会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Insulated gate semiconductor device
    • 绝缘栅半导体器件
    • US07586151B2
    • 2009-09-08
    • US11578949
    • 2005-05-11
    • Hidefumi TakayaYasushi OkuraAkira KuroyanagiNorihito Tokura
    • Hidefumi TakayaYasushi OkuraAkira KuroyanagiNorihito Tokura
    • H01L29/78
    • H01L29/7813H01L29/0623H01L29/0653H01L29/42368H01L29/4238H01L29/7811
    • The present invention provides an insulated gate semiconductor device which has floating regions around the bottoms of trenches and which is capable of reliably achieving a high withstand voltage. An insulated gate semiconductor device 100 includes a cell area through which current flows and an terminal area which surrounds the cell area. The semiconductor device 100 also has a plurality of gate trenches 21 in the cell area and a plurality of terminal trenches 62 in the terminal area. The gate trenches 21 are formed in a striped shape, and the terminal trenches 62 are formed concentrically. In the semiconductor device 100, the gate trenches 21 and the terminal trenches 62 are positioned in a manner that spacings between the ends of the gate trenches 21 and the side of the terminal trench 62 are uniform. That is, the length of the gate trenches 21 is adjusted according to the curvature of the corners of the terminal trench 62.
    • 本发明提供了一种绝缘栅半导体器件,其在沟槽底部附近具有浮动区域,并且能够可靠地实现高耐压。 绝缘栅半导体器件100包括电流流过的单元区域和围绕单元区域的端子区域。 半导体器件100还在单元区域中具有多个栅极沟槽21以及端子区域中的多个端子沟槽62。 栅极沟槽21形成为条状,并且端子沟槽62同心地形成。 在半导体器件100中,栅极沟槽21和端子沟槽62以栅极沟槽21的端部和端子沟槽62的侧面之间的间隔均匀的方式定位。 也就是说,栅极沟槽21的长度根据端子沟槽62的拐角的曲率来调节。
    • 5. 发明授权
    • Method of forming a sidewall on a semiconductor element
    • 在半导体元件上形成侧壁的方法
    • US5462896A
    • 1995-10-31
    • US903465
    • 1992-06-23
    • Atushi KomuraKenji KondoAkira Kuroyanagi
    • Atushi KomuraKenji KondoAkira Kuroyanagi
    • H01L21/302H01L21/3065H01L21/311H01L21/336H01L29/78H01L21/465
    • H01L29/66719H01L21/31116H01L29/66712H01L29/7811H01L29/0615H01L29/0638H01L29/1095H01L29/402H01L29/42368
    • A method fabricates a semiconductor device having a sidewall made from an insulation film at each side of a gate electrode portion. The method forms a polysilicon gate electrode (11a) on a gate oxide film (10) in a predetermined region on an n.sup.- epitaxial layer (2). A CVD silicon oxide film (15) having a predetermined thickness is formed over the polysilicon gate electrode material (11a) on the n.sup.- epitaxial layer (2). A magnetron enhanced reactive ion etching apparatus is used to etch the CVD silicon oxide film (15) while pouring a CHF.sub.3 gas made by coupling carbon, hydrogen, and fluorine and an N.sub.2 gas onto the etched material, such that the CVD silicon oxide film (15) is left only at each side of the polysilicon gate electrode material (11a), to form a sidewall (16). To avoid electrodes of the magnetron enhanced reactive ion etching apparatus from staining, CHF.sub.3 /He/N.sub.2 /O.sub.2 may be used for etching.
    • 一种制造半导体器件,其具有由栅电极部分的每一侧由绝缘膜制成的侧壁。 该方法在n型外延层(2)上的预定区域中的栅极氧化膜(10)上形成多晶硅栅电极(11a)。 在n外延层(2)上的多晶硅栅电极材料(11a)上形成具有预定厚度的CVD氧化硅膜(15)。 使用磁控增强反应离子蚀刻装置来蚀刻CVD氧化硅膜(15),同时将通过将碳,氢和氟与N 2气体偶合而形成的CHF 3气体倒入到蚀刻材料上,使得CVD氧化硅膜( 15)仅留在多晶硅栅电极材料(11a)的每一侧,以形成侧壁(16)。 为了避免磁控管增强反应离子蚀刻装置的电极染色,可以使用CHF 3 / He / N 2 / O 2进行蚀刻。
    • 7. 发明授权
    • Semiconductor memory device of a floating gate tunnel oxide type
    • 浮栅隧道氧化物半导体存储器件
    • US5063423A
    • 1991-11-05
    • US567760
    • 1990-08-15
    • Tetsuo FujiiMinekazu SakaiAkira Kuroyanagi
    • Tetsuo FujiiMinekazu SakaiAkira Kuroyanagi
    • H01L21/28H01L29/788
    • H01L21/28273H01L29/7883
    • A tunnel insulating film of a three-layer structure, wherein an oxide film is interposed between nitrided oxide films, is formed on the surface of a semiconductor substrate. A first polysilicon film serving as a low-concentration impurity region is formed on the tunnel insulating film. An oxide film is formed on that region of the first polysilicon film, which corresponds to the tunnel insulating film, the oxide film having such a thickness that the film can serve as a stopper for impurity diffusion and can allow electrons to pass through. A second polysilicon film, having an impurity concentration higher than that of the first polysilicon film, is formed on the oxide film. The first and second polysilicon films constitute a floating gate. A third polysilicon film serving as a control gate is formed above the second polysilicon film, with an insulating layer interposed therebetween.
    • 在半导体衬底的表面上形成三层结构的隧道绝缘膜,其中在氮化氧化物膜之间插入氧化膜。 在隧道绝缘膜上形成用作低浓度杂质区的第一多晶硅膜。 在第一多晶硅膜的与隧道绝缘膜相对应的区域上形成氧化膜,氧化膜具有使膜能够作为用于杂质扩散的阻挡层的厚度,并且可以使电子通过。 在氧化膜上形成杂质浓度高于第一多晶硅膜的第二多晶硅膜。 第一和第二多晶硅膜构成浮栅。 用作控制栅极的第三多晶硅膜形成在第二多晶硅膜上方,绝缘层位于其间。