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1. 发明申请

WO2004105112A1 SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS 审中-公开
标题翻译：基板保持装置和抛光装置
公开(公告)号：WO2004105112A1
公开(公告)日：2004-12-02
申请号：PCT/JP2004/002219
申请日：2004-02-25
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , NABEYA, Osamu
发明人： TOGAWA, Tetsuji , NABEYA, Osamu
IPC分类号： H01L21/304
CPC分类号： H01L21/6838 , B24B37/30 , B24B49/16 , H01L21/67092
摘要： A substrate holding apparatus holds a substrate such as a semiconductor and presses the substrate against a polishing surface. The substrate holding apparatus includes a top ring body (2) for holding the substrate, a plurality of fluid passages (33, 34, 35, 36) for supplying a fluid to a plurality of pressure chambers (22, 23, 24, 25) defined in the top ring body, and a plurality of sensors (S1, S2, S3, S4) disposed in the fluid passages, respectively, for detecting flowing states of the fluid which flows through the fluid passages.
摘要翻译：基板保持装置保持诸如半导体的基板，并将基板压靠在抛光表面上。基板保持装置包括用于保持基板的顶环体（2），用于向多个压力室（22,23,24,25）供给流体的多个流体通道（33,34,35,36）以及分别设置在流体通道中的多个传感器（S1，S2，S3，S4），用于检测流过流体通道的流体的流动状态。

2. 发明申请

WO2010021297A1 METHOD AND APPARATUS FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：抛光衬底的方法和装置
公开(公告)号：WO2010021297A1
公开(公告)日：2010-02-25
申请号：PCT/JP2009/064319
申请日：2009-08-07
申请人： EBARA CORPORATION , FUKUSHIMA, Makoto , TOGAWA, Tetsuji , SAITO, Shingo , INOUE, Tomoshi
发明人： FUKUSHIMA, Makoto , TOGAWA, Tetsuji , SAITO, Shingo , INOUE, Tomoshi
IPC分类号： B24B37/04 , H01L21/304
CPC分类号： B24B37/20 , B24B37/005 , B24B37/042 , B24B37/32 , B24B49/10 , B24B49/12
摘要： A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.
摘要翻译：抛光方法用于将半导体晶片等基板研磨成平面镜面。通过研磨装置研磨基板的方法包括具有研磨面的研磨台（100），用于保持基板并将基板压靠在研磨面上的顶环（1），以及可升降机构沿垂直方向移动顶环（1）。在将衬底压靠在抛光表面之前，将顶环（1）移动到第一高度，然后在衬底被压靠在抛光表面上之后将顶环（1）移动到第二高度。

3. 发明申请

WO2004060610A3 SUBSTRATE HOLDING MECHANISM, SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 审中-公开
标题翻译：基板保持机构，基板抛光装置和基板抛光方法
公开(公告)号：WO2004060610A3
公开(公告)日：2004-11-25
申请号：PCT/JP0317032
申请日：2003-12-26
申请人： EBARA CORP , TOSHIBA KK , TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYOTA GEN , IWADE KENJI , TATEYAMA YOSHIKUNI
发明人： TOGAWA TETSUJI , WATANABE TOSHIO , YANO HIROYUKI , TOYOTA GEN , IWADE KENJI , TATEYAMA YOSHIKUNI
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , B24B41/06 , B24B49/14 , B24B55/02 , H01L21/304
CPC分类号： B24B37/015 , B24B41/061 , B24B55/02
摘要： A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing the polishing solution and polishing dust from adhering to the outer peripheral portion of the substrate holding part and drying out thereon. The substrate holding mechanism (top ring 1) has a mounting flange 2, a support member 6, and a retainer ring 3. A substrate W to be polished is held on the lower side of the support member 6 surrounded by the retainer ring 3, and the substrate W is pressed against a polishing surface. The mounting flange 2 is provided with a flow passage 26 contiguous with at least the retainer ring 3. A temperature-controlled gas is supplied through the flow passage 26 to cool the mounting flange 2, the support member 6 and the retainer ring 3. The retainer ring 3 is provided with a plurality of through-holes 3a communicating with the flow passage 26 to spray the gas flowing through the flow passage 26 onto the polishing surface of a polishing table.
摘要翻译：基板保持机构，基板研磨装置和基板研磨方法具有能够使待研磨基板的抛光时产生的热量最小化的功能，并有效地冷却基板保持机构的基板保持部，并且还能够有效地防止研磨液和研磨粉尘附着在基板保持部的外周部并在其上干燥。基板保持机构（顶环1）具有安装凸缘2，支撑构件6和保持环3.待被抛光的基板W被保持在由保持环3包围的支撑构件6的下侧，将基板W压在研磨面上。安装凸缘2设置有与至少保持环3相邻的流动通道26.通过流动通道26供应温度控制的气体以冷却安装凸缘2，支撑构件6和保持环3。保持环3设置有与流路26连通的多个通孔3a，以将流过流路26的气体喷射到研磨台的研磨面上。

4. 发明申请

WO2006049269A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：WO2006049269A1
公开(公告)日：2006-05-11
申请号：PCT/JP2005/020334
申请日：2005-10-31
申请人： EBARA CORPORATION , NABEYA, Osamu , TOGAWA, Tetsuji , FUKUSHIMA, Makoto , YASUDA, Hozumi
发明人： NABEYA, Osamu , TOGAWA, Tetsuji , FUKUSHIMA, Makoto , YASUDA, Hozumi
IPC分类号： H01L21/304 , B24B37/04
CPC分类号： B24B37/20 , B24B37/005 , B24B37/10 , B24B37/105 , B24B37/30 , B24B37/32 , B24B47/22 , B24B49/00 , B24B49/16
摘要： A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20) when a lower surface of the top ring (20) is brought into contact with the polishing pad (22), and a controller (47) operable to calculate an optimal position of the top ring (20) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor (46). The vertical movement mechanism (24) includes a ball screw mechanism (30, 32, 38, 42) operable to move the top ring (20) to the optimal position.
摘要翻译：抛光装置（1）具有抛光垫（22），用于保持半导体晶片（W）的顶环（20），可垂直移动顶环（20）的垂直移动机构（24）距离测量传感器（46），当所述顶环（20）的下表面与所述抛光垫（22）接触时，可操作以检测所述顶环（20）的位置;以及控制器（47），其可操作以基于由距离测量传感器（46）检测到的位置，计算顶环（20）的最佳位置以对半导体晶片（W）进行抛光。垂直运动机构（24）包括可操作以将顶环（20）移动到最佳位置的滚珠丝杆机构（30,32,38,42）。

5. 发明申请

WO2004113020A1 SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD 审中-公开
标题翻译：基板抛光装置和底板抛光方法
公开(公告)号：WO2004113020A1
公开(公告)日：2004-12-29
申请号：PCT/JP2004/008855
申请日：2004-06-17
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , FUKAYA, Koichi , TADA, Mitsuo , TAKAHASHI, Taro , SUTO, Yasunari
发明人： TOGAWA, Tetsuji , FUKAYA, Koichi , TADA, Mitsuo , TAKAHASHI, Taro , SUTO, Yasunari
IPC分类号： B24B37/00
CPC分类号： B24B37/013 , B24B49/105 , B24B49/12 , B24B49/16
摘要： The present invention relates to a substrate polishing apparatus and a substrate polishing method for polishing a substrate such as a semiconductor wafer to a flat finish. The substrate polishing apparatus includes a polishing table (100) having a polishing surface (101), a substrate holder (1) for holding and pressing a substrate (W) against the polishing surface (101) of the polishing table (100), and a film thickness measuring device (200) for measuring a thickness of a film on the substrate (W). The substrate holder (1) has a plurality of pressure adjustable chambers (22 to 25), and pressures in the respective chambers (22 to 25) are adjusted based on the film thickness measured by the film thickness measuring device (200).
摘要翻译：本发明涉及一种用于将诸如半导体晶片的基板抛光到平整的基板抛光装置和基板抛光方法。基板研磨装置具备：具有抛光面（101）的研磨台（100），将基板（W）保持并压靠在研磨台（100）的研磨面（101）上的基板保持架（1），以及用于测量衬底（W）上的膜的厚度的膜厚测量装置（200）。衬底保持器（1）具有多个压力可调节室（22〜25），并且基于由膜厚测量装置（200）测量的膜厚调节各个室（22至25）中的压力。

6. 发明申请

WO2009102047A1 POLISHING APPARATUS 审中-公开
标题翻译：抛光装置
公开(公告)号：WO2009102047A1
公开(公告)日：2009-08-20
申请号：PCT/JP2009/052456
申请日：2009-02-09
申请人： EBARA CORPORATION , FUKUSHIMA, Makoto , TOGAWA, Tetsuji , YASUDA, Hozumi , SAITO, Koji , NABEYA, Osamu , INOUE, Tomoshi
发明人： FUKUSHIMA, Makoto , TOGAWA, Tetsuji , YASUDA, Hozumi , SAITO, Koji , NABEYA, Osamu , INOUE, Tomoshi
IPC分类号： B24B37/04
CPC分类号： B24B37/30
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.
摘要翻译：抛光装置用于将半导体晶片等基板研磨成平面镜面。抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。

7. 发明申请

WO2004070806A1 SUBSTRATE HOLDING APPARATUS AND POLISHING APPARATUS 审中-公开
标题翻译：基板保持装置和抛光装置
公开(公告)号：WO2004070806A1
公开(公告)日：2004-08-19
申请号：PCT/JP2004/001143
申请日：2004-02-04
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , YOSHIDA, Hiroshi , NABEYA, Osamu , FUKUSHIMA, Makoto , FUKAYA, Koichi
发明人： TOGAWA, Tetsuji , YOSHIDA, Hiroshi , NABEYA, Osamu , FUKUSHIMA, Makoto , FUKAYA, Koichi
IPC分类号： H01L21/304
CPC分类号： B24B37/30 , B24B37/32 , B24B49/16
摘要： The present invention relates to a substrate holding apparatus for holding a substrate (W) such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. A substrate holding apparatus comprises a vertically movable member (6), and an elastic member (7) for defining a chamber (22). The elastic member (7) comprises a contact portion (8) which is brought into contact with the substrate (W), and a circumferential wall (9) extending upwardly from the contact portion (8) and connected to the vertically movable member (6). The circumferential wall (9) has a stretchable and contractible portion (40) which is stretchable and contractible vertically.
摘要翻译：本发明涉及一种用于将基板（W）例如半导体晶片保持在用于将基板抛光到抛光装置的平面光洁度的基板保持装置。基板保持装置包括可垂直移动的构件（6）和用于限定腔室（22）的弹性构件（7）。弹性构件（7）包括与基板（W）接触的接触部分（8）和从接触部分（8）向上延伸并连接到可垂直移动的部件（6）的周壁（9））。周壁（9）具有可伸缩的部分（40），其可垂直伸缩。

8. 发明申请

WO0247139A3 METHODE OF FORMING A COPPER FILM ON A SUBSTRATE 审中-公开
标题翻译：在基材上形成铜膜的方法
公开(公告)号：WO0247139A3
公开(公告)日：2004-01-15
申请号：PCT/JP0110590
申请日：2001-12-04
申请人： EBARA CORP , KONDO FUMIO , MISHIMA KOJI , TANAKA AKIRA , SUZUKI YOKO , TOGAWA TETSUJI , INOUE HIROAKI
发明人： KONDO FUMIO , MISHIMA KOJI , TANAKA AKIRA , SUZUKI YOKO , TOGAWA TETSUJI , INOUE HIROAKI
IPC分类号： B65G49/07 , B24B37/04 , B24B49/16 , C23C18/16 , C25D5/00 , C25D5/50 , C25D7/12 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/304 , H01L21/3205 , H01L21/321 , H01L21/673 , H01L21/677 , H01L21/768 , H01L23/52 , B24B7/22
CPC分类号： H01L21/67161 , B24B37/005 , B24B37/042 , B24B37/245 , B24B37/345 , B24B41/061 , B24B49/16 , C23C18/1632 , C23C18/1653 , C25D7/123 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67219 , H01L21/6723 , H01L21/67393 , H01L21/67396 , H01L21/67772 , H01L21/7684 , H01L21/76843 , H01L21/76849 , H01L21/76864 , H01L21/76873 , H01L21/76874 , H01L21/76877
摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.
摘要翻译：一种基板处理方法，包括在基板的表面上形成铜膜的步骤。这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边部分进行调整。

9. 发明申请

WO2003077296A1 DEHYDRATION DRYING METHOD AND APPARATUS, AND SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：脱水干燥方法和装置，以及基板加工装置
公开(公告)号：WO2003077296A1
公开(公告)日：2003-09-18
申请号：PCT/JP2003/002553
申请日：2003-03-05
申请人： EBARA CORPORATION , ATO, Koji , TOGAWA, Tetsuji
发明人： ATO, Koji , TOGAWA, Tetsuji
IPC分类号： H01L21/304
CPC分类号： H01L21/67034 , F26B5/04 , F26B25/063 , H01L21/02052 , H01L21/3105 , H01L21/31695
摘要： A dehydration drying method dehydrates and dries a substrate. The substrate (15) is dehydrated and dried without being rotated while the substrate (15) is accommodated in a carrier (10) operable to carry the substrate (15) between apparatuses for carrying out certain processes.
摘要翻译：脱水干燥方法使基材脱水并干燥。基板（15）被脱水和干燥而不旋转，同时基板（15）容纳在可操作以将基板（15）承载在用于执行某些处理的装置之间的载体（10）中。

10. 发明申请

WO2003006206A1 SUBSTRATE POLISHING MACHINE 审中-公开
标题翻译：基板抛光机
公开(公告)号：WO2003006206A1
公开(公告)日：2003-01-23
申请号：PCT/JP2002/006979
申请日：2002-07-10
申请人： EBARA CORPORATION , TOGAWA, Tetsuji , NOJI, Ikutaro , NAMIKI, Keisuke , YASUDA, Hozumi , KOJIMA, Shunichiro , SAKURAI, Kunihiko , TAKADA, Nobuyuki , NABEYA, Osamu , FUKUSHIMA, Makoto , TAKAYANAGI, Hideki
发明人： TOGAWA, Tetsuji , NOJI, Ikutaro , NAMIKI, Keisuke , YASUDA, Hozumi , KOJIMA, Shunichiro , SAKURAI, Kunihiko , TAKADA, Nobuyuki , NABEYA, Osamu , FUKUSHIMA, Makoto , TAKAYANAGI, Hideki
IPC分类号： B24B37/04
CPC分类号： B24B37/30 , B24B37/32
摘要： There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.
摘要翻译：提供了一种衬底抛光机，其包括抛光表面和用于保持衬底并使其与抛光表面接触的衬底载体。基板载体包括载体主体，用于将待研磨的基板的表面保持在基板上的基板保持部件朝向研磨面。衬底保持构件以使得衬底保持构件能够朝向和远离抛光表面移动的方式安装在载体主体上。基板研磨机还包括基板保持部件定位装置，该基板保持部件定位装置设置在基板保持部件的与保持基板相同的一侧。衬底保持构件定位装置具有限定腔室的柔性构件，并且在引入不可压缩流体时沿朝向抛光表面的方向膨胀。

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