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    • 5. 发明授权
    • Thick film paste systems for circuits on diamond substrates
    • 用于金刚石衬底电路的厚膜贴剂系统
    • US06723420B2
    • 2004-04-20
    • US10119073
    • 2002-04-09
    • Ronald R. Petkie
    • Ronald R. Petkie
    • B32B1500
    • H01C7/003H01C17/06533H01C17/0658H01L23/3732H01L2924/0002Y10T428/24917Y10T428/24926Y10T428/30H01L2924/00
    • This invention relates to the nature of thick film compositions that are specifically designed for the fabrication of circuit elements on diamond substrates, especially resistive elements. The nature of diamond sheet material requires special consideration because of its relatively low coefficient of thermal expansion and its sensitivity to oxygen at elevated processing temperatures. The general compositional requirements of thick film paste formulations are provided as a basis for accommodating the particular physical properties of diamond, and thereby establishing a method by which high performance microelectronic components can be fabricated economically. Thick film pastes containing certain borosilicate glasses, metal components, and optionally semiconducting materials are demonstrated to possess favorable behavior in terms of mechanical and electrical properties after sintering. Resistive elements on diamond can be fabricated by adding conductive components to a borosilicate glass.
    • 本发明涉及专门设计用于在金刚石衬底,特别是电阻元件上制造电路元件的厚膜组合物的性质。 金刚石片材的性质需要特别考虑,因为它在较高的加工温度下具有较低的热膨胀系数和对氧的敏感性。 提供厚膜糊制剂的一般组成要求作为适应金刚石的特定物理性质的基础,从而建立经济地制造高性能微电子元件的方法。 证明含有某些硼硅酸盐玻璃,金属组分和任选的半导体材料的厚膜糊在烧结后的机械和电学性能方面具有良好的性能。 可以通过向硼硅酸盐玻璃中加入导电组分来制造金刚石上的电阻元件。