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    • 2. 发明申请
    • METHODS FOR PRODUCING UNIFORM LARGE-GRAINED AND GRAIN BOUNDARY LOCATION MANIPULATED POLYCRYSTALLINE THIN FILM SEMICONDUCTORS USING SEQUENTIAL LATERIAL SOLIDIFICATION
    • 用于生产均匀的大颗粒和颗粒边界位置的方法操作的多晶薄膜半导体使用顺序方向固化
    • US20070202668A1
    • 2007-08-30
    • US11744493
    • 2007-05-04
    • James ImRobert SposiliMark Crowder
    • James ImRobert SposiliMark Crowder
    • H01L21/20
    • B23K26/0622B23K26/0626B23K26/066G03F7/70041G03F7/70725H01L21/02532H01L21/0268H01L21/02686H01L21/02691H01L27/1285H01L27/1296H01L29/04
    • Methods for processing an amorphous silicon thin film sample into a polycrystalline silicon thin film are disclosed. In one preferred arrangement, a method includes the steps of generating a sequence of excimer laser pulses, controllably modulating each excimer laser pulse in the sequence to a predetermined fluence, homoginizing each modulated laser pulse in the sequence in a predetermined plane, masking portions of each homoginized fluence controlled laser pulse in the sequence with a two dimensional pattern of slits to generate a sequence of fluence controlled pulses of line patterned beamlets, each slit in the pattern of slits being sufficiently narrow to prevent inducement of significant nucleation in region of a silicon thin film sample irradiated by a beamlet corresponding to the slit, irradiating an amorphous silicon thin film sample with the sequence of fluence controlled slit patterned beamlets to effect melting of portions thereof corresponding to each fluence controlled patterned beamlet pulse in the sequence of pulses of patterned beamlets, and controllably sequentially translating a relative position of the sample with respect to each of the fluence controlled pulse of slit patterned beamlets to thereby process the amorphous silicon thin film sample into a single or polycrystalline silicon thin film.
    • 公开了将非晶硅薄膜样品加工成多晶硅薄膜的方法。 在一个优选的布置中,一种方法包括以下步骤:产生准分子激光脉冲序列,可控制地将序列中的每个准分子激光脉冲调制成预定的注量,在预定的平面中使序列中的每个调制的激光脉冲均匀化, 均匀注入能量密度控制的激光脉冲具有两维狭缝图案的序列,以产生线图案化子束的注量控制脉冲序列,狭缝图案中的每个狭缝足够窄以防止在硅薄层区域中引起显着成核 通过对应于狭缝的子束照射的薄膜样品,以可控流程控制的狭缝图案化子束的顺序照射非晶硅薄膜样品,以按照图案化子束的脉冲序列对应于每个注量控制的图案化子束脉冲的部分进行熔化, 并可控地顺序地翻译一个关系 相对于狭缝图案化子束的每个注量控制脉冲的样品的位置,从而将非晶硅薄膜样品处理成单个或多晶硅薄膜。
    • 6. 发明申请
    • Method for optimized laser annealing smoothing
    • 优化激光退火平滑的方法
    • US20050009352A1
    • 2005-01-13
    • US10913678
    • 2004-08-05
    • Mark CrowderYasuhiro MitaniApostolos Voutsas
    • Mark CrowderYasuhiro MitaniApostolos Voutsas
    • B23K26/06H01L21/00H01L21/20H01L21/302H01L21/44H01L21/461H01L21/84
    • H01L21/0268B23K26/066H01L21/2026
    • A laser annealing mask is provided with cross-hatched sub-resolution aperture patterns. The mask comprises a first section with aperture patterns for transmitting approximately 100% of incident light, and at least one section with cross-hatched sub-resolution aperture patterns for diffracting incident light. In one aspect, a second mask section with cross-hatched sub-resolution aperture patterns has an area adjacent a vertical edge and a third mask section with cross-hatched sub-resolution aperture patterns adjacent the opposite vertical edge, with the first mask section being located between the second and third mask sections. The section with cross-hatched sub-resolution aperture patterns transmits approximately 40% to 70%, and preferably 50% to 60% of incident light energy density. In some aspects, the section with cross-hatched sub-resolution aperture patterns includes a plurality of different cross-hatched aperture patterns. The cross-hatched sub-resolution aperture patterns can be defined by horizontal gap and slits, as well as vertical gap and slits.
    • 激光退火掩模具有交叉阴影的子分辨率孔径图案。 掩模包括具有用于传输大约100%的入射光的孔径图案的第一部分和具有用于衍射入射光的交叉阴影的子分辨率孔径图案的至少一个部分。 在一个方面,具有交叉阴影线的子分辨率孔径图案的第二掩模部分具有与垂直边缘相邻的区域和具有与相对的垂直边缘相邻的交叉阴影的子分辨率孔径图案的第三掩模部分,第一掩模部分是 位于第二和第三掩模部分之间。 具有交叉阴影的子分辨率孔径图案的部分透射入射光能密度的大约40%至70%,优选地为50%至60%。 在一些方面,具有交叉阴影的子分辨率孔径图案的部分包括多个不同的交叉阴影孔径图案。 交叉阴影的子分辨率孔径图案可以由水平间隙和狭缝以及垂直间隙和狭缝限定。
    • 7. 发明申请
    • Methods for producing uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors using sequential lateral solidification
    • 使用顺序侧向凝固生产均匀的大粒度和晶界位置操纵多晶薄膜半导体的方法
    • US20050255640A1
    • 2005-11-17
    • US11141815
    • 2005-06-01
    • James ImRobert SposiliMark Crowder
    • James ImRobert SposiliMark Crowder
    • G03F7/20H01L21/20H01L21/77H01L21/84H01L29/04
    • B23K26/0622B23K26/0626B23K26/066G03F7/70041G03F7/70725H01L21/02532H01L21/0268H01L21/02686H01L21/02691H01L27/1285H01L27/1296H01L29/04
    • Methods for processing an amorphous silicon thin film sample into a polycrystalline silicon thin film are disclosed. In one preferred arrangement, a method includes the steps of generating a sequence of excimer laser pulses, controllably modulating each excimer laser pulse in the sequence to a predetermined fluence, homoginizing each modulated laser pulse in the sequence in a predetermined plane, masking portions of each homoginized fluence controlled laser pulse in the sequence with a two dimensional pattern of slits to generate a sequence of fluence controlled pulses of line patterned beamlets, each slit in the pattern of slits being sufficiently narrow to prevent inducement of significant nucleation in region of a silicon thin film sample irradiated by a beamlet corresponding to the slit, irradiating an amorphous silicon thin film sample with the sequence of fluence controlled slit patterned beamlets to effect melting of portions thereof corresponding to each fluence controlled patterned beamlet pulse in the sequence of pulses of patterned beamlets, and controllably sequentially translating a relative position of the sample with respect to each of the fluence controlled pulse of slit patterned beamlets to thereby process the amorphous silicon thin film sample into a single or polycrystalline silicon thin film.
    • 公开了将非晶硅薄膜样品加工成多晶硅薄膜的方法。 在一个优选的布置中,一种方法包括以下步骤:产生准分子激光脉冲序列,可控制地将序列中的每个准分子激光脉冲调制成预定的注量,在预定的平面中使序列中的每个调制的激光脉冲均匀化, 均匀注入能量密度控制的激光脉冲具有两维狭缝图案的序列,以产生线图案化子束的注量控制脉冲序列,狭缝图案中的每个狭缝足够窄以防止在硅薄层区域中引起显着成核 通过对应于狭缝的子束照射的薄膜样品,以可控流程控制的狭缝图案化子束的顺序照射非晶硅薄膜样品,以按照图案化子束的脉冲序列对应于每个注量控制的图案化子束脉冲的部分进行熔化, 并可控地顺序地翻译一个关系 相对于狭缝图案化子束的每个注量控制脉冲的样品的位置,从而将非晶硅薄膜样品处理成单个或多晶硅薄膜。
    • 9. 发明申请
    • Contamination Resistant Surfaces
    • 耐污染表面
    • US20080160215A1
    • 2008-07-03
    • US11617662
    • 2006-12-28
    • Mark CrowderChristina Haley
    • Mark CrowderChristina Haley
    • C23C16/50B05D5/06
    • C23C16/26B05D1/62B05D5/083C23C16/505
    • The invention provides a fluorocarbon coating having a reduced surface energy that has low susceptibility to molecular and particulate contamination. The fluorocarbon coating is stable and functional in vacuum. The fluorocarbon coating is stable to chemical solvents, cryogenic temperatures, and temperatures as high as 400° C. The fluorocarbon coating may be deposited as a thin film or produced as a modification to a surface of optical instruments without significant alteration of the optical characteristics. The fluorocarbon coating may reside on a textured substrate or include texturing within the process to further enhance the contamination resistant qualities of the treated surface. The fluorocarbon coating may be graded in composition throughout the coating layer. The invention can be used on surfaces that operate in aerospace environments and in dusty environments where contamination is an important consideration.
    • 本发明提供了具有降低的表面能的氟碳涂层,其对分子和颗粒污染的敏感性低。 氟碳涂层在真空中稳定和功能。 氟碳涂层对于化学溶剂,低温温度和高达400℃的温度是稳定的。氟碳涂层可以作为薄膜沉积或者作为光学仪器表面的修饰产生,而不会显着改变光学特性。 氟碳涂层可以驻留在织构化的基底上,或者包括在该方法内的纹理以进一步增强被处理表面的抗污染性质。 氟碳涂层可以在整个涂层中以组成分级分。 本发明可用于在航空航天环境中和在污染是重要考虑因素的多尘环境中工作的表面。