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    • 5. 发明授权
    • Method for manufacturing semiconductor substrate
    • 半导体衬底的制造方法
    • US08273611B2
    • 2012-09-25
    • US12840379
    • 2010-07-21
    • Tetsuya KakehataKazutaka Kuriki
    • Tetsuya KakehataKazutaka Kuriki
    • H01L21/762
    • H01L21/76254
    • A single crystal semiconductor layer is formed over a substrate having an insulating surface by the following steps: forming an ion doped layer at a given depth from a surface of a single crystal semiconductor substrate; performing plasma treatment to the surface of the single crystal semiconductor substrate; forming an insulating layer on the single crystal semiconductor substrate to which the plasma treatment is performed; bonding the single crystal semiconductor substrate to the substrate having the insulating surface with an insulating layer interposed therebetween; and separating the single crystal semiconductor substrate using the ion doped layer as a separation surface. As a result, a semiconductor substrate in which a defect in an interface between the single crystal semiconductor layer and the insulating layer is reduced can be provided.
    • 通过以下步骤在具有绝缘表面的衬底上形成单晶半导体层:从单晶半导体衬底的表面形成在给定深度处的离子掺杂层; 对所述单晶半导体衬底的表面进行等离子体处理; 在进行等离子体处理的单晶半导体基板上形成绝缘层; 将单晶半导体衬底与绝缘表面的衬底接合在绝缘层之间; 以及使用离子掺杂层作为分离表面分离单晶半导体衬底。 结果,可以提供其中单晶半导体层和绝缘层之间的界面的缺陷减小的半导体衬底。
    • 8. 发明申请
    • MANUFACTURING METHOD OF SINGLE CRYSTAL SEMICONDUCTOR FILM AND MANUFACTURING METHOD OF ELECTRODE
    • 单晶半导体膜的制造方法及电极的制造方法
    • US20110269301A1
    • 2011-11-03
    • US13092249
    • 2011-04-22
    • Sho KATOKazutaka KURIKI
    • Sho KATOKazutaka KURIKI
    • H01L21/20
    • H01L21/76251
    • To provide a method of obtaining a single crystal semiconductor film by a method that is simple and low-cost. A single crystal semiconductor film 11 having compression stress is formed over a surface of a single crystal semiconductor substrate 10 by a vapor phase epitaxial growth method, a film having tensile stress (for example, a thermo-setting resin film 12) is formed over a surface of the single crystal semiconductor film 11, and the single crystal semiconductor substrate 10 and the single crystal semiconductor film 11 are separated from each other by a separation step in which force is applied to the single crystal semiconductor film 11, thereby obtaining a single crystal semiconductor film. Note that as the thermo-setting resin film 12, an epoxy resin film can be used, for example.
    • 提供通过简单且低成本的方法获得单晶半导体膜的方法。 通过气相外延生长法在单晶半导体衬底10的表面上形成具有压应力的单晶半导体膜11,在其上形成具有拉伸应力的膜(例如,热固性树脂膜12) 通过对单晶半导体膜11施加力的分离工序将单晶半导体膜11的表面,单晶半导体基板10和单晶半导体膜11分离,得到单晶 半导体膜。 另外,作为热固性树脂膜12,例如可以使用环氧树脂膜。
    • 10. 发明授权
    • Semiconductor substrate, method for manufacturing semiconductor substrate, semiconductor device, and electronic device
    • 半导体衬底,半导体衬底的制造方法,半导体器件和电子器件
    • US07763502B2
    • 2010-07-27
    • US12213308
    • 2008-06-18
    • Tetsuya KakehataKazutaka Kuriki
    • Tetsuya KakehataKazutaka Kuriki
    • H01L21/30
    • H01L21/76254
    • A single crystal semiconductor layer is formed over a substrate having an insulating surface by the following steps: forming an ion doped layer at a given depth from a surface of a single crystal semiconductor substrate; performing plasma treatment to the surface of the single crystal semiconductor substrate; forming an insulating layer on the single crystal semiconductor substrate to which the plasma treatment is performed; bonding the single crystal semiconductor substrate to the substrate having the insulating surface with an insulating layer interposed therebetween; and separating the single crystal semiconductor substrate using the ion doped layer as a separation surface. As a result, a semiconductor substrate in which a defect in an interface between the single crystal semiconductor layer and the insulating layer is reduced can be provided.
    • 通过以下步骤在具有绝缘表面的衬底上形成单晶半导体层:从单晶半导体衬底的表面形成在给定深度处的离子掺杂层; 对所述单晶半导体衬底的表面进行等离子体处理; 在进行等离子体处理的单晶半导体基板上形成绝缘层; 将单晶半导体衬底与绝缘表面的衬底接合在绝缘层之间; 以及使用离子掺杂层作为分离表面分离单晶半导体衬底。 结果,可以提供其中单晶半导体层和绝缘层之间的界面的缺陷减小的半导体衬底。