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    • 1. 发明专利
    • Raw material gas supply device for semiconductor manufacturing device
    • 用于半导体制造设备的原材料气体供应装置
    • JP2013019003A
    • 2013-01-31
    • JP2011151375
    • 2011-07-08
    • Fujikin Inc株式会社フジキン
    • NAGASE MASAAKIHIDAKA ATSUSHIHIRATA KAORUDOI RYOSUKENISHINO KOJIIKEDA SHINICHI
    • C23C16/448H01L21/31
    • C23C16/448C23C16/4485C23C16/45561C23C16/52Y10T137/86485
    • PROBLEM TO BE SOLVED: To provide a raw material gas supply device that is configured to achieve the simplification and miniaturization of a structure, in which only a raw material gas which is vapor of a liquid raw material gas can be stably supplied to a process chamber while controlling a flow rate at high precision without using a carrier gas.SOLUTION: The raw material gas supply device is constituted in such a manner that the temperature of a source tank 5 storing a liquid raw material gas is held to a set value, further, the supply pressure of the raw material gas G1, which is vapor of the liquid raw material gas derived from an upper space part inside the source tank, to a process chamber 11 is controlled by an automatic pressure regulator 6, and the raw material gas G1 is supplied to the process chamber via an throttle part while holding the pressure of the raw material gas inside the secondary side gas flow passage of the automatic pressure regulator to a desired set pressure.
    • 解决的问题:提供一种原料气体供给装置,其被构造为实现仅能够将液态原料气体的蒸汽的原料气体稳定地供给到的结构的简化和小型化 处理室,同时以高精度控制流量而不使用载气。 解决方案:原料气体供给装置构成为使得储存液体原料气体的源罐5的温度保持在设定值,此外,原料气体G1的供给压力, 将来自源槽内的上部空间部分的液体原料气体的蒸气通过自动压力调节器6控制到处理室11,原料气体G1经由节气门部分 同时将原料气体的压力保持在自动压力调节器的次级侧气体流路内,达到期望的设定压力。 版权所有(C)2013,JPO&INPIT
    • 2. 发明专利
    • Material vaporization supply apparatus and automatic pressure regulator used therefor
    • 材料蒸发供应装置及其自动调压器
    • JP2008010510A
    • 2008-01-17
    • JP2006177113
    • 2006-06-27
    • Fujikin Inc株式会社フジキン
    • HIRATA KAORUNAGASE MASAAKIHIDAKA ATSUSHIMATSUMOTO ATSUSHIDOI RYOSUKENISHINO KOJIIKEDA SHINICHI
    • H01L21/205C23C16/455
    • C23C16/4481C23C16/52G05D16/2013Y10T137/7737
    • PROBLEM TO BE SOLVED: To provide a material vaporization supply apparatus which can accurately control the supply quantity of material to a process chamber, and is used for semiconductor manufacture by MODVC method. SOLUTION: The material vaporization supply apparatus is comprised of a source tank for accumulating material; a flow rate control device which adjusts a carrier gas from a carrier gas supply source at a constant flow rate, and supplies it to the material in the source tank; a primary piping route to lead a mixed gas Go of material vapor G 4 and a carrier gas G 1 accumulating in the upper space of the source tank; an automatic pressure regulator which adjusts the opening of a control valve provided at the end of the primary piping route on the basis of the detected values of pressure and temperature of the mixed gas Go of the primary piping route, and holds the pressure of the mixed gas Go in the source tank at a constant value by adjusting the sectional area of the route distributing the mixed gas Go; and a constant-temperature heater which heats a part other than a computation control unit of the source tank and the automatic pressure regulator at a set temperature. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供一种能够精确地控制处理室的材料供给量的材料蒸发供给装置,并且通过MODVC方法用于半导体制造。

      解决方案:材料蒸发供应装置由用于堆积材料的源罐组成; 流量控制装置,其以恒定的流量调节来自载气供给源的载气,并将其供给到源罐中的材料; 引导物料蒸气G 4 的混合气体Go的主要管道路线和积聚在源罐的上部空间中的载气G 1 基于主要管路的混合气体Go的压力和温度的检测值,调整设置在主管路的末端的控制阀的开度的自动压力调节器,并且保持混合的压力 气体通过调整分配混合气体Go的路径的截面积,以恒定值进入源罐; 以及恒温加热器,其在设定温度下加热源罐的计算控制单元和自动压力调节器以外的部分。 版权所有(C)2008,JPO&INPIT

    • 4. 发明专利
    • Raw material vaporization and supply device
    • 原料气化和供应装置
    • JP2014114463A
    • 2014-06-26
    • JP2012267021
    • 2012-12-06
    • Fujikin Inc株式会社フジキン
    • HIDAKA ATSUSHINAGASE MASAAKIYAMASHITA SATORUNISHINO KOJIIKEDA SHINICHI
    • C23C16/448H01L21/31
    • C23C16/4485C23C16/4481C23C16/4482C23C16/52F17C9/02F22B1/284F22B1/285
    • PROBLEM TO BE SOLVED: To stably supply a raw material gas with high purity and desired concentration to a process chamber while performing flow rate control with high precision by making substantially any raw material gas into a raw material gas with desired high temperature and high vapor pressure without causing any thermal decomposition irrelevantly to whether the raw material is solid or liquid.SOLUTION: In a raw material gas supply device comprising a raw material receiving tank, a vaporizer which vaporizes a liquid pressure-fed from the liquid receiving tank, a flow rate control device which controls the flow rate of a raw material gas from the vaporizer, and a heating device which heats desired parts of the vaporizer, high-temperature and pressure type flow rate control device, and a pipeline connected thereto, respective liquid contact parts or gas contact parts of metal surfaces of any of at least the raw material receiving tank, vaporizer, flow rate control device, pipeline connecting the devices to one another, and an on/off valve interposed in the pipeline are subjected to AlOpassive-state processing, CrOpassive state processing, or FeFpassive state processing.
    • 要解决的问题:通过将基本上任何原料气体基本上成为具有期望的高温和高蒸气压的原料气体,来将高纯度和期望浓度的原料气体稳定地供应到处理室,同时以高精度进行流量控制 不会对原料是固体还是液体造成任何热分解。解决方案:在原料气体供给装置中,包括原料接收罐,蒸发从液体接收罐供给的液体的蒸发器, 控制装置,其控制来自蒸发器的原料气体的流量;以及加热装置,其加热蒸发器,高温和压力型流量控制装置的所需部分以及与其连接的管道,各自的液体接触部分或 至少原料接收罐,蒸发器,流量控制装置,管道c中任何一个的金属表面的气体接触部分 将设备彼此连接,并且插入管道中的开/关阀进行AlOpassive状态处理,CrOpassive状态处理或FeFpassive状态处理。
    • 6. 发明专利
    • System for vaporizing and feeding liquid material
    • 蒸气和送料液体系统
    • JP2010180429A
    • 2010-08-19
    • JP2009022688
    • 2009-02-03
    • Fujikin Inc株式会社フジキン
    • HIDAKA ATSUSHINAGASE MASAAKIIKEDA SHINICHIDOI RYOSUKENISHINO KOJI
    • C23C16/448H01L21/205H01L21/31
    • PROBLEM TO BE SOLVED: To provide a system for vaporizing and feeding a liquid material capable of reducing the opening/closing frequency of a valve for regulating the flow rate of the liquid material, controlling the flow rate of raw material gas vaporized by a vaporizer with high precision, and making service life of the valve longer.
      SOLUTION: The system for vaporizing and feeding the liquid material comprises: a vaporizer 4 for receiving and vaporizing the liquid material to be pressed and fed; a flow rate controller 5 for regulating the flow rate of flow-out gas from the vaporizer 4; a pressure detector 6 for detecting the pressure of the gas to be fed from the vaporizer 4 to the flow rate controller 5; a control valve 7 for controlling the feed of the liquid material to the vaporizer 4; and a controller which controls the control valve 7 to open when the gas pressure in the vaporizer 4 is dropped, and the detected value of the pressure detector 6 is equal to or less than the preset threshold, and controls the control valve 7 to close after the lapse of the predetermined delay time after the gas pressure in the vaporizer 4 is increased by the opening operation of the control valve 7, and the detected value of the pressure detector 6 exceeds the threshold.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种用于蒸发和供给能够降低用于调节液体材料的流量的阀的打开/关闭频率的液体材料的系统,控制由液体材料蒸发的原料气体的流量 蒸发器精度高,使阀门使用寿命更长。 解决方案:用于蒸发和供给液体材料的系统包括:蒸发器4,用于接收和蒸发待加压和供给的液体材料; 用于调节来自蒸发器4的流出气体的流量的流量控制器5; 用于检测从蒸发器4供给到流量控制器5的气体的压力的压力检测器6; 用于控制液体材料进入蒸发器4的控制阀7; 以及当蒸发器4中的气体压力下降时控制阀7打开的控制器,并且压力检测器6的检测值等于或小于预设阈值,并且控制阀7关闭之后 在蒸发器4中的气体压力经过控制阀7的打开操作而增加了预定的延迟时间,压力检测器6的检测值超过阈值。 版权所有(C)2010,JPO&INPIT
    • 8. 发明专利
    • Flow rate control device with flow rate monitor
    • 流量监控器流量控制装置
    • JP2014186662A
    • 2014-10-02
    • JP2013062537
    • 2013-03-25
    • Fujikin Inc株式会社フジキン
    • NAGASE MASAAKIHIDAKA ATSUSHINISHINO KOJIIKEDA SHINICHI
    • G05D7/06
    • G05D7/0635G01F1/42G01F1/50G01F15/005Y10T137/7761
    • PROBLEM TO BE SOLVED: To provide a pressure type flow rate control device with a flow rate monitor, capable of monitoring a flow rate almost in a real time, and automatically adjusting the set flow rate of a pressure type flow rate control part by using a monitor flow rate, and achieving the significant miniaturization and cost reduction of the device by combining a build-down type flow rate monitor part with the upstream side of the pressure type flow rate control part by effectively using the high pressure variation resistance characteristics of the pressure type flow rate control part.SOLUTION: A flow rate control device with a flow rate monitor comprises: a build-down type flow rate monitor part BDM installed at an upstream side; a pressure type flow rate control part FCS installed at the downstream side; a signal transmission circuit CT for connecting the build-down type flow rate monitor part BDM with the pressure type flow rate control part FCS, and for transmitting a monitor flow rate Q of the build-down type flow rate monitor part BDM to the pressure type flow rate control part FCS; and a flow rate set value adjustment mechanism QSR installed at the pressure type flow rate control part FCS for adjusting a set flow rate Qs of the pressure type flow rate control part FCS in accordance with the monitor flow rate Q from the build-down type flow rate monitor part BDM.
    • 要解决的问题:提供一种具有流量监测器的压力式流量控制装置,其能够几乎实时地监测流量,并且通过使用压力式流量控制部件自动调节压力型流量控制部件的设定流量 监测流量,通过有效地利用压力型流量控制部分的高压变异电阻特性,结合压缩式流量监测部分与压力式流量控制部分的上游侧,实现装置的显着的小型化和成本降低 型流量控制部分。解决方案:具有流量监测器的流量控制装置包括:安装在上游侧的建立型流量监测部分BDM; 安装在下游侧的压力式流量控制部FCS; 用于将建成型流量监视器部分BDM与压力型流量控制部分FCS连接的信号传输电路CT,以及用于将建立型流量监视器部分BDM的监测流量Q发送到压力型 流量控制部分FCS; 以及安装在压力型流量控制部FCS上的流量设定值调节机构QSR,用于根据来自增压型流量的监视流量Q调整压力型流量控制部FCS的设定流量Qs 速率监视器BDM。
    • 9. 发明专利
    • Raw material vaporization supply apparatus
    • 原料气化装置
    • JP2013033782A
    • 2013-02-14
    • JP2011167915
    • 2011-08-01
    • Fujikin Inc株式会社フジキン
    • NAGASE MASAAKIHIDAKA ATSUSHIHIRATA KAORUDOI RYOSUKENISHINO KOJIIKEDA SHINICHI
    • H01L21/205C23C16/448
    • C23C16/4485
    • PROBLEM TO BE SOLVED: To make a raw material vaporization supply apparatus compact, to improve the quality of a semiconductor product, and to easily manage the remaining amount of raw material by stably supplying raw material vapor generated by heating solid raw material or liquid raw material to a process chamber while performing flow rate control using a pressure type flow controller.SOLUTION: The raw material vaporization supply apparatus comprises a source tank in which the raw material is reserved, a raw material vapor supply path which supplies the raw material vapor from an internal space of a source tank to the process chamber, the pressure type flow controller which is interposed in the raw material vapor supply path and controls the flow rate of the raw material vapor supplied to the process chamber, and a constant-temperature heating part which heats the source tank, supply path, and pressure type flow controller to set temperature, and then supplies the raw material vapor generated in the internal space of the source tank to the process chamber while performing flow rate control by the pressure type flow controller.
    • 要解决的问题:为了使原料蒸发供给装置紧凑,提高半导体产品的质量,并且通过稳定地供应通过加热固体原料产生的原料蒸汽或容易地管理原料的剩余量,或者 在使用压力型流量控制器进行流量控制的同时将液态原料输送到处理室。 原料蒸发供给装置包括:预备原料的源罐,将原料蒸气从源罐的内部空间供给到处理室的原料蒸气供给路径,压力 型流量控制器,其插入在原料蒸气供给路径中,并控制供给到处理室的原料蒸气的流量;以及恒温加热部,其对源罐,供给路径和压力型流量控制器 设定温度,然后在通过压力式流量控制器进行流量控制的同时将在源罐的内部空间中产生的原料蒸气供给到处理室。 版权所有(C)2013,JPO&INPIT
    • 10. 发明专利
    • Material vaporization supply apparatus
    • 材料蒸发供应设备
    • JP2012234860A
    • 2012-11-29
    • JP2011100446
    • 2011-04-28
    • Fujikin Inc株式会社フジキン
    • HIDAKA ATSUSHIHIRATA KAORUNAGASE MASAAKIDOI RYOSUKENISHINO KOJIIKEDA SHINICHI
    • H01L21/205C23C16/448
    • C23C16/45512C23C16/4481C23C16/45557C23C16/52Y10T137/7837
    • PROBLEM TO BE SOLVED: To provide a material vaporization supply apparatus for precisely adjusting material concentration in mixed gas, supplying the mixed gas to a process chamber in a stable manner, and facilitating the residual amount control of the material.SOLUTION: A material vaporization supply apparatus comprises: a source tank 5 for accumulating material 4; a flow channel Lfor supplying carrier gas Ggiven by a carrier gas supply source 1 to an inner-upper space 5a of the source tank 5; an automatic pressure regulator 15 for controlling the pressure in the inner-upper space 5a by adjusting an opening of a control valve CV; a flow channel Lfor supplying mixed gas G, which is mixture of material vapor produced from the material 4 and the carrier gas, to a process chamber 11; a flow rate controller 19 for automatically controlling the flow rate of the mixed gas Gwhich is supplied to the process chamber 11 by adjusting an opening of a control valve CV; and a constant-temperature heater for heating the flow channel Land flow channel Lat a set temperature. The mixed gas Gis supplied to the process chamber 11 while the inner-upper space 5a is controlled at a desired pressure.
    • 解决的问题:提供一种用于精确调整混合气体中的材料浓度的材料蒸发供给装置,以稳定的方式将混合气体供给到处理室,并且有助于材料的剩余量控制。 解决方案:一种材料蒸发供应装置包括:用于堆积材料4的源罐5; 用于将载气供给源1给出的载气气体G 1 的气流通道L 1 的源罐5; 自动压力调节器15,用于通过调节控制阀CV 1 的打开来控制内部上部空间5a中的压力; 用于供应混合气体G 0 的流动通道L 2 ,这是由材料4产生的材料蒸气和载体 气体到处理室11; 流量控制器19,用于通过调节控制阀的开度自动控制供给到处理室11的混合气体G 0 的流量 2 ; 以及用于在设定温度下加热流路L 1 和流路L 2 的恒温加热器。 将混合气体G 0 供给到处理室11,同时将内部上部空间5a控制在期望的压力。 版权所有(C)2013,JPO&INPIT