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    • 1. 发明授权
    • Photosensitive resin composition and method for forming fine patterns
with said composition
    • 光敏树脂组合物和用所述组合物形成精细图案的方法
    • US4554237A
    • 1985-11-19
    • US452198
    • 1982-12-22
    • Fumio KataokaFusaji ShojiHitoshi YokonoDaisuke MakinoShigeru KoibuchiAsao Isobe
    • Fumio KataokaFusaji ShojiHitoshi YokonoDaisuke MakinoShigeru KoibuchiAsao Isobe
    • G03C1/72G03F7/008G03C1/52G03C1/60G03C5/16
    • G03F7/008Y10S430/128
    • Disclosed are photosensitive resin composition useful for formation of fine patterns on semiconductor devices, magnetic bubble devices, etc. which is highly sensitive and is excellent in developability and which has no problem such as precipitation of azide compounds and remaining azide particles after development and a method for forming fine patterns with said composition.Said photosensitive resin composition comprises (a) at least one polymer compound selected from the group consisting of a novolak resin and a polyhydroxystyrene resin and (b) an azide compound represented by the general formula (1): ##STR1## [wherein X is --N.sub.3 or --SO.sub.2 N.sub.3, Y is ##STR2## R.sup.1 is a lower alkylene such as --CH.sub.2 CH.sub.2 --, --CH.sub.2 CH.sub.2 CH.sub.2 --, or --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 CH.sub.2 --, a hydroxyalkylene or an aminoalkylene such as ##STR3## (wherein R.sup.4 and R.sup.5 are lower alkyl or hydrogen, R.sup.6 -R.sup.8 are lower alkyl groups, R.sup.3 is hydrogen, a lower alkyl group or --CH.sub.2 CH.sub.2 O).sub.n R.sup.9 wherein n is an integer of 3 or less and R.sup.9 is hydrogen or a lower alkyl group)].
    • 公开了用于在半导体器件上形成精细图案的光敏树脂组合物,具有高度敏感性和显影性优异的并且没有问题,例如显影后的叠氮化合物和剩余的叠氮化物颗粒的沉淀,以及方法 用于用所述组合物形成精细图案。 所述光敏树脂组合物包含(a)至少一种选自酚醛清漆树脂和聚羟基苯乙烯树脂的聚合物化合物和(b)由通式(1)表示的叠氮化合物:其中 X是-N3或-SO2N3,Y是低级亚烷基,例如-CH2CH2-,-CH2CH2CH2-或-CH2CH2OCH2CH2CH2-,羟基亚烷基或氨基亚烷基,例如
    • 9. 发明授权
    • Water-dispersible epoxy modified alkyd resins
    • 水分散性环氧改性醇酸树脂
    • US4154709A
    • 1979-05-15
    • US883706
    • 1978-03-06
    • Ryoji UkitaAsao IsobeTakao HirayamaShigeyoshi Tanaka
    • Ryoji UkitaAsao IsobeTakao HirayamaShigeyoshi Tanaka
    • C08G63/66C09D167/08C09D3/64C09D3/66C09D5/02
    • C08G63/66C09D167/08
    • A water-dispersible epoxy modified alkyd resin produced by reacting (A) 0-50 parts by weight of oil or oil fatty acid, (B) 10-50 parts by weight of polyhydric alcohol, (C) 0-25 parts by weight of monobasic acid having 6 to 18 carbon atoms, (D) 15-70 parts by weight of polybasic acid having 4 to 10 carbon atoms or its anhydride, (E) 5-25 parts by weight of polyoxyalkylene glycol having a molecular weight of 600 to 20,000, and (F) an epoxy compound, wherein the ratio of the hydroxyl groups to the carboxyl groups in the components (A) through (E) is 0.625-1.8 and the amount of the component (F) is 3-50 parts by weight per 100 parts by weight of the total weight of the components (A) through (E), can provide water-dispersible coatings having improved drying characteristics and water resistance as well as corrosion resistance.
    • (A)0-50重量份的油或油脂肪酸,(B)10-50重量份的多元醇,(C)0-25重量份的 具有6至18个碳原子的一元酸,(D)15-70重量份的具有4至10个碳原子的多元酸或其酸酐,(E)5-25重量份的分子量为600至100的聚氧化亚烷基二醇 20,000和(F)环氧化合物,其中组分(A)至(E)中羟基与羧基的比例为0.625-1.8,组分(F)的量为3-50份, (A)至(E)中每100重量份的重量,可以提供具有改进的干燥特性和耐水性以及耐腐蚀性的水分散性涂料。