling and disassembling a shadow mask to cover a top of a workpiece for exposure to a processing condition. The assembly may include a magnetic handling carrier and a shadow mask disposed over, and magnetically coupled to, the magnetic handling carrier to cover a top of a workpiece that is to be disposed between the shadow mask and the magnetic handling carrier when exposed to a processing condition. A system includes a first chamber with a first support to hold the shadow mask, a second support to hold a handling carrier, and an alignment system to align the shadow mask a workpiece to be disposed between the carrier and shadow mask. The first and second supports are moveable relative to each other.
摘要翻译：一种用于基板的薄膜处理的磁性处理组件，一种组装和拆卸荫罩以覆盖工件的顶部以暴露于处理条件的系统和方法。所述组件可以包括磁性处理载体和设置在所述磁性处理载体上并且磁性耦合到所述磁性处理载体的阴影掩模，以在暴露于处理时覆盖将要设置在所述阴影掩模和所述磁性处理载体之间的工件的顶部条件。一种系统包括具有用于保持荫罩的第一支撑件的第一腔室，用于保持搬运载体的第二支撑件以及用于将荫罩工件对准以设置在载体和荫罩之间的对准系统。第一和第二支撑件可相对于彼此移动。

7. 发明申请

WO2014096302A1 EVAPORATOR, DEPOSITION ARRANGEMENT, DEPOSITION APPARATUS AND METHODS OF OPERATION THEREOF 审中-公开
标题翻译：蒸发器，沉积装置，沉积装置及其操作方法
公开(公告)号：WO2014096302A1
公开(公告)日：2014-06-26
申请号：PCT/EP2013/077569
申请日：2013-12-20
申请人： APPLIED MATERIALS, INC. , KELLER, Stefan , SCHÜSSLER, Uwe , DIEGUEZ-CAMPO, Jose Manuel , BANGERT, Stefan , KWAK BYUNG-SUNG, Leo
发明人： KELLER, Stefan , SCHÜSSLER, Uwe , DIEGUEZ-CAMPO, Jose Manuel , BANGERT, Stefan , KWAK BYUNG-SUNG, Leo
IPC分类号： C23C14/24
CPC分类号： C23C16/4485 , C23C14/246 , C23C16/06 , C23C16/45519 , C23C16/45561 , C23C16/45565 , C23C16/4557 , C23C16/52
摘要： A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate (4) is described. The arrangement a first chamber (110) configured for liquefying the material, a valve (130) being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve, an evaporation zone (114) being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material, and one or more outlets (116) for directing the vaporized material towards the substrate.
摘要翻译：描述了用于蒸发包括碱金属或碱土金属的材料并用于将材料沉积在基板（4）上的沉积布置。该装置构造成用于液化材料的第一室（110），与第一室流体连通并且位于第一室的下游的阀（130），其中阀构造成用于控制液化的流速材料通过阀，蒸发区（114）与阀流体连通并且位于阀的下游，其中蒸发区被配置为蒸发液化材料，以及一个或多个出口（116），用于引导蒸发的材料朝向基板。

8. 发明申请

WO2013106082A3 MASK-LESS FABRICATION OF THIN FILM BATTERIES 审中-公开
标题翻译：薄膜电池无掩膜制造
公开(公告)号：WO2013106082A3
公开(公告)日：2013-10-17
申请号：PCT/US2012042523
申请日：2012-06-14
申请人： APPLIED MATERIALS INC , SONG DAOYING , JIANG CHONG , KWAK BYUNG SUNG LEO
发明人： SONG DAOYING , JIANG CHONG , KWAK BYUNG SUNG LEO
IPC分类号： H01M2/10 , H01M10/36
CPC分类号： H01M6/40 , B01J19/121 , B01J2219/0879 , B01J2219/12 , C01B21/097 , C01G51/42 , C01P2006/40 , H01M2/026 , H01M2/0277 , H01M2/26 , H01M4/04 , H01M4/0426 , H01M4/139 , H01M4/1395 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/185 , H01M6/186 , H01M10/0404 , H01M10/0436 , H01M10/052 , H01M10/0562 , H01M10/0585 , H01M2220/30 , H01M2300/0068 , Y10T29/49108
摘要： Thin film batteries (TFB) are fabricated by a process which eliminates and/or minimizes the use of shadow masks. A selective laser ablation process, where the laser patterning process removes a layer or stack of layers while leaving layer(s) below intact, is used to meet certain or all of the patterning requirements. For die patterning from the substrate side, where the laser beam passes through the substrate before reaching the deposited layers, a die patterning assistance layer, such as an amorphous silicon layer or a microcrystalline silicon layer, may be used to achieve thermal stress mismatch induced laser ablation, which greatly reduces the laser energy required to remove material.
摘要翻译：薄膜电池（TFB）是通过消除和/或最小化使用荫罩的方法来制造的。选择性激光烧蚀工艺，其中激光图案化工艺去除一层或多层的层，同时使层下面完整，用于满足某些或所有图案化要求。对于从衬底侧进行管芯图案化，其中激光束在到达沉积层之前通过衬底，可以使用诸如非晶硅层或微晶硅层的管芯图案辅助层来实现热应力失配诱导激光器消融，这大大降低了去除材料所需的激光能量。

9. 发明申请

WO2012174260A3 PINHOLE-FREE DIELECTRIC THIN FILM FABRICATION 审中-公开
标题翻译：无孔电介质薄膜制造
公开(公告)号：WO2012174260A3
公开(公告)日：2013-04-25
申请号：PCT/US2012042487
申请日：2012-06-14
申请人： APPLIED MATERIALS INC , JIANG CHONG , KWAK BYUNG SUNG LEO
发明人： JIANG CHONG , KWAK BYUNG SUNG LEO
IPC分类号： H01M14/00
CPC分类号： C23C14/0676 , C23C14/08 , C23C14/5826 , C23C14/586
摘要： A method of depositing a dielectric thin film may include: depositing a thin layer of dielectric; stopping deposition of the dielectric layer, and modifying the gas in the chamber if desired; inducing and maintaining a plasma in the vicinity of the substrate to provide ion bombardment of the deposited layer of dielectric; and repeating the depositing, stopping and inducing and maintaining steps until a desired thickness of dielectric is deposited. A variation on this method may include, in place of the repeating step: depositing a thick layer of lower quality dielectric; depositing a thin layer of high quality dielectric; stopping deposition of the dielectric layer, and modifying the gas in the chamber if desired; and inducing and maintaining a plasma in the vicinity of the substrate to provide ion bombardment of the deposited layer of dielectric. The thick layer of dielectric may be deposited more rapidly than the thin layers.
摘要翻译：沉积电介质薄膜的方法可以包括：沉积介电薄层; 阻止介电层的沉积，如果需要则改变腔中的气体; 在衬底附近诱导和维持等离子体，以提供沉积的电介质层的离子轰击; 并重复沉积，停止和引导和维持步骤，直到沉积所需的电介质厚度。该方法的变型可以包括：代替重复步骤：沉积较厚质量的电介质层; 沉积一层高质量的电介质; 阻止介电层的沉积，如果需要则改变腔中的气体; 以及在衬底附近诱导和维持等离子体，以提供沉积的电介质层的离子轰击。电介质的厚层可以比薄层更快地沉积。

10. 发明申请

WO2013022992A2 THIN FILM STRUCTURES AND DEVICES WITH INTEGRATED LIGHT AND HEAT BLOCKING LAYERS FOR LASER PATTERNING 审中-公开
标题翻译：薄膜结构和器件，集成光和热阻塞层用于激光图案
公开(公告)号：WO2013022992A2
公开(公告)日：2013-02-14
申请号：PCT/US2012/050025
申请日：2012-08-08
申请人： APPLIED MATERIALS, INC. , SONG, Daoying , JIANG, Chong , KWAK, Byung, Sung Leo , GORDON, Joseph, G.
发明人： SONG, Daoying , JIANG, Chong , KWAK, Byung, Sung Leo , GORDON, Joseph, G.
IPC分类号： H01L21/301 , H01M10/04 , H01L31/18
CPC分类号： H01L31/1876 , H01L31/02164 , H01L31/02167 , H01L31/024 , H01L31/0463 , H01L31/18 , H01M4/0471 , H01M6/40 , H01M10/0436
摘要： Selective removal of specified layers of thin film structures and devices, such as solar cells, electrochromics, and thin film batteries, by laser direct patterning is achieved by including heat and light blocking layers in the device/structure stack immediately adjacent to the specified layers which are to be removed by laser ablation. The light blocking layer is a layer of metal that absorbs or reflects a portion of the laser energy penetrating through the dielectric/semiconductor layers and the heat blocking layer is a conductive layer with thermal diffusivity low enough to reduce heat flow into underlying metal layer(s), such that the temperature of the underlying metal layer(s) does not reach the melting temperature, Tm, or in some embodiments does not reach (Tm)/3, of the underlying metal layer(s) during laser direct patterning.
摘要翻译：通过激光直接图案化来选择性去除特定层的薄膜结构和器件，例如太阳能电池，电致变色和薄膜电池，通过在器件/结构中包括热阻挡层和光阻挡层堆叠紧邻指定层，这些层要通过激光烧蚀去除。光阻挡层是吸收或反射透过电介质/半导体层的激光能量的一部分的金属层，并且热阻挡层是具有足够低的热扩散率的导电层以减少热流进入下面的金属层），使得在激光直接图案化期间，下层金属层的温度没有达到熔化温度Tm，或者在一些实施例中没有达到下层金属层的（Tm）/ 3。 / p>

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