会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明授权
    • Electronic devices with InAlAsSb/AlSb barrier
    • 具有InAlAsSb / AlSb屏障的电子设备
    • US5798540A
    • 1998-08-25
    • US848203
    • 1997-04-29
    • John Bradley BoosWalter KruppaDoewon ParkBrian R. Bennett
    • John Bradley BoosWalter KruppaDoewon ParkBrian R. Bennett
    • H01L21/308H01L21/338H01L29/201H01L29/205H01L29/778H01L29/812H01L29/00
    • H01L29/205H01L29/201H01L29/7783
    • An electronic device characterized by a GaAs substrate and a base disposed n the substrate, the base comprising InAs channel layer, AlSb layer above the channel layer, In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y layer containing at least In, Al, and As disposed above the AlSb channel layer, InAs cap layer disposed above and in contact with the In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y layer disposed below the InAs channel layer and in contact with the substrate, p.sup.+ GaSb layer disposed within the AlSb layer, Schottky gate with a pad disposed on and in contact with the In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y layer, at least one ohmic contact disposed on the InAs cap layer, and a trench extending through the base to the substrate isolating the gate bonding pad from the device and providing a gate air bridge which prevents contact between the gate and the InAs layer. The gate air bridge fabrication is accomplished by a liquid etchant containing more than half, on volume basis, of concentrated lactic acid or acetic acid with remainder hydrogen peroxide and concentrated hydrofluoric acid. The etchant attacks InAs, In.sub.x Al.sub.1-x As.sub.y Sb.sub.1-y, AlSb, and GaSb but does not attack GaAs and Au-based alloys.
    • 一种电子器件,其特征在于具有GaAs衬底和设置在衬底上的基极,所述基底包括InAs沟道层,在沟道层上方的AlSb层,InxAl1-xAsySb1-y层至少包含位于AlSb沟道上方的In,Al和As 层InAs覆盖层设置在InAs1沟道层下方并与衬底接触的In x Al 1-x As y Sb 1-y层上方并与之接触,设置在AlSb层内的p + GaSb层,具有布置在并且接触的焊盘的肖特基栅极 与InxAl1-xAsySb1-y层,设置在InAs覆盖层上的至少一个欧姆接触,以及延伸穿过基底到衬底的沟槽,将栅极焊盘与器件隔离,并提供栅极空气桥, 门和InAs层。 门空气桥的制造是通过液体蚀刻剂来实现的,该液体蚀刻剂含有一半以上的体积基础上的浓缩乳酸或乙酸,剩余的是过氧化氢和浓缩的氢氟酸。 蚀刻剂攻击InAs,InxAl1-xAsySb1-y,AlSb和GaSb,但不会侵蚀GaAs和Au基合金。