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1. 发明授权

US07914287B2 System and method of teaching and learning mathematics 有权
标题翻译：教与学数学系统与方法
公开(公告)号：US07914287B2
公开(公告)日：2011-03-29
申请号：US11955315
申请日：2007-12-12
申请人： Huong Nguyen
发明人： Huong Nguyen
IPC分类号： G09B19/02
CPC分类号： G09B1/02 , G09B19/02
摘要： Numero Cubes and the Whole Number System are disclosed. In one embodiment, the system may comprise cubes, pegs, magnets, dividers, shafts, and a number placement panel. The shafts may comprise individual marks representing the base ten number system. The system may provide a method of learning mathematics through a cognitively authentic learning experience in constructing and building numbers.
摘要翻译：数字立方体和全数字系统被公开。在一个实施例中，系统可以包括立方体，钉，磁体，分隔件，轴和数字安置面板。轴可以包括表示基础十号系统的单独标记。该系统可以通过在构建和建立数字方面的认知学习体验来提供学习数学的方法。

2. 发明申请

US20070026367A1 SYSTEM AND METHOD OF TEACHING AND LEARNING MATHEMATICS 有权
标题翻译：教学与学习数学系统与方法
公开(公告)号：US20070026367A1
公开(公告)日：2007-02-01
申请号：US11381964
申请日：2006-05-05
申请人： Huong Nguyen
发明人： Huong Nguyen
IPC分类号： G09B19/02
CPC分类号： G09B19/02 , G09B1/02
摘要： Numero Cubes and the Whole Number System are disclosed. In one embodiment, the system may comprise cubes, pegs, magnets, dividers, shafts, and a number placement panel. The shafts may comprise individual marks representing the base ten number system. The system may provide a method of learning mathematics through a cognitively authentic learning experience in constructing and building numbers.
摘要翻译：数字立方体和全数字系统被公开。在一个实施例中，系统可以包括立方体，钉，磁体，分隔件，轴和数字安置面板。轴可以包括表示基础十号系统的单独标记。该系统可以通过在构建和建立数字方面的认知正确的学习经验来提供一种学习数学的方法。

3. 发明授权

US08378222B2 Method of reducing solder wicking on a substrate 有权
公开(公告)号：US08378222B2
公开(公告)日：2013-02-19
申请号：US12653358
申请日：2009-12-11
申请人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
发明人： Glen C. Shepherd , Anthony Aaron Lynn Burton , Michael Ryan Ng , Mimi Munson Tantillo , Dieu-Huong Nguyen Tran
IPC分类号： H05K1/00
CPC分类号： H05K1/115 , H05K1/114 , H05K3/3442 , H05K3/3452 , H05K2201/09381 , H05K2201/099 , H05K2201/10636 , Y02P70/611 , Y02P70/613 , Y10T29/49144 , Y10T29/49165
摘要： This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

4. 发明申请

US20060149042A1 Process for concentration of macromolecules 有权
标题翻译：高分子浓缩方法
公开(公告)号：US20060149042A1
公开(公告)日：2006-07-06
申请号：US10532998
申请日：2003-11-01
申请人： Konstantin Konstantinov , Huong Nguyen , Jens Vogel
发明人： Konstantin Konstantinov , Huong Nguyen , Jens Vogel
IPC分类号： C07K1/14
CPC分类号： C07K14/55 , C07K1/34 , C07K1/36
摘要： The invention provides methods for concentrating a macromolecule from a solution comprising the macromolecule and an organic polymer by first subjecting the solution to ultrafiltration to produce a first retentate solution, then adjusting the conductivity of the first retentate solution such that any protein precipitation induced by the organic polymer is essentially prevented to produce a second retentate solution, and then subjecting the second retentate solution to ultrafiltration. In a preferred embodiment, the conductivity is adjusted by diafiltration against water, suitable diluent or buffer. Preferably, the invention pertains to the concentration of solutions of native or recombinant proteins. The invention further pertains preferably to methods for the concentration of cell culture supernatant comprising a product protein and organic polymers of the Pluronic family of block co-polymers, and more preferably comprising Pluronic F-68 block co-polymer.
摘要翻译：本发明提供了从包含大分子和有机聚合物的溶液中浓缩高分子的方法，首先使溶液经过超滤以产生第一滞留物溶液，然后调节第一渗余溶液的电导率，使得由有机物诱导的任何蛋白质沉淀基本上防止聚合物产生第二滞留物溶液，然后使第二滞留物溶液经过超滤。在优选的实施方案中，通过对水，合适的稀释剂或缓冲液进行渗滤来调节电导率。优选地，本发明涉及天然或重组蛋白质的溶液的浓度。本发明还优选地涉及浓缩包含产物蛋白质的细胞培养上清液和Pluronic族嵌段共聚物的有机聚合物，更优选包含Pluronic F-68嵌段共聚物的方法。

5. 发明申请

US20050241762A1 Alternating asymmetrical plasma generation in a process chamber 审中-公开
标题翻译：处理室中的交替不对称等离子体产生
公开(公告)号：US20050241762A1
公开(公告)日：2005-11-03
申请号：US11060980
申请日：2005-02-18
申请人： Alexander Paterson , Elizabeth Pavel , Valentin Todorow , Huong Nguyen , Thomas Kropewnicki , Brian Hatcher , John Holland
发明人： Alexander Paterson , Elizabeth Pavel , Valentin Todorow , Huong Nguyen , Thomas Kropewnicki , Brian Hatcher , John Holland
IPC分类号： C23F1/00 , H01J37/32 , H01L21/3065
CPC分类号： H01J37/32091 , H01J37/32082 , H01J37/321 , H01J37/32146 , H01J37/32165
摘要： Embodiments of the invention generally provide etch or CVD plasma processing methods and apparatus used to generate a uniform plasma across the surface of a substrate by modulation pulsing the power delivered to a plurality of plasma controlling devices found in a plasma processing chamber. The plasma generated and/or sustained in the plasma processing chamber is created by the one or more plasma controlling devices that are used to control, generate, enhance, and/or shape the plasma during the plasma processing steps by use of energy delivered from a RF power source. Plasma controlling devices may include, for example, one or more coils (inductively coupled plasma), one or more electrodes (capacitively coupled plasma), and/or any other energy inputting device such as a microwave source.
摘要翻译：本发明的实施例通常提供蚀刻或CVD等离子体处理方法和装置，用于通过调制脉冲输送到在等离子体处理室中发现的多个等离子体控制装置的功率来在衬底的表面上产生均匀的等离子体。在等离子体处理室中产生和/或维持的等离子体是由一个或多个等离子体控制装置产生的，这些等离子体控制装置用于在等离子体处理步骤期间通过使用从等离子体处理室输送的能量来控制，产生，增强和/或形成等离子体射频电源。等离子体控制装置可以包括例如一个或多个线圈（电感耦合等离子体），一个或多个电极（电容耦合等离子体）和/或任何其它能量输入装置，例如微波源。

6. 发明授权

US06184158B2 Inductively coupled plasma CVD 失效
公开(公告)号：US06184158B2
公开(公告)日：2001-02-06
申请号：US08772374
申请日：1996-12-23
申请人： Paul Kevin Shufflebotham , Brian McMillin , Alex Demos , Huong Nguyen , Butch Berney , Monique Ben-Dor
发明人： Paul Kevin Shufflebotham , Brian McMillin , Alex Demos , Huong Nguyen , Butch Berney , Monique Ben-Dor
IPC分类号： H01J3732
CPC分类号： H01J37/321 , C23C16/402 , C23C16/507 , H01L21/02126 , H01L21/02164 , H01L21/02211 , H01L21/02274 , H01L21/02301 , H01L21/02315 , H01L21/02362 , H01L21/31612 , H01L21/76837 , Y10S438/902 , Y10S438/906
摘要： A method of depositing a dielectric film on a substrate in a process chamber of an inductively coupled plasma-enhanced chemical vapor deposition reactor. Gap filling between electrically conductive lines on a semiconductor substrate and depositing a cap layer are achieved. Films having significantly improved physical characteristics including reduced film stress are produced by heating the substrate holder on which the substrate is positioned in the process chamber.

7. 发明授权

US6013155A Gas injection system for plasma processing 失效
标题翻译：用于等离子体处理的气体注入系统
公开(公告)号：US6013155A
公开(公告)日：2000-01-11
申请号：US885353
申请日：1997-06-30
申请人： Brian McMillin , Huong Nguyen , Michael Barnes , Tom Ni
发明人： Brian McMillin , Huong Nguyen , Michael Barnes , Tom Ni
IPC分类号： C23C16/50 , C23C16/44 , C23C16/455 , C23C16/507 , C30B25/10 , C30B25/14 , H01J37/32 , H01L21/205 , H01L21/302 , H05H1/00
CPC分类号： H01J37/3244 , C23C16/455 , C23C16/45565 , C23C16/45572 , C23C16/45578 , C23C16/507 , C30B25/105 , C30B25/14 , H01J37/321
摘要： A plasma processing system for plasma processing of substrates such as semiconductor wafers. The system includes a plasma processing chamber, a substrate support for supporting a substrate within the processing chamber, a dielectric member having an interior surface facing the substrate support, the dielectric member forming a wall of the processing chamber, a gas supply comprising one or more injector tubes extending rectilinearly in the plasma processing chamber and having one or more orifices in a sidewall for supplying gas into the chamber, and an RF energy source such as a planar coil which inductively couples RF energy through the dielectric member and into the chamber to energize the process gas into a plasma state. The gas is supplied through orifices located outside of regions at the distal tip of the injector tubes where electric field lines are concentrated. The arrangement minimizes clogging of the orifices since the orifices are located away from areas where most build-up of process byproducts occur on the injector tube.
摘要翻译：用于诸如半导体晶片的衬底等离子体处理的等离子体处理系统。该系统包括等离子体处理室，用于在处理室内支撑衬底的衬底支撑件，具有面向衬底支撑件的内表面的电介质构件，形成处理室壁的电介质构件，包括一个或多个喷射器管在等离子体处理室中直线延伸并且在侧壁中具有一个或多个孔以将气体供应到室中;以及RF能量源，例如平面线圈，其通过电介质构件将RF能量感应耦合到腔中以激励工艺气体进入等离子体状态。气体通过位于喷射器管的远端的区域外侧的孔提供，其中电场线集中。该装置使得孔口的堵塞最小化，因为孔口远离喷射器管上发生过程副产物的最多的区域。

8. 发明授权

US5835334A Variable high temperature chuck for high density plasma chemical vapor deposition 失效
标题翻译：用于高密度等离子体化学气相沉积的可变高温卡盘
公开(公告)号：US5835334A
公开(公告)日：1998-11-10
申请号：US724005
申请日：1996-09-30
申请人： Brian McMillin , Michael Barnes , Butch Berney , Huong Nguyen
发明人： Brian McMillin , Michael Barnes , Butch Berney , Huong Nguyen
IPC分类号： H01L21/68 , H01L21/683 , H02N13/00
CPC分类号： H01L21/6833 , Y10T279/23
摘要： An electrostatic chuck comprises an electrode cap with a dielectric layer for attracting and holding the back side of a semiconductor wafer positioned on the top surface of the dielectric layer, and a lower electrode. The electrostatic chuck is heated by resistive heating elements attached to or embedded within the chuck. The electrostatic chuck is cooled by circulating liquid coolant through the body of the chuck. Coolant gas is provided at the back side of the semiconductor wafer to improve thermal transfer. A feedback control mechanism maintains the chuck, and consequently the wafer, at a predetermined temperature by actively controlling both the heating and the cooling functions.
摘要翻译：静电卡盘包括具有用于吸引并保持位于电介质层的顶表面上的半导体晶片的背面的电介质层的电极帽和下电极。静电卡盘被附着在卡盘内或嵌入卡盘内的电阻加热元件加热。通过将液体冷却剂循环通过卡盘的主体来冷却静电卡盘。冷却剂气体设置在半导体晶片的背面，以改善热转印。反馈控制机构通过主动地控制加热和冷却功能来将卡盘以及因此的晶片维持在预定温度。

9. 发明授权

US5539746A Contention resolution scheme for communications systems 失效
标题翻译：通信系统竞争解决方案
公开(公告)号：US5539746A
公开(公告)日：1996-07-23
申请号：US422750
申请日：1995-04-14
申请人： Gang Huang , Mai-Huong Nguyen , Jean-Jacques Werner
发明人： Gang Huang , Mai-Huong Nguyen , Jean-Jacques Werner
IPC分类号： G06F13/00 , G06F13/374 , G06F15/16 , G06F15/177 , H04L29/06 , H04J3/14 , G06F9/46
CPC分类号： H04L29/06 , G06F13/374
摘要： Timing control resolution between two communications devices is provided by assigning each device to one of a plurality of priorities and by transmitting an identification of this priority to the other communications device. The determination of which device is the master and which device is the slave is then resolved by comparing the received and transmitted identifications from the contending devices to a predetermined ranking of identification signals. When such identifications signals are the same, each device randomly selects an identification signal from a group of such signals. Preferably this group includes all of the identification signals except that transmitted in the immediately prior contention round. The received and transmitted identifications signals from the contending devices are then compared to the predetermined ranking of identification signals. This random selection of identification signals, transmission and comparison are repeated until the transmitted and received identifications signals are different and contention is resolved or a predetermined number of contention rounds is reached.
摘要翻译：通过将每个设备分配给多个优先级中的一个并且通过将该优先级的标识发送给另一个通信设备来提供两个通信设备之间的定时控制分辨率。然后，通过将来自竞争装置的接收和发送的标识与标识信号的预定等级进行比较，来解析哪个装置是主装置和哪个装置是从装置的确定。当这种标识信号相同时，每个设备从一组这样的信号中随机选择一个识别信号。优选地，该组包括除了在紧接在前的争用轮中传送的所有识别信号。然后将来自竞争装置的接收和发送的标识信号与预定的识别信号等级进行比较。重复这种随机选择的识别信号，传输和比较，直到发送和接收的标识信号不同并且争用解决或达到预定数量的争用轮次。

10. 发明申请

US20120266574A1 Pre-Stretched Coreless Film Roll Products 审中-公开
标题翻译：预拉伸无芯膜卷产品
公开(公告)号：US20120266574A1
公开(公告)日：2012-10-25
申请号：US13164389
申请日：2011-06-20
申请人： Huong Nguyen , Hai Nguyen
发明人： Huong Nguyen , Hai Nguyen
IPC分类号： B65B11/02
CPC分类号： B65H75/185 , B65H75/10 , B65H2701/1944
摘要： A coreless film roll product which may be used for both hand wrapping and machines wrapping with or without retrofitting stabilizing components.
摘要翻译：无芯胶卷产品，可用于手提包装和机器包装，带或不带改装稳定组件。

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