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    • 4. 发明申请
    • Method For Fabricating Semiconductor Device Having Metal Fuse
    • 制造具有金属保险丝的半导体器件的方法
    • US20080070398A1
    • 2008-03-20
    • US11758512
    • 2007-06-05
    • Dong Su ParkHo Jin ChoKeum Bum LeeSu Jin ChaeCheol-Hwan Park
    • Dong Su ParkHo Jin ChoKeum Bum LeeSu Jin ChaeCheol-Hwan Park
    • H01L23/525
    • H01L23/5258H01L2924/0002H01L2924/00
    • Disclosed herein is a method of fabricating a semiconductor device having a metal fuse. The method includes forming a plate electrode on a semiconductor substrate, forming an interlayer insulating layer on the plate electrode, forming a barrier metal layer containing either silicon or aluminum, a first metal layer and an antireflection layer containing either silicon or aluminum sequentially from bottom to top on the interlayer insulating layer. The method also includes patterning the antireflection layer, the first metal layer, and the barrier metal layer to form a first metal interconnection. The method also includes forming a fuse with the same material and structure as those of the first metal interconnection while forming the first metal interconnection. The method further includes forming an inter-metal dielectric layer on the first metal interconnection and the fuse, forming a second metal interconnection on the inter-metal dielectric layer, forming a passivation layer on the second metal interconnection, and forming a fuse box in the passivation layer.
    • 这里公开了一种制造具有金属保险丝的半导体器件的方法。 该方法包括在半导体衬底上形成平板电极,在平板电极上形成层间绝缘层,从底部依次形成含有硅或铝的阻挡金属层,第一金属层和含有硅或铝的抗反射层, 顶层在层间绝缘层上。 该方法还包括图案化抗反射层,第一金属层和阻挡金属层以形成第一金属互连。 该方法还包括形成具有与第一金属互连相同的材料和结构的熔丝,同时形成第一金属互连。 该方法还包括在第一金属互连和熔丝上形成金属间电介质层,在金属间绝缘层上形成第二金属互连,在第二金属互连上形成钝化层,并在第 钝化层。
    • 8. 发明授权
    • Phase-change memory device and method for manufacturing the same
    • 相变存储器件及其制造方法
    • US07772101B2
    • 2010-08-10
    • US12146184
    • 2008-06-25
    • Su-Jin ChaeKeum-Bum LeeMin-Yong Lee
    • Su-Jin ChaeKeum-Bum LeeMin-Yong Lee
    • H01L21/44
    • H01L45/06H01L27/2409
    • A phase-change memory device and a fabrication method thereof, capable of reducing driving current while minimizing a size of a contact hole used for forming a PN diode in the phase-change memory device that employs the PN diode. The method of fabricating the phase-change memory device includes the steps of preparing a semiconductor substrate having a junction area formed with a dielectric layer, forming an interlayer dielectric layer having etching selectivity lower than that of the dielectric layer over an entire structure, and forming a contact hole by removing predetermined portions of the interlayer dielectric layer and the dielectric layer. The contact area between the PN diode and the semiconductor substrate is increased so that interfacial resistance is reduced.
    • 一种相变存储器件及其制造方法,其能够在使用PN二极管的相变存储器件中最小化用于形成PN二极管的接触孔的尺寸的同时降低驱动电流。 制造相变存储器件的方法包括以下步骤:制备具有形成有介电层的结区的半导体衬底,在整个结构上形成具有低于电介质层的蚀刻选择性的层间电介质层,以及形成 通过去除层间电介质层和电介质层的预定部分的接触孔。 PN二极管和半导体衬底之间的接触面积增加,从而降低界面电阻。