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1. 发明授权

US08202779B2 Methods for forming a memory cell having a top oxide spacer 有权
标题翻译：形成具有顶部氧化物间隔物的存储单元的方法
公开(公告)号：US08202779B2
公开(公告)日：2012-06-19
申请号：US12891310
申请日：2010-09-27
申请人： Shenqing Fang , Angela Hui , Gang Xue , Alexander Nickel , Kashmir Sahota , Scott Bell , Chun Chen , Wai Lo
发明人： Shenqing Fang , Angela Hui , Gang Xue , Alexander Nickel , Kashmir Sahota , Scott Bell , Chun Chen , Wai Lo
IPC分类号： H01L21/336
CPC分类号： H01L27/11568 , H01L21/28282 , H01L29/792
摘要： Methods for fabricating a semiconductor memory cell that has a spacer layer are disclosed. A method includes forming a plurality of source/drain regions in a substrate where the plurality of source/drain regions are formed between trenches, forming a first oxide layer above the plurality of source/drain regions and in the trenches, forming a charge storage layer above the oxide layer and separating the charge storage layer in the trenches where a space is formed between separated portions of the charge storage layer. The method further includes forming a spacer layer to fill the space between the separated portions of the charge storage layer and to rise a predetermined distance above the space. A second oxide layer is formed above the charge storage layer and the spacer layer and a polysilicon layer is formed above the second oxide layer.
摘要翻译：公开了制造具有间隔层的半导体存储单元的方法。一种方法包括在衬底中形成多个源极/漏极区域，其中多个源极/漏极区域形成在沟槽之间，在多个源极/漏极区域上方和沟槽中形成第一氧化物层，形成电荷存储层在电荷存储层的分离部分之间，在形成空间的沟槽中分离电荷存储层。该方法还包括形成间隔层以填充电荷存储层的分离部分之间的空间并在空间上方上升预定距离。在电荷存储层和间隔层上方形成第二氧化物层，并且在第二氧化物层上方形成多晶硅层。

2. 发明申请

US20110233647A1 METHODS FOR FORMING A MEMORY CELL HAVING A TOP OXIDE SPACER 有权
标题翻译：用于形成具有顶部氧化物间隔物的存储单元的方法
公开(公告)号：US20110233647A1
公开(公告)日：2011-09-29
申请号：US12891310
申请日：2010-09-27
申请人： Shenqing FANG , Angela HUI , Gang XUE , Alexander NICKEL , Kashmir SAHOTA , Scott BELL , Chun CHEN , Wai LO
发明人： Shenqing FANG , Angela HUI , Gang XUE , Alexander NICKEL , Kashmir SAHOTA , Scott BELL , Chun CHEN , Wai LO
IPC分类号： H01L29/788 , H01L21/336
CPC分类号： H01L27/11568 , H01L21/28282 , H01L29/792
摘要： Methods for fabricating a semiconductor memory cell that has a spacer layer are disclosed. A method includes forming a plurality of source/drain regions in a substrate where the plurality of source/drain regions are formed between trenches, forming a first oxide layer above the plurality of source/drain regions and in the trenches, forming a charge storage layer above the oxide layer and separating the charge storage layer in the trenches where a space is formed between separated portions of the charge storage layer. The method further includes forming a spacer layer to fill the space between the separated portions of the charge storage layer and to rise a predetermined distance above the space. A second oxide layer is formed above the charge storage layer and the spacer layer and a polysilicon layer is formed above the second oxide layer.
摘要翻译：公开了制造具有间隔层的半导体存储单元的方法。一种方法包括在衬底中形成多个源极/漏极区域，其中多个源极/漏极区域形成在沟槽之间，在多个源极/漏极区域上方和沟槽中形成第一氧化物层，形成电荷存储层在电荷存储层的分离部分之间，在形成空间的沟槽中分离电荷存储层。该方法还包括形成间隔层以填充电荷存储层的分离部分之间的空间并在空间上方上升预定距离。在电荷存储层和间隔层上方形成第二氧化物层，并且在第二氧化物层上方形成多晶硅层。

3. 发明授权

US07358191B1 Method for decreasing sheet resistivity variations of an interconnect metal layer 有权
标题翻译：降低互连金属层的薄层电阻率变化的方法
公开(公告)号：US07358191B1
公开(公告)日：2008-04-15
申请号：US11388390
申请日：2006-03-24
申请人： Krishnashree Achuthan , Brad Davis , James Xie , Kashmir Sahota
发明人： Krishnashree Achuthan , Brad Davis , James Xie , Kashmir Sahota
IPC分类号： H01L21/311
CPC分类号： H01L21/3212 , H01L21/7684
摘要： According to one exemplary embodiment, a method includes a step of forming a number of trenches in a dielectric layer, where the dielectric layer is situated over a wafer. The method further includes forming a metal layer over the dielectric layer and in the trenches such that the metal layer has a dome-shaped profile over the wafer. The method further includes performing a planarizing process to form a number of interconnect lines, where each of the interconnect lines is situated in one of the trenches. The dome-shaped profile of the metal layer causes the interconnect lines to have a reduced thickness variation across the wafer after performing the planarizing process. The interconnect lines are situated in an interconnect metal layer, where the dome-shaped profile of the metal layer causes the interconnect metal layer to have increased sheet resistivity uniformity across the wafer after performing the planarizing process.
摘要翻译：根据一个示例性实施例，一种方法包括在电介质层中形成多个沟槽的步骤，其中电介质层位于晶片之上。该方法还包括在电介质层上和沟槽中形成金属层，使得金属层在晶片上具有圆顶形轮廓。该方法还包括执行平面化处理以形成多个互连线，其中每个互连线位于沟槽中的一个中。在执行平坦化处理之后，金属层的圆顶形轮廓使得互连线在晶片上具有减小的厚度变化。互连线位于互连金属层中，其中金属层的圆顶形轮廓使得互连金属层在执行平坦化处理之后在晶片上具有增加的片电阻率均匀性。

4. 发明授权

US06376389B1 Method for eliminating anti-reflective coating in semiconductors 有权
标题翻译：消除半导体抗反射涂层的方法
公开(公告)号：US06376389B1
公开(公告)日：2002-04-23
申请号：US09588117
申请日：2000-05-31
申请人： Ramkumar Subramanian , Minh Van Ngo , Kashmir Sahota , Yongzhong Hu , Hiroyuki Kinoshita , Fei Wang , Wenge Yang
发明人： Ramkumar Subramanian , Minh Van Ngo , Kashmir Sahota , Yongzhong Hu , Hiroyuki Kinoshita , Fei Wang , Wenge Yang
IPC分类号： H01L2100
CPC分类号： H01L21/76802 , H01L21/76895 , H01L23/522 , H01L27/115 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a method for manufacturing a semiconductor device without the use of an anti-reflective coating. In one embodiment, electrical devices are formed on a semiconductor substrate. A material with a low dielectric constant such as an oxide is then deposited. The low dielectric layer is then covered with photoresist and photolithographically processed and subsequently developed. The low dielectric layer is then etched using the pattern formed on the photoresist and the photoresist is later removed. Because this process works in any similar circumstances, good examples of its application are the formation of both contacts and local interconnects.
摘要翻译：本发明提供一种不使用抗反射涂层的半导体器件的制造方法。在一个实施例中，电子器件形成在半导体衬底上。然后沉积具有低介电常数的材料，例如氧化物。然后用光致抗蚀剂覆盖低介电层，并进行光刻处理并随后显影。然后使用形成在光致抗蚀剂上的图案蚀刻低介电层，随后去除光致抗蚀剂。因为这个过程在任何类似的情况下都可以工作，它的应用的很好的例子是形成两个触点和局部互连。

5. 发明授权

US06004862A Core array and periphery isolation technique 失效
标题翻译：核心阵列和外围隔离技术
公开(公告)号：US06004862A
公开(公告)日：1999-12-21
申请号：US8320
申请日：1998-01-20
申请人： Unsoon Kim , Hung-Sheng Chen , Kashmir Sahota , Yu Sun
发明人： Unsoon Kim , Hung-Sheng Chen , Kashmir Sahota , Yu Sun
IPC分类号： H01L21/762 , H01L21/76
CPC分类号： H01L21/76202 , H01L21/76224
摘要： A process for forming a semiconductor integrated circuit with a core area densely populated with active devices and with a periphery area less densely populated with active devices as compared to the core area, comprising the steps of: forming a first layer of first insulator material above a semiconductor substrate having a core area and a periphery area, wherein the first insulator material constitutes a polish stop for polishing processes and also as an oxidation barrier; patterning the first layer of first insulator material to expose first portions of the semiconductor substrate substantially only in the core area while using the first insulator material to substantially mask the periphery area; forming a plurality of trenches into the exposed first portions of semiconductor substrate in the core area; filling the plurality of trenches with an insulator; polishing down to the first layer of first insulator material; removing the first layer of first insulator material; forming a second layer of first insulator material over the core and periphery areas; forming openings down into the second layer of first insulator material to expose second portions of the semiconductor substrate substantially only in the periphery area while using the second layer to substantially mask the core area; and forming an isolation region in the exposed second portions of the semiconductor substrate.
摘要翻译：一种用于形成半导体集成电路的方法，所述半导体集成电路具有密集地填充有有源器件的核心区域，并且与所述核心区域相比具有较少密集地填充有源器件的外围区域，包括以下步骤：在第一绝缘体材料的上方形成第一层具有芯区域和周边区域的半导体衬底，其中所述第一绝缘体材料构成用于抛光工艺的抛光止挡件以及氧化屏障; 图案化第一绝缘体材料层，以在使用第一绝缘体材料基本上遮蔽周边区域的同时，在半导体衬底的基本上仅在芯部区域露出第一部分; 在芯区域中的半导体衬底的暴露的第一部分中形成多个沟槽; 用绝缘体填充多个沟槽; 抛光到第一绝缘体材料层; 去除第一绝缘体材料的第一层; 在所述芯和外围区域上形成第二绝缘体材料层; 将第一绝缘体材料的第二层向下形成开口，以便在使用第二层基本上掩蔽核心区域时，基本上只在周边区域露出半导体衬底的第二部分; 以及在半导体衬底的暴露的第二部分中形成隔离区。

6. 发明授权

US06613646B1 Methods for reduced trench isolation step height 有权
标题翻译：减少沟槽隔离台阶的方法
公开(公告)号：US06613646B1
公开(公告)日：2003-09-02
申请号：US10106005
申请日：2002-03-25
申请人： Kashmir Sahota , Krishnashree Achuthan
发明人： Kashmir Sahota , Krishnashree Achuthan
IPC分类号： H01L2176
CPC分类号： H01L21/76229 , H01L21/31053
摘要： Shallow trench isolation techniques are disclosed in which a thin nitride layer is formed on a semiconductor substrate, and a trench is formed through the nitride layer and into the semiconductor substrate, which is then filled. The wafer is then planarized using a fixed-abrasive CMP process to mitigate or avoid step height in the shallow trench isolation process. The nitride layer is then removed following planarization.
摘要翻译：公开了一种浅沟槽隔离技术，其中在半导体衬底上形成薄的氮化物层，并且通过氮化物层形成沟槽并进入到半导体衬底中，然后填充。然后使用固定磨料CMP工艺将晶片平坦化，以减轻或避免浅沟槽隔离工艺中的台阶高度。然后在平坦化之后去除氮化物层。

7. 发明授权

US6136649A Method for removing anti-reflective coating layer using plasma etch process after contact CMP 有权
标题翻译：接触CMP后使用等离子体蚀刻工艺去除抗反射涂层的方法
公开(公告)号：US6136649A
公开(公告)日：2000-10-24
申请号：US416389
申请日：1999-10-12
申请人： Angela T. Hui , Wenge Yang , Kashmir Sahota , Mark T. Ramsbey , Suzette K. Pangrle , Minh Van Ngo
发明人： Angela T. Hui , Wenge Yang , Kashmir Sahota , Mark T. Ramsbey , Suzette K. Pangrle , Minh Van Ngo
IPC分类号： H01L21/311 , H01L21/336 , H01L21/8247
CPC分类号： H01L27/11521 , H01L21/31116 , H01L29/66825
摘要： The present invention provides a method for selectively removing anti-reflective coating (ARC) from the surface of a dielectric layer over the surface of a substrate without scratching the dielectric layer and/or tungsten contacts formed therein. In one embodiment, a fluoromethane (CH.sub.3 F)/oxygen (O.sub.2) etch chemistry is used to selectively remove the ARC layer. The CH.sub.3 F/O.sub.2 etch chemistry etches the ARC layer at a rate which is significantly faster than the etch rates of the dielectric layer or the tungsten contacts.
摘要翻译：本发明提供一种用于在基板表面上从电介质层的表面选择性去除抗反射涂层（ARC）的方法，而不会刮擦形成在其中的电介质层和/或钨触点。在一个实施方案中，使用氟甲烷（CH 3 F）/氧（O 2）蚀刻化学物质来选择性地除去ARC层。 CH3F / O2蚀刻化学蚀刻ARC层的速度明显快于介电层或钨触点的蚀刻速率。

8. 发明授权

US07449413B1 Method for effectively removing polysilicon nodule defects 失效
标题翻译：有效去除多晶硅结节缺陷的方法
公开(公告)号：US07449413B1
公开(公告)日：2008-11-11
申请号：US11402082
申请日：2006-04-11
申请人： Krishnashree Achuthan , Kashmir Sahota
发明人： Krishnashree Achuthan , Kashmir Sahota
IPC分类号： H01L21/302 , H01L21/461 , B24B1/00 , B24C1/00
CPC分类号： H01L21/3212 , H01L21/02068 , H01L21/02074 , H01L21/32134
摘要： According to one exemplary embodiment, a method includes a step of forming a polysilicon layer over a substrate by using a deposition process, where the deposition process causes polysilicon nodule defects to form on a top surface of the polysilicon layer. The method further includes performing a polysilicon CMP process on the polysilicon layer, where the polysilicon CMP process removes a substantial percentage of the polysilicon nodule defects from the top surface of the polysilicon layer. The CMP process removes at least 95.0 percent of the polysilicon nodule defects from the top surface of the polysilicon layer. According to this embodiment, the polysilicon CMP process utilizes a polishing pressure that is less than 1.5 psi. The polysilicon CMP process also utilizes a table speed of between 20.0 rpm and 40.0 rpm. The polysilicon CMP process further utilizes a colloidal silica slurry.
摘要翻译：根据一个示例性实施例，一种方法包括通过使用沉积工艺在衬底上形成多晶硅层的步骤，其中沉积工艺在多晶硅层的顶表面上形成多晶硅结核缺陷。该方法还包括在多晶硅层上执行多晶硅CMP工艺，其中多晶硅CMP工艺从多晶硅层的顶表面去除相当大比例的多晶硅结核缺陷。 CMP工艺从多晶硅层的顶表面去除至少95.0％的多晶硅结核缺陷。根据该实施例，多晶硅CMP工艺利用小于1.5psi的抛光压力。多晶硅CMP工艺还利用了在20.0rpm和40.0rpm之间的工作台速度。多晶硅CMP工艺进一步利用胶体二氧化硅浆料。

9. 发明授权

US07294573B1 Method for controlling poly 1 thickness and uniformity in a memory array fabrication process 有权
标题翻译：用于控制存储器阵列制造工艺中聚1厚度和均匀性的方法
公开(公告)号：US07294573B1
公开(公告)日：2007-11-13
申请号：US11035188
申请日：2005-01-13
申请人： Krishnashree Achuthan , Unsoon Kim , Kashmir Sahota , Patriz C. Regalado
发明人： Krishnashree Achuthan , Unsoon Kim , Kashmir Sahota , Patriz C. Regalado
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01L21/7684
摘要： According to one exemplary embodiment, a method includes planarizing a layer of polysilicon situated over field oxide regions on a substrate to form polysilicon segments, where the polysilicon segments have top surfaces that are substantially planar with top surfaces of the field oxide regions, and where the field oxide regions have a first height and the polysilicon segments have a first thickness. The method further includes removing a hard mask over a peripheral region of the substrate. According to this exemplary embodiment, the method further includes etching the polysilicon segments to cause the polysilicon segments to have a second thickness, which causes the top surfaces of the polysilicon segments to be situated below the top surfaces of the field oxide regions. The polysilicon segments can be etched by using a wet etch process. The polysilicon segments are situated in a core region of the substrate.
摘要翻译：根据一个示例性实施例，一种方法包括将位于衬底上的场氧化物区域上的多晶硅层平坦化以形成多晶硅段，其中多晶硅段具有与场氧化物区域的顶表面基本上平面的顶表面，场氧化物区域具有第一高度，并且多晶硅段具有第一厚度。该方法还包括在衬底的周边区域上去除硬掩模。根据该示例性实施例，该方法还包括蚀刻多晶硅段以使多晶硅段具有第二厚度，这导致多晶硅段的顶表面位于场氧化物区的顶表面之下。可以通过使用湿蚀刻工艺来蚀刻多晶硅段。多晶硅段位于衬底的芯区域中。

10. 发明授权

US06348406B1 Method for using a low dielectric constant layer as a semiconductor anti-reflective coating 有权
标题翻译：使用低介电常数层作为半导体抗反射涂层的方法
公开(公告)号：US06348406B1
公开(公告)日：2002-02-19
申请号：US09586264
申请日：2000-05-31
申请人： Ramkumar Subramanian , Minh Van Ngo , Kashmir Sahota , Yongzhong Hu , Hiroyuki Kinoshita , Fei Wang , Wenge Yang
发明人： Ramkumar Subramanian , Minh Van Ngo , Kashmir Sahota , Yongzhong Hu , Hiroyuki Kinoshita , Fei Wang , Wenge Yang
IPC分类号： H01L214763
CPC分类号： H01L27/11521 , H01L21/31144
摘要： The present invention provides a method for manufacturing a semiconductor device with an anti-reflective coating (ARC) that does not need to be removed. In one embodiment, electrical devices are formed on a semiconductor substrate. A dielectric layer is then deposited over the electrical devices and the semiconductor substrate, upon which an optically transparent ARC layer of low dielectric constant is then deposited. Photoresist is then deposited on top of the ARC layer and is then photolithographically processed and subsequently developed. The dielectric layer is then etched down to the semiconductor substrate to form contacts or local interconnects. The ARC layer can subsequently be used as a hard mask and does not require removal.
摘要翻译：本发明提供一种制造具有不需要去除的抗反射涂层（ARC）的半导体器件的方法。在一个实施例中，电子器件形成在半导体衬底上。然后将电介质层沉积在电气器件和半导体衬底上，然后沉积出具有低介电常数的光学透明ARC层。然后将光致抗蚀剂沉积在ARC层的顶部上，然后光刻加工并随后显影。然后将电介质层向下蚀刻到半导体衬底以形成接触或局部互连。 ARC层可以随后用作硬掩模，并且不需要去除。

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