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1. 发明授权

US4715673A Optical switch 失效
标题翻译：光开关
公开(公告)号：US4715673A
公开(公告)日：1987-12-29
申请号：US857957
申请日：1986-05-01
申请人： Takanobu Noro , Yasumasa Koakutsu , Tamio Takeuchi , Masao Yano , Seiichi Onoda , Hideo Arima , Hitoshi Yokono , Hirayoshi Tanei
发明人： Takanobu Noro , Yasumasa Koakutsu , Tamio Takeuchi , Masao Yano , Seiichi Onoda , Hideo Arima , Hitoshi Yokono , Hirayoshi Tanei
IPC分类号： G02B6/35 , G02B6/36
CPC分类号： G02B6/35 , G02B6/3598 , G02B6/3542 , G02B6/3572 , G02B6/3582 , G02B6/3586
摘要： An optical switch having a small number of optical connections includes a substrate in which are provided a first light path for conducting optical signals and a second light path consisting of a photosensitive element and light emitting element in pairs. An optical fiber cable is interrupted by the substrate, and optical signals in the fiber cable are transmitted through the first light path or intervened by an electrical system through the second light path in response to the switching movement of the substrate.
摘要翻译：具有少量光学连接的光学开关包括其中设置有用于传导光学信号的第一光路和由感光元件和发光元件成对组成的第二光路的基板。光纤电缆被基板中断，并且光纤电缆中的光信号响应于基板的切换运动而通过第一光路传输或通过第二光路被电气系统干涉。

2. 发明授权

US4457161A Gas detection device and method for detecting gas 失效
标题翻译：气体检测装置及气体检测方法
公开(公告)号：US4457161A
公开(公告)日：1984-07-03
申请号：US366304
申请日：1981-04-07
申请人： Shoichi Iwanaga , Nobuo Sato , Akira Ikegami , Tokio Isogai , Takanobu Noro , Hideo Arima
发明人： Shoichi Iwanaga , Nobuo Sato , Akira Ikegami , Tokio Isogai , Takanobu Noro , Hideo Arima
IPC分类号： G01N27/04 , G01N27/12 , G01N33/00
CPC分类号： G01N33/0031 , G01N27/12
摘要： A gas detection device and a method for detecting a gas where gas information including concentrations of gas components in a mixed gas, concentration, presence of specific gas components and the like is detected by measuring, e.g., the output voltages of a plurality of gas sensors having different gas selectivities. The gas selectivities, as a characteristic constant of the specific gas sensor, was previously determined. The measured output voltages and gas selectivities are then used for solving plural simultaneous equations for gas concentrations.
摘要翻译：一种气体检测装置和气体检测方法，其中气体信息包括混合气体中气体组分的浓度，浓度，特定气体组分的存在等，通过测量多个气体传感器的输出电压具有不同的气体选择性。作为特定气体传感器的特性常数，气体选择性是先前确定的。然后测量的输出电压和气体选择性用于求解气体浓度的多个联立方程。

3. 发明授权

US4638443A Gas detecting apparatus 失效
标题翻译：气体检测装置
公开(公告)号：US4638443A
公开(公告)日：1987-01-20
申请号：US581667
申请日：1984-02-21
申请人： Masayoshi Kaneyasu , Hideo Arima , Mitsuko Ito , Shoichi Iwanaga , Nobuo Sato , Takanobu Noro , Akira Ikagami , Tokio Isogai
发明人： Masayoshi Kaneyasu , Hideo Arima , Mitsuko Ito , Shoichi Iwanaga , Nobuo Sato , Takanobu Noro , Akira Ikagami , Tokio Isogai
IPC分类号： G08B21/00 , G01N27/12 , G01N33/00 , G08B17/117 , G08B21/16 , G06F15/20 , G08B17/10
CPC分类号： G01N33/0031 , G08B17/117
摘要： A gas detecting apparatus incorporates a number of gas detecting elements which react with a variety of gases and exhibit gas sensitivities differing from one another in dependence on the gas species. The detection patterns obtained by quantitizing the detection outputs of the gas detecting elements are compared with a plurality of standard patterns prepared previously for assumed combinations of gas species and concentrations thereof. On the basis of the standard pattern which is same or most similar to the detection pattern, the gas species is identified.
摘要翻译：一种气体检测装置结合有多种气体检测元件，其与各种气体反应，并且根据气体种类显示彼此不同的气体灵敏度。通过对气体检测元件的检测输出进行定量而获得的检测图案与先前为气体种类及其浓度的假定组合准备的多个标准图案进行比较。基于与检测图案相同或最相似的标准图案，识别气体种类。

4. 发明授权

US4586143A Gas detecting apparatus 失效
标题翻译：气体检测装置
公开(公告)号：US4586143A
公开(公告)日：1986-04-29
申请号：US461743
申请日：1983-01-28
申请人： Masayoshi Kaneyasu , Takanobu Noro , Hideo Arima , Mitsuko Ito , Shoichi Iwanaga , Nobuo Sato , Akira Ikegami , Tokio Isogai
发明人： Masayoshi Kaneyasu , Takanobu Noro , Hideo Arima , Mitsuko Ito , Shoichi Iwanaga , Nobuo Sato , Akira Ikegami , Tokio Isogai
IPC分类号： G01N27/04 , G01N27/12 , G01N33/00
CPC分类号： G01N27/122 , G01N33/0031
摘要： A gas detecting apparatus is disclosed in which detection outputs from a plurality of semiconductor gas detecting elements different in gas detection characteristic from each other and previously-obtained characteristic values of the semiconductor gas detecting elements for a mixed gas are subjected to operational processing to detect one or more specified constituent gases contained in the mixed gas, and in which when the specified constituent gas is detected, the detection information is announced by some means, and also the supply of gas is stopped or a supply gas is diluted.
摘要翻译：公开了一种气体检测装置，其中来自多个气体检测特性不同的半导体气体检测元件和先前获得的用于混合气体的半导体气体检测元件的特征值的检测输出进行操作处理以检测一个或更多的特定构成气体，并且当检测到特定构成气体时，通过某种手段宣布检测信息，并且停止供给气体或者供给气体被稀释。

5. 发明授权

US4598167A Multilayered ceramic circuit board 失效
标题翻译：多层陶瓷电路板
公开(公告)号：US4598167A
公开(公告)日：1986-07-01
申请号：US634066
申请日：1984-07-25
申请人： Nobuyuki Ushifusa , Satoru Ogihara , Takanobu Noro
发明人： Nobuyuki Ushifusa , Satoru Ogihara , Takanobu Noro
IPC分类号： B32B15/08 , B32B15/02 , H01L23/498 , H01L23/538 , H05K1/03 , H05K3/46 , H05K1/00
CPC分类号： H01L23/5384 , H01L23/49883 , H01L23/49894 , H05K1/0306 , H01L2224/16225 , H01L2924/09701 , H01L2924/15192 , H01L2924/15312
摘要： A multilayered ceramic circuit board, formed by sintering together a plurality of unit ceramic circuit boards, wherein each unit ceramic circuit board includes a ceramic layer, a patterned electrically conductive layer and through hole conductors formed in the ceramic layer for connecting the patterned electrically conductive layers of the respective unit ceramic circuit boards to form a predetermined wiring circuit. The patterned electrically conductive layers and the through hole conductors have a coefficient of thermal expansion which is greater than the coefficient of thermal expansion of the ceramic layers, wherein the difference between the coefficients of thermal expansion is selected to be less than 100.times.10.sup.-7 /.degree.C., and the through holes have decreased pitch. The conductive layers and conductors can be formed of a metal such as gold, silver or copper, with a low softening point glass filler to reduce the coefficient of thermal expansion of the conductive layers and conductors.The multilayered ceramic circuit board according to the present invention is less sensitive to cracks due to thermal stress.
摘要翻译：一种多层陶瓷电路板，其通过将多个单元陶瓷电路板烧结在一起形成，其中每个单位陶瓷电路板包括陶瓷层，图案化导电层和形成在陶瓷层中的通孔导体，用于连接图案化的导电层以形成预定的布线电路。图案化的导电层和通孔导体的热膨胀系数大于陶瓷层的热膨胀系数，其中热膨胀系数之间的差选择为小于100×10 -7 /℃ C.，通孔的间距减小。导电层和导体可以由诸如金，银或铜的金属与低软化点玻璃填料形成，以降低导电层和导体的热膨胀系数。根据本发明的多层陶瓷电路板对于热应力对裂纹的敏感性较差。

6. 发明授权

US5086337A Connecting structure of electronic part and electronic device using the structure 失效
标题翻译：使用结构的电子部件和电子设备的连接结构
公开(公告)号：US5086337A
公开(公告)日：1992-02-04
申请号：US243796
申请日：1988-09-13
申请人： Takanobu Noro , Kunio Matsumoto , Muneo Oshima , Naoya Kanda , Suguru Sakaguchi , Akira Murata
发明人： Takanobu Noro , Kunio Matsumoto , Muneo Oshima , Naoya Kanda , Suguru Sakaguchi , Akira Murata
IPC分类号： H01L21/60 , H01L23/433 , H01L23/48 , H01L23/498 , H05K3/32 , H05K3/34
CPC分类号： H01L24/81 , H01L23/4338 , H01L23/49827 , H01L24/16 , H01L24/72 , H05K3/3436 , H01L2224/13099 , H01L2224/13144 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/75 , H01L2224/75252 , H01L2224/753 , H01L2224/75314 , H01L2224/755 , H01L2224/75756 , H01L2224/7598 , H01L2224/78301 , H01L2224/81801 , H01L2224/85181 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/30107 , H01L2924/351 , H05K2201/0397 , H05K2201/10378 , H05K3/326 , Y02P70/613
摘要： This invention relates to a connecting structure for electrically connecting an electronic part such as an LSI chip to a substrate, its production method and an electronic device using the former. The present invention is particularly useful for connecting electrically a plurality of chips, for which an absorption function of the difference of thermal expansion in a horizontal direction and capability of displacement in a vertical direction are requisite, to a substrate. Moreover, the connecting structure of the present invention can simplify the fabrication process, has high reliability and can be applied to high performance electronic appliances and apparatuses such as electronic computers.
摘要翻译：本发明涉及一种用于将诸如LSI芯片的电子部件电连接到基板的连接结构，其制造方法和使用前者的电子装置。本发明特别适用于电连接多个芯片，其中水平方向上的热膨胀差异的吸收函数和垂直方向上的位移能力是必需的。此外，本发明的连接结构可以简化制造工艺，具有高可靠性并且可以应用于诸如电子计算机的高性能电子设备和设备。

7. 发明授权

US4922377A Module and a substrate for the module 失效
标题翻译：模块和模块的基板
公开(公告)号：US4922377A
公开(公告)日：1990-05-01
申请号：US271677
申请日：1988-11-16
申请人： Kunio Matsumoto , Takanobu Noro , Naoya Kanda
发明人： Kunio Matsumoto , Takanobu Noro , Naoya Kanda
IPC分类号： H01L21/60 , H01L23/473 , H01L23/538
CPC分类号： H01L24/81 , H01L23/473 , H01L23/5382 , H01L23/5383 , H01L2224/16225 , H01L2224/73253 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15787 , H01L2924/16152 , H01L2924/16251
摘要： This invention relates to a module which mounts a plurality of semiconductor devices and to a module substrate that interconnect the semiconductor devices.This invention has the testing and engineering change pads on the underside of the substrate. This arrangement results in the advantages of: providing a sufficient area for the testing and engineering change pads; improving the package density of semiconductor devices, which in turn leads to higher computation speed; and eliminating the need for a special cooling system during the module testing, simplifying the process of testing. Furthermore, since the signal joint terminals to the semiconductor chips are provided on the surface of the substrate on which the semiconductor chips are mounted and since the power bus joint terminals are provided around the chips on the semiconductor chip-mounting surface of the substrate, it is possible to realize a high density package with high reliability.
摘要翻译：本发明涉及一种安装多个半导体器件的模块以及将半导体器件互连的模块衬底。本发明在衬底的底面上具有测试和工程改变焊盘。这种安排导致以下优点：为测试和工程换板提供足够的面积; 提高半导体器件的封装密度，从而提高计算速度; 并且在模块测试期间不需要特殊的冷却系统，简化了测试过程。此外，由于在安装有半导体芯片的基板的表面上设置了与半导体芯片的信号接合端子，并且由于在基板的半导体芯片安装表面上的芯片周围设置有电力总线接头端子，所以可以实现高可靠性的高密度封装。

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