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1. 发明申请

WO2012109113A3 METHOD FOR ENCAPSULATING AN ORGANIC LIGHT EMITTING DIODE 审中-公开
标题翻译：用于封装有机发光二极管的方法
公开(公告)号：WO2012109113A3
公开(公告)日：2012-11-29
申请号：PCT/US2012023853
申请日：2012-02-03
申请人： APPLIED MATERIALS INC , HAAS DIETER , WHITE JOHN M , KWAK BYUNG-SUNG LEO , CHOI SOO YOUNG , CHEN JRJYAN JERRY , DIEGUEZ-CAMPO JOSE MANUEL
发明人： HAAS DIETER , WHITE JOHN M , KWAK BYUNG-SUNG LEO , CHOI SOO YOUNG , CHEN JRJYAN JERRY , DIEGUEZ-CAMPO JOSE MANUEL
IPC分类号： H01L51/50 , H01L51/56 , H05B33/04
CPC分类号： H01L51/0014 , H01L51/5253
摘要： Methods for encapsulating OLED structures disposed on a substrate using a soft/polymer mask technique are provided. The soft/polymer mask technique can efficiently provide a simple and low cost OLED encapsulation method, as compared to convention hard mask patterning techniques. The soft/polymer mask technique can utilize a single polymer mask to complete the entire encapsulation process with low cost and without alignment issues present when using conventional metal masks. Rather than utilizing a soft/polymer mask, the encapsulation layers may be blanked deposited and then laser ablated such that no masks are utilized during the encapsulation process.
摘要翻译：提供了使用软/聚合物掩模技术封装设置在基板上的OLED结构的方法。与常规硬掩模图案化技术相比，软/聚合物掩模技术可以有效地提供简单且低成本的OLED封装方法。软/聚合物掩模技术可以利用单一聚合物掩模以低成本完成整个封装工艺，并且在使用常规金属掩模时不存在对准问题。不是使用软/聚合物掩模，而是可以将封装层消隐沉积，然后激光烧蚀，使得在封装过程中不使用掩模。

2. 发明申请

WO2015086168A8 A PROCESSING APPARATUS FOR PROCESSING DEVICES, PARTICULARLY DEVICES INCLUDING ORGANIC MATERIALS THEREIN, AND METHOD FOR TRANSFERRING AN EVAPORATION SOURCE FROM A PROCESSING VACUUM CHAMBER TO A MAINTENANCE VACUUM CHAMBER OR FROM THE MAINTENANCE VACUUM CHAMBER TO THE PROCESSING VACUUM CHAMBER 审中-公开
标题翻译：用于处理装置的处理装置，包括其有机材料的特定装置，以及将蒸发源从处理真空室传送到维护真空室或从维护真空室转移到加工真空室的方法
公开(公告)号：WO2015086168A8
公开(公告)日：2016-06-09
申请号：PCT/EP2014067673
申请日：2014-08-19
申请人： APPLIED MATERIALS INC , DIEGUEZ-CAMPO JOSE MANUEL , BANGERT STEFAN , SCHÜSSLER UWE , HAAS DIETER
发明人： DIEGUEZ-CAMPO JOSE MANUEL , BANGERT STEFAN , SCHÜSSLER UWE , HAAS DIETER
IPC分类号： C23C14/04 , B05D1/00 , B05D1/02 , B05D3/04 , C23C14/12 , C23C14/24 , C23C14/56 , C23C16/44 , H01L51/00 , H01L51/56
CPC分类号： C23C14/243 , C23C14/042 , C23C14/12 , C23C14/246 , C23C14/50 , C23C14/56 , C23C14/562 , C23C14/564 , C23C14/566 , H01L51/001 , H01L51/0011 , H01L51/56
摘要： A processing apparatus for processing devices, particularly devices including organic materials therein, is described. The processing apparatus includes a processing vacuum chamber; at least one evaporation source for organic material, wherein the at least one evaporation source includes at least one evaporation crucible, wherein the at least one evaporation crucible is configured to evaporate the organic material, and at least one distribution pipe with one or more outlets, wherein the at least one distribution pipe is in fluid communication with the at least one evaporation crucible; and a maintenance vacuum chamber connected with the processing vacuum chamber, wherein the at least one evaporation source can be transferred from the processing vacuum chamber to the maintenance vacuum chamber and from the maintenance vacuum chamber to the processing vacuum chamber.
摘要翻译：描述了用于处理装置的处理装置，特别是包括其中的有机材料的装置。处理装置包括处理真空室; 用于有机材料的至少一个蒸发源，其中所述至少一个蒸发源包括至少一个蒸发坩埚，其中所述至少一个蒸发坩埚被配置为蒸发所述有机材料，以及至少一个具有一个或多个出口的分配管，其中所述至少一个分配管与所述至少一个蒸发坩埚流体连通; 以及与所述处理真空室连接的维护真空室，其中所述至少一个蒸发源可以从所述处理真空室转移到所述维护真空室，并且从所述维护真空室转移到所述处理真空室。

3. 发明申请

WO2016070941A8 MATERIAL SOURCE ARRANGMENT AND NOZZLE FOR VACUUM DEPOSITION 审中-公开
标题翻译：用于真空沉积的材料源布置和喷嘴
公开(公告)号：WO2016070941A8
公开(公告)日：2017-06-15
申请号：PCT/EP2014074088
申请日：2014-11-07
申请人： APPLIED MATERIALS INC , BANGERT STEFAN , SCHÜSSLER UWE , DIEGUEZ-CAMPO JOSE MANUEL
发明人： BANGERT STEFAN , SCHÜSSLER UWE , DIEGUEZ-CAMPO JOSE MANUEL
IPC分类号： C23C14/12 , C23C14/24 , C23C14/56 , C23C16/455
CPC分类号： C23C14/24 , C23C14/12 , C23C14/562 , C23C16/45578
摘要： A material source arrangement (100) for depositing a material on a substrate (121) in a vacuum deposition chamber (110) is described. The material source arrangement includes a distribution pipe (106) being configured to be in fluid communication with a material source (102) providing the material to the distribution pipe (106); and at least one nozzle (200; 712) configured for guiding the material provided in the distribution pipe (106) to the vacuum deposition chamber (110). The nozzle (200; 712) includes a thread for repeatedly connecting and disconnecting the nozzle to the distribution pipe. Further, a deposition apparatus (300) for depositing material on a substrate (121) including a material source arrangement, a nozzle for a material source arrangement, and a method for providing a distribution pipe (106) and a nozzle (200; 712) for a material source arrangement (100) are described.
摘要翻译：描述了用于在真空沉积室（110）中的基底（121）上沉积材料的材料源装置（100）。所述材料源装置包括分配管（106），所述分配管（106）被构造成与将所述材料提供到所述分配管（106）的材料源（102）流体连通; 和至少一个喷嘴（200; 712），所述喷嘴被构造成用于将设置在分配管（106）中的材料引导至真空沉积室（110）。喷嘴（200; 712）包括用于重复地将喷嘴连接到分配管和将喷嘴与分配管断开的螺纹。此外，用于在包括材料源装置，用于材料源装置的喷嘴以及用于提供分配管（106）和喷嘴（200; 712）的方法的基板（121）上沉积材料的沉积装置（300）描述了材料源装置（100）。

4. 发明专利

JP2008121115A System and method for control of electromagnetic radiation in pecvd discharge processes 有权
标题翻译：用于控制PECVD放电过程中电磁辐射的系统和方法
公开(公告)号：JP2008121115A
公开(公告)日：2008-05-29
申请号：JP2007286527
申请日：2007-11-02
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： STOWELL MICHAEL W , LIEHR MICHAEL , DIEGUEZ-CAMPO JOSE MANUEL
IPC分类号： C23C16/52 , C23C16/50 , H01L21/31 , H01L21/316
CPC分类号： H01J37/32357 , C23C16/452 , C23C16/482 , C23C16/517 , C23C16/52 , H01J37/32339 , H01J37/32623
摘要： PROBLEM TO BE SOLVED: To provide a system for and a method of coating a substrate with a film.
SOLUTION: One embodiment includes a process that provides a substrate on which to deposit a film; generates a plasma to produce radicals from a support gas; disassociates a precursor gas using the radicals; deposits a material from the disassociated precursor gas on the substrate; and controls the amount of electromagnetic radiation to which the deposited material is exposed.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用薄膜涂覆基材的方法和方法。解决方案：一个实施例包括提供其上沉积膜的基板的工艺; 产生等离子体以从支持气体产生自由基; 使用自由基分离前体气体; 从衬底上分离的前体气体沉积材料; 并且控制沉积材料暴露于其中的电磁辐射的量。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2009010350A Method of cleaning patterning device, method of depositing layer system on substrate, system for cleanine patterning device, and coating system for depositing layer system on substrate 有权
标题翻译：清洁图案装置的方法，基板上沉积层系统的方法，清洁装置的系统以及用于在基板上沉积层系统的涂覆系统
公开(公告)号：JP2009010350A
公开(公告)日：2009-01-15
申请号：JP2008132880
申请日：2008-05-21
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： UWE HOFFMAN , DIEGUEZ-CAMPO JOSE MANUEL
IPC分类号： H01L21/3065 , C23C14/00 , C23C14/04 , C23C14/12 , C23C14/58 , G03F1/08 , H01L21/027 , H01L21/363 , H01L21/365 , H01L51/50 , H05B33/10
CPC分类号： H01L51/0011 , C23C14/042 , C23C14/12 , H01L51/56
摘要： PROBLEM TO BE SOLVED: To provide a method of cleaning a patterning device that has at least an organic coating material (OLED material) deposited thereon. SOLUTION: The method comprises the step of supplying a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 μm/min, particularly 0.5 μm/min, particularly 1 μm/min, particularly 2.5 μm/min, particularly 5 μm/min. In order to generate a pulsed cleaning plasma, pulsed energy is supplied. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined, or they may be carried out sequentially. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种清洁至少具有沉积在其上的有机涂层材料（OLED材料）的图案形成装置的方法。解决方案：该方法包括通过等离子体蚀刻工艺从图案形成装置提供用于去除涂层材料的清洁等离子体的步骤。在从图案形成装置中除去涂层材料的步骤中，图案形成装置的温度不超过引起图案形成装置损坏的临界温度，同时保持等离子体蚀刻速率至少为0.2μm/ min，特别是0.5μm/ min，特别是1μm/ min，特别是2.5μm/ min，特别是5μm/ min。为了产生脉冲清洁等离子体，提供脉冲能量。该方法可以在直接等离子体蚀刻工艺中或在远程等离子体蚀刻工艺中进行。可以组合不同的蚀刻工艺，或者可以依次进行蚀刻。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2009024259A Sputter coating device and method of depositing layer on substrate 审中-公开
标题翻译：溅射涂层装置和沉积在基板上的层的方法
公开(公告)号：JP2009024259A
公开(公告)日：2009-02-05
申请号：JP2008187935
申请日：2008-07-18
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： SCHOLHAMMER JIM , UWE HOFFMAN , DIEGUEZ-CAMPO JOSE MANUEL
IPC分类号： C23C14/34
CPC分类号： C23C14/352 , C23C14/20 , C23C14/564
摘要： PROBLEM TO BE SOLVED: To provide a device and a method for damage free or damage-reduced sputter coating on top of an organic material layer, e.g. on top of an OLED layer, the method having an acceptable coating ratio.
SOLUTION: The sputter coating device comprises: a coating chamber; substrates 110a, 110b each having an organic material layer deposited thereon; at least a rotatable cathode unit arranged in the coating chamber comprising at least one rotatable target 102 and a magnet assembly 104 for generating at least one plasma confinement zone arranged above at least one surface section of the target 102; scattering zone for scattering the sputtered particles; and means for selectively preventing a portion of the sputtered particles from moving to the substrate surface.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在有机材料层的顶部上的无损伤或损坏的溅射涂层的装置和方法，例如，在OLED层的顶部，该方法具有可接受的涂布比。溅射涂布装置包括：涂覆室; 每个具有沉积在其上的有机材料层的衬底110a，110b; 至少一个布置在涂覆室中的可旋转的阴极单元，其包括至少一个可旋转靶102和用于产生布置在靶102的至少一个表面部分上方的至少一个等离子体限制区的磁体组件104; 用于散射溅射颗粒的散射区域; 以及用于选择性地防止溅射的颗粒的一部分移动到基板表面的装置。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008270218A Processing device and method for processing substrate 审中-公开
标题翻译：处理装置和处理基板的方法
公开(公告)号：JP2008270218A
公开(公告)日：2008-11-06
申请号：JP2008109175
申请日：2008-04-18
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： UWE HOFFMAN , DIEGUEZ-CAMPO JOSE MANUEL
IPC分类号： H05B33/10 , H01L51/50 , H05B33/04
CPC分类号： H01L51/56 , C23C14/12 , C23C14/564 , C23C14/568 , H01L51/5253
摘要： PROBLEM TO BE SOLVED: To provide a processing device for forming a layer system, preferably a layer system including at least one layer of an organic light emitting semiconductor material (OLED). SOLUTION: This processing device 1 comprises an aggregate comprising one or more treatment stations A, 2 for processing a substrate in the treatment stations, and a first encapsulation module 5a having a first encapsulation tool 6a for providing an encapsulation element on the layer system deposited on the substrate. Furthermore, the processing device 1 comprises at least a second encapsulation module 5b having a second encapsulation tool 6b. By providing the two encapsulation modules 5a and 5b, one of them, for instance, the second module 5b is cleaned during a continuous operation of the processing device 1, and in the meantime, the first encapsulation module 5a forms an encapsulation on the coated substrate. Deposition of an OLED coating and an encapsulation element on the OLED coating is continuously executed by a coating device. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于形成层系统的处理装置，优选地包括至少一层有机发光半导体材料（OLED）的层系统。解决方案：该处理装置1包括聚集体，其包括用于处理处理站中的衬底的一个或多个处理站A，2，以及具有用于在层上提供封装元件的第一封装工具6a的第一封装模块5a 系统沉积在基底上。此外，处理装置1至少包括具有第二封装工具6b的第二封装模块5b。通过提供两个封装模块5a和5b，其中一个例如第二模块5b在处理装置1的连续操作期间被清洁，并且同时第一封装模块5a在涂覆的基板上形成封装。通过涂覆装置连续地将OLED涂层和封装元件沉积在OLED涂层上。版权所有（C）2009，JPO＆INPIT

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