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1. 发明授权

US5133403A Cooling arrangement for semiconductor devices and method of making the same 失效
标题翻译：用于半导体器件的冷却装置及其制造方法
公开(公告)号：US5133403A
公开(公告)日：1992-07-28
申请号：US423386
申请日：1989-10-19
申请人： Hitoshi Yokono , Takao Terabayashi , Nobuo Kayaba , Takahiro Daikoku , Shigekazu Kieda , Fumiyuki Kobayashi , Shizuo Zushi
发明人： Hitoshi Yokono , Takao Terabayashi , Nobuo Kayaba , Takahiro Daikoku , Shigekazu Kieda , Fumiyuki Kobayashi , Shizuo Zushi
IPC分类号： H01L23/373 , H01L23/433 , H01L23/473 , H05K7/20
CPC分类号： H01L23/4338 , H01L23/3733 , F28F2255/18 , H01L2224/16225
摘要： A cooling device for cooling semiconductor elements by removing heat generated from the semiconductor elements such as, for example, semiconductor integrated chips in a large-sized electronic computer. The cooling device is fashioned of a composite AlN-BN sintered material having a Vickers hardness not higher than one-fifth of that of an AlN material, and an anisotropic property of thermal conductivity in a two dimensional direction is higher than that of AlN which is isotropic in thermal conductivity. The cooling device may be mass-produced while nevertheless having a high transfer performance matching the quantity of heat generated for each semiconductor element even if the composite sintered material is uniform in shape and size. The composite sintered material is formed by a mixture of a hexagonal BN powder having an average particle diameter of not less than 1 .mu.m and an AlN powder having an average particle diameter of about 2 .mu.m, with a sintering aid being added and the powdery mixture being subjected to a hot press sintering whereby the sintered material is low in thermal conductivity in a direction parallel to an axis of a shaft of the hot press.
摘要翻译：一种用于通过从大型电子计算机中的诸如半导体集成芯片的半导体元件产生的热量来冷却半导体元件的冷却装置。该冷却装置由维氏硬度不高于AlN材料的五分之一的复合AlN-BN烧结材料制成，并且二维方向的热导率的各向异性特性比AlN的各向异性高各向同性的导热性。即使复合烧结体的形状和尺寸一致，冷却装置也可以批量生产，同时具有与每个半导体元件产生的热量匹配的高转印性能。复合烧结材料由平均粒径不小于1μm的六方晶BN粉末和平均粒径约2μm的AlN粉末的混合物形成，并加入烧结助剂。混合物进行热压烧结，由此烧结材料在与热压机的轴的轴线平行的方向上的导热性低。

2. 发明授权

US5089936A Semiconductor module 失效
标题翻译：半导体模块
公开(公告)号：US5089936A
公开(公告)日：1992-02-18
申请号：US404341
申请日：1989-09-07
申请人： Hiroyuki Kojima , Toshio Hatsuda , Takahiro Daikoku , Shizuo Zushi , Fumiyuki Kobayashi
发明人： Hiroyuki Kojima , Toshio Hatsuda , Takahiro Daikoku , Shizuo Zushi , Fumiyuki Kobayashi
IPC分类号： H01L23/40 , H01L23/473
CPC分类号： H01L23/473 , H01L23/4006 , H01L2023/4043 , H01L2023/4062 , H01L2023/4081 , H01L2224/16225 , H01L2224/73253
摘要： In a semiconductor module including a wiring substrate having one or a plurality of semiconductor devices electrically connected thereon, a housing constituted of a sealing frame and a ceiling board to enclose the semiconductor devices therein, and a cooling jacket to cool the semiconductor devices. The semiconductor module comprises an elastic arm placed on the cooling jacket for exerting pressure to cause the cooling jacket to be uniformly contacted with the housing ceiling board, and clamping jigs press the cooling jacket and the ceiling board through the elastic arm, so that the clamping jigs may serve to press the respective intermediate positions of the four sides of the cooling jacket through the elastic arm, or screw fasteners may be provided on the elastic arm for controlling the displacements and pressing force.
摘要翻译：在包括具有电连接在其上的一个或多个半导体器件的布线基板的半导体模块中，由密封框架和顶板组成的壳体以封装其中的半导体器件，以及用于冷却半导体器件的冷却套。半导体模块包括放置在冷却套上的弹性臂，用于施加压力以使冷却套与壳体天花板均匀地接触，并且夹具通过弹性臂挤压冷却套和顶板，使得夹紧夹具可以用于通过弹性臂挤压冷却套的四个侧面的相应中间位置，或者可以在弹性臂上设置螺钉紧固件以控制位移和按压力。

3. 发明授权

US5077601A Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system 失效
标题翻译：用于冷却电子设备的冷却系统和用于冷却系统的散热片
公开(公告)号：US5077601A
公开(公告)日：1991-12-31
申请号：US404350
申请日：1989-09-07
申请人： Toshio Hatada , Takayuki Atarashi , Takahiro Daikoku , Satomi Kobayashi , Shizuo Zushi , Fumiyuki Kobayashi , Susumu Iwai
发明人： Toshio Hatada , Takayuki Atarashi , Takahiro Daikoku , Satomi Kobayashi , Shizuo Zushi , Fumiyuki Kobayashi , Susumu Iwai
IPC分类号： H01L23/467
CPC分类号： H01L23/467 , H01L2924/0002
摘要： A cooling system for cooling an electronic device by allowing a cooling fluid to flow in contact with heat generating components such as LSI chips of the electronic device arranged in series along the major flow of the cooling fluid. The cooling system has heat radiation fins attached to the heat-generating components, and a cooling duct defining a cooling fluid flow passage in which assemblies composed of the heat-generating components and the heat radiation fins are disposed. The flow passage has, at the upstream end of the upstream end assembly, a cross-sectional area greater than that of the assembly when taken in a plane perpendicular to the direction of the major flow of the cooling fluid. The cross-sectional area of the flow passage progressively decreases towards the downstream end, whereby the flow passage is divided into a main passage through which a main flow component of the cooling fluid directly flows into the series of assemblies and an auxiliary passage through which an auxiliary component of the cooling fluid flows substantially vertically towards the heat-generating component to impinge upon the heat generating component.
摘要翻译：一种冷却系统，用于通过使冷却流体沿着沿着冷却流体的主流排列成串联的电子装置的发热部件等发热部件而流动而冷却电子设备。冷却系统具有附接到发热部件的散热翅片，以及限定冷却流体流动通道的冷却管道，其中设置有由发热部件和散热翅片组成的组件。当在垂直于冷却流体的主流方向的平面中时，流动通道在上游端组件的上游端处具有大于组件的截面面积的横截面面积。流动通道的横截面积朝向下游端逐渐减小，由此流动通道被分成主通道，冷却流体的主流分量通过该主通道直接流入一系列组件和辅助通道，通过该辅助通道冷却流体的辅助部件基本垂直地朝着发热部件流动以撞击发热部件。

4. 发明授权

US4837663A Electronic apparatus cooling system 失效
标题翻译：电子设备冷却系统
公开(公告)号：US4837663A
公开(公告)日：1989-06-06
申请号：US145473
申请日：1988-01-19
申请人： Shizuo Zushi , Mitsuo Miyamoto , Hiroshi Gou , Fumiyuki Kobayashi , Tetsuo Ogata
发明人： Shizuo Zushi , Mitsuo Miyamoto , Hiroshi Gou , Fumiyuki Kobayashi , Tetsuo Ogata
IPC分类号： F25D1/02 , H05K7/20
CPC分类号： H05K7/20572
摘要： A cooling system for an electronic apparatus comprises a plurality of mother boards each having a circuit board to be cooled, a blower for causing an air flow from one of the mother boards to the other, and a draft duct for directing the air flow between the mother boards.The draft duct includes an inlet for dividing the air flow into a plurality of partial flows, a partition for changing an air flow direction of the partial flows into some other directions, and an outlet for intermixing the partial flows.
摘要翻译：一种用于电子设备的冷却系统包括多个母板，每个母板具有要冷却的电路板，用于使空气从一个母板引导到另一个的鼓风机，以及用于将空气流引导到母板引流管包括用于将空气流分成多个部分流的入口，用于将部分流动的空气流动方向改变成一些其它方向的分隔件和用于混合部分流动的出口。

5. 发明授权

US5040992A Mounting structure for electronic device 失效
标题翻译：电子设备的安装结构
公开(公告)号：US5040992A
公开(公告)日：1991-08-20
申请号：US444859
申请日：1989-12-04
申请人： Mitsuo Miyamoto , Fumiyuki Kobayashi , Shizuo Zushi , Norio Sengoku , Yoshiaki Horita
发明人： Mitsuo Miyamoto , Fumiyuki Kobayashi , Shizuo Zushi , Norio Sengoku , Yoshiaki Horita
IPC分类号： G06F1/18 , H05K1/14 , H05K7/14
CPC分类号： H05K7/1449 , H05K1/14 , H05K1/148 , Y10S439/928
摘要： A first mother board among a plurality of mother boards is mounted adjacent to a reference mother board and a second mother board among said plurality of mother boards is mounted in a position rotated 180.degree. about the horizontal centerline of the second mother board and mounted back to back to the first mother board, whereby the reference mother board and the first and second mother boards can be interconnected at a minimal distance.
摘要翻译：多个母板中的第一母板安装在参考母板附近，并且所述多个母板中的第二母板安装在围绕第二母板的水平中心线旋转180°的位置，并安装回返回到第一母板，由此参考母板和第一和第二母板可以以最小的距离相互连接。

6. 发明授权

US5109317A Mounting mechanism for mounting heat sink on multi-chip module 失效
标题翻译：用于在多芯片模块上安装散热器的安装机构
公开(公告)号：US5109317A
公开(公告)日：1992-04-28
申请号：US604953
申请日：1990-10-29
申请人： Mitsuo Miyamoto , Shizuo Zushi , Hiroshi Go , Fumiyuki Kobayashi , Hiroyuki Kojima
发明人： Mitsuo Miyamoto , Shizuo Zushi , Hiroshi Go , Fumiyuki Kobayashi , Hiroyuki Kojima
IPC分类号： H01L23/40 , H01L23/433 , H01L23/473
CPC分类号： H01L23/4006 , H01L23/433 , H01L23/473 , H01L2224/16225
摘要： A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.
摘要翻译：公开了一种用于通过散热器冷却多芯片模块的冷却结构，其中散热器设置在多芯片模块上方，导热油脂被夹在散热器和多重模块的模块盖之间芯片模块，并且多芯片模块的散热器，模块盖和布线板通过夹紧构件夹紧为一体，其中散热器推动构件用于将散热器按压在模块盖上固定力附着在夹紧件上。

7. 发明授权

US4739444A Device for adjusting pressure loss of cooling air for an assembly of cards carrying electronic components 失效
标题翻译：用于调节携带电子部件的卡组件的冷却空气的压力损失的装置
公开(公告)号：US4739444A
公开(公告)日：1988-04-19
申请号：US835764
申请日：1986-03-03
申请人： Shizuo Zushi , Tetsuo Ogata , Mitsuo Miyamoto , Tsutomu Imai , Fumiyuki Kobayashi
发明人： Shizuo Zushi , Tetsuo Ogata , Mitsuo Miyamoto , Tsutomu Imai , Fumiyuki Kobayashi
IPC分类号： H05K7/20
CPC分类号： H05K7/20563
摘要： In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.
摘要翻译：在用于电子设备的冷却结构中，其中安装在电路板上的电子部件组成的卡片平行排列在母板上。具有孔的压力调节装置布置在每个卡的冷却空气流动通道中。基于平均气流截面面积，相对于相关卡的压力损失特性来选择孔的面积。

8. 发明授权

US5592363A Electronic apparatus 失效
标题翻译：电子仪器
公开(公告)号：US5592363A
公开(公告)日：1997-01-07
申请号：US128227
申请日：1993-09-29
申请人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
发明人： Takayuki Atarashi , Toshio Hatada , Takahiro Daikoku , Nobuo Kawasaki , Toshiki Iino , Tamotsu Tsukaguchi , Kenichi Kasai , Fumiyuki Kobayashi , Yoshito Hayashi
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002
摘要： An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.
摘要翻译：在每个半导体器件上设置具有多个半导体器件的电子设备，所述多个半导体器件在操作期间产生热量，散热片具有多个平板状或针状散热片。喷嘴与散热器相关联，以将冷却流体供应到散热器中。散热器布置成使得所有这些散热器沿相同的方向引导和排出冷却流体。在由散热器确定的流体的流动方向（x方向）和冷却流体的排放量上测量的各个喷嘴的宽度小于相关散热器的宽度。在与x方向垂直的方向（y方向）上测量的喷嘴的宽度小于相关联的散热器的宽度。相邻喷嘴之间的空间提供了足够横截面的排放通道，其减小被加热的冷却介质通过其排出所遇到的阻力。

9. 发明授权

US4770242A Cooling device of semiconductor chips 失效
标题翻译：半导体芯片的冷却装置
公开(公告)号：US4770242A
公开(公告)日：1988-09-13
申请号：US873304
申请日：1986-06-09
申请人： Takahiro Daikoku , Tadakatsu Nakajima , Noriyuki Ashiwake , Keizo Kawamura , Motohiro Sato , Fumiyuki Kobayashi , Wataru Nakayama
发明人： Takahiro Daikoku , Tadakatsu Nakajima , Noriyuki Ashiwake , Keizo Kawamura , Motohiro Sato , Fumiyuki Kobayashi , Wataru Nakayama
IPC分类号： H01L23/40 , H01L23/433 , F28F7/00
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.
摘要翻译：用于提供集成电路半导体芯片的冷却的冷却装置被布置成通过彼此以小间隙配合的薄翅片构件传递热量。与翅片构件一体设置的导热构件中的一个的底面的表面积比半导体芯片的后平面更大，导热构件和半导体芯片始终保持平面接触从而提高冷却性能。

10. 发明授权

US5276586A Bonding structure of thermal conductive members for a multi-chip module 失效
标题翻译：用于多芯片模块的导热构件的结合结构
公开(公告)号：US5276586A
公开(公告)日：1994-01-04
申请号：US872178
申请日：1992-04-22
申请人： Toshio Hatsuda , Takahiro Daikoku , Tetsuya Hayashida , Noriyuki Ashiwake , Fumiyuki Kobayashi , Keizou Kawamura , Sohji Sakata
发明人： Toshio Hatsuda , Takahiro Daikoku , Tetsuya Hayashida , Noriyuki Ashiwake , Fumiyuki Kobayashi , Keizou Kawamura , Sohji Sakata
IPC分类号： H01L23/36 , H01L23/433 , H01L25/065 , H05K7/20
CPC分类号： H01L24/33 , H01L23/433 , H01L25/0655 , H01L2224/16225 , H01L2224/27013 , H01L2224/73253 , H01L2224/73257 , H01L2224/83051 , H01L2924/01004 , H01L2924/01005 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/16152
摘要： A semiconductor module comprises a substrate, a plurality of semiconductor chips mounted on the substrate, a plurality of heat conduction members mounted on the back surfaces of the plurality of semiconductor chips, respectively, and a cooling jacket, on which the plurality of heat conduction members are bonded with heat conductive bonding agent, sealed with the substrate, wherein, in a surface of each of the plurality of heat conduction members adjacent to the cooling jacket and in a surface of the cooling jacket adjacent to the heat conduction members, around a portion corresponding to the back surface of each of the semiconductor chip is formed a portion which has non-affinity for the heat conductive bonding agent. Further, it is preferred that a reservoir having an affinity for the heat conductive bonding agent and serving to receive an excessive bonding agent is formed around each of the non-affinity portions of the plurality of heat conduction members and the cooling jacket.
摘要翻译：半导体模块包括基板，安装在基板上的多个半导体芯片，分别安装在多个半导体芯片的背面上的多个导热部件和冷却套，多个导热部件与导热接合剂接合，用基板密封，其中，在与冷却套相邻的多个热传导构件的每一个的表面中以及在与热传导构件相邻的冷却套的表面中，对应于每个半导体芯片的背表面形成对于导热粘合剂具有非亲和性的部分。此外，优选在多个导热构件和冷却套中的每个非亲合部分周围形成对导热粘合剂具有亲和力并用于接收过量粘合剂的储存器。

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