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71. 发明专利

JPH04252878A ELECTRONIC PARTS MANUFACTURING SYSTEM 失效
公开(公告)号：JPH04252878A
公开(公告)日：1992-09-08
申请号：JP842691
申请日：1991-01-28
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , TAKEUCHI TAKAO
IPC分类号： F04B37/14 , F04B37/16 , H01L21/02
摘要： PURPOSE:To provide such an electronic parts manufacturing system that receives no restriction of the pipe diameter, layout, etc., of a discharge piping system in a vacuum pump and requires no separate compressor even at a time when exhausted gas is further pressurized. CONSTITUTION:An inlet port 8a of a vacuum pump P is connected to a reaction chamber or electronic parts manufacturing chamber 21, and the vacuum pump is turned to a positive displacement pump with a single or multistage internal compressor. With this constitution, discharge pressure of the vacuum pump can be set to such that is more than the atmospheric pressure.

72. 发明专利

JP2010115805A Image forming apparatus 审中-公开
标题翻译：图像形成装置
公开(公告)号：JP2010115805A
公开(公告)日：2010-05-27
申请号：JP2008289101
申请日：2008-11-11
申请人： Ebara Corp , Murata Machinery Ltd , Okutekku:Kk , 村田機械株式会社 , 株式会社オクテック , 株式会社荏原製作所
发明人： MURAKAMI TAKESHI , SOFUGAWA TAKUJI , OKUMURA KATSUYA , SOJO YOSHIHIRO
IPC分类号： B41J2/385 , G03G15/05
摘要： PROBLEM TO BE SOLVED: To provide an image forming apparatus which can carry out thick-film printing at a higher speed and with high accuracy. SOLUTION: The image forming apparatus 1 includes: a supply device 10 which supplies fine particles 100; an imaging device 20 which forms a thick-film image by hitting and adhering the fine particles 100 to a surface of an imaging object 40 after electrically charging and emitting the fine particles 100, focusing and deflecting a flow of the flying fine particles 100; and a fixing device 30 which fixes the thick-film image formed on the imaging object 40. The imaging device 20 includes a blade 200 which electrically charges the fine particles 100, a pair of supply electrode 210 and an anode electrode 230 which emit the charged fine particles 100, a suppressor electrode 220 which permits or prohibits emission of the fine particles 100, a focus electrode 240 which focuses the flow of the emitted fine particles 100 by an electric field, a deflecting electrode 250 which deflects a direction of the flow of the focused fine particles 100, and a target electrode 260 which adheres the fine particles 100 to the imaging object 40 by impacting. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以更高的速度和高精度进行厚膜印刷的图像形成装置。解决方案：图像形成装置1包括：供给装置10，其供给微粒100; 成像装置20，其在充电和发射微粒100之后，将微粒100击打并粘附到成像对象40的表面上，形成厚膜图像，聚焦和偏转飞行微粒100的流动; 以及固定装置30，其固定形成在成像对象物40上的厚膜图像。成像装置20包括对微粒100进行电荷的刀片200，一对供给电极210和发射带电的阳极电极230 微粒100，允许或禁止发射微粒100的抑制电极220，通过电场聚焦发射的细颗粒100的流动的聚焦电极240，偏转电极250，其偏转方向聚焦细颗粒100和通过冲击将微粒100粘附到成像对象40的目标电极260。版权所有（C）2010，JPO＆INPIT

73. 发明专利

JP2002367896A Environmental chamber as well as apparatus and method for treating substrate 有权
标题翻译：环境室作为设备和处理基板的方法
公开(公告)号：JP2002367896A
公开(公告)日：2002-12-20
申请号：JP2001176086
申请日：2001-06-11
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： WATANABE KAZUHIDE , TANAKA AKIRA , OKUMURA KATSUYA , TOUKI TATSUHIKO
IPC分类号： B01J19/00 , H01L21/02 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrate capable of stably treating a substrate and energy-saving. SOLUTION: The apparatus 20 for treating the substrate in a clean room C isolated from an exterior comprises a protective chamber 10 for covering a space for installing the apparatus 20, an environmental condition detecting means 40 for detecting environmental conditions at least one of the exterior and the interior of the chamber 10, and an environmental controller 30 for controlling the conditions in the chamber 10 based on an output of the detecting means 40.
摘要翻译：要解决的问题：提供一种用于处理能够稳定地处理基板并且节能的基板的设备。解决方案：用于处理从外部隔离的洁净室C中的基板的装置20包括用于覆盖用于安装装置20的空间的保护室10，环境条件检测装置40，用于检测环境条件中的至少一个外部和室10的内部和用于基于检测装置40的输出来控制室10中的状况的环境控制器30。

74. 发明专利

JP2002106563A DRIVING DEVICE 失效
公开(公告)号：JP2002106563A
公开(公告)日：2002-04-10
申请号：JP2000293266
申请日：2000-09-27
申请人： TOSHIBA CORP , EBARA CORP , NSK LTD
发明人： OKUMURA KATSUYA , SUGIHARA KAZUYOSHI , SOFUGAWA TAKUJI , AONO HIROSHI , SAJI NOBUHITO , NAKAMURA TAKESHI
IPC分类号： B65G49/00 , F16C32/06 , H01L21/677 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a driving device capable of maintaining cleanliness inside a process chamber and keeping a bearing at a low-load condition even if capacity of the process chamber is increased. SOLUTION: Free insertion of a cylindrical shaft 30 from the outside of the process chamber P leads to drive of a workpiece mounted on the end part of the window side through the outside of the process chamber P. In such cases, a shaft diameter of a cylindrical member 30 can be invariant even though the process chamber size is increased in accordance with work. Therefore, the length of a differential exhaust seal 50 opposing the peripheral surface is unchanged, whereby the force supported by a static pressure bearing part 72 can be suppressed to a low level.

75. 发明专利

JP2001287142A SUBSTRATE EDGE POLISHING DEVICE 失效
公开(公告)号：JP2001287142A
公开(公告)日：2001-10-16
申请号：JP2000102669
申请日：2000-04-04
申请人： EBARA CORP , TOSHIBA CORP
发明人： KIMURA NORIO , SHIRAKASHI MICHIHIKO , OKUMURA KATSUYA
IPC分类号： B24B57/02 , B24B9/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a substrate edge polishing device capable of efficiently polishing the edge of a substrate and allowing compactification of the device. SOLUTION: This substrate edge polishing device comprises a vertically movable substrate holding part 14 for holding the substrate W with the edge of the substrate W exposed, and a rotatable polishing part 16 having a ring-like polishing surface 20 at a position facing to the edge of the substrate W held by the substrate holding part 14.

76. 发明专利

JP2000317824A POLISHING DEVICE EQUIPPED WITH ATTITUDE CONTROL DEVICE FOR TURNTABLE SYSTEM 失效
公开(公告)号：JP2000317824A
公开(公告)日：2000-11-21
申请号：JP2000066070
申请日：2000-03-10
申请人： EBARA CORP , TOSHIBA CORP
发明人： SATO KAZUKI , KIMURA NORIO , OKUMURA KATSUYA
IPC分类号： B24B37/005 , B24B37/04 , B24B37/10 , B24B37/12 , B24B37/30 , H01L21/304 , B24B37/00
摘要： PROBLEM TO BE SOLVED: To equalize the contact (polishing) pressure to be given from the polishing surface over the whole area of the substrate which is held by a top ring and is pressed down on the polishing surface of a turntable for polishing. SOLUTION: A support unit 43 for supporting a turntable 1 possible to move in a tilted position and a posture control means 45 to control the posture of the turntable 1 are provided. The posture control means 45 can control the tilt angle of the turntable 1 by electromagnetic force. The posture control device by electromagnetic force is provided with an electromagnetic device 45 fixed on the stationary frame of a polishing device and an armature 14 fixed on the turntable 1 and moved by the magnetic force of an electromagnetic device.

77. 发明专利

JPH03270729A METHOD AND APPARATUS FOR DISCHARGING HYDROGEN IN VACUUM CONTAINER 失效
公开(公告)号：JPH03270729A
公开(公告)日：1991-12-02
申请号：JP6845990
申请日：1990-03-20
申请人： TOSHIBA CORP , EBARA CORP
发明人： OKUMURA KATSUYA , OKANO HARUO , TSUJIMURA MANABU , SHIBATA AKIO
IPC分类号： B01J3/00 , B01J3/02 , B01J12/00 , B01J19/08 , B01J19/12 , C01B5/00 , C01B7/01 , C01B7/19
摘要： PURPOSE:To remove hydrogen from a vacuum exhaust system and to highly draw a vacuum by introducing a substance having the good reactivity with hydrogen into an exhaust system route and accelerating the reactivity of the substance with hydrogen by excitation. CONSTITUTION:A vacuum container A is evacuated at first by a suction pump C and subsequently further evacuated by a turbo molecular pump B. At this time, a reactive substance such as halogen or ozone having the good reactivity with hydrogen is introduced into an exciting chamber E1. When the reactive substance is a liquid, it is preliminarily evaporated. The introduced reactive substance is excited by a microwave or heat energy applying method to be introduced into the turbo molecular pump B and the suction port G1 and discharge port G3 of the turbo molecular pump B. By this method, hydrogen in the vacuum exhaust system changes to a substance having a relatively large MW to become a state capable of being easily discharged by the turbo molecular pump B and the vacuum exhaust system reaches a high vacuum state.

78. 发明专利

JP2014081096A Vacuum heating furnace 审中-公开
标题翻译：真空加热炉
公开(公告)号：JP2014081096A
公开(公告)日：2014-05-08
申请号：JP2012227646
申请日：2012-10-15
申请人： Ebara Corp , 株式会社荏原製作所 , Jsr Corp , Jsr株式会社 , Tokyo Electron Ltd , 東京エレクトロン株式会社
发明人： KAWASAKI HIROYUKI , SOFUGAWA TAKUJI , OKUMURA KATSUYA , YAMADA KINJI , NAOI MASAYA , KIMURA YOSHIO
IPC分类号： F27B5/05 , F27B5/14 , F27D7/06 , F27D11/02 , H05B3/00
摘要： PROBLEM TO BE SOLVED: To provide a compact vacuum heating furnace capable of performing processing of vacuum drying of moisture content, a solvent and the like included in various samples (materials) by heating the various samples (materials) with low power consumption while a pressure in a chamber is reduced by pressure reducing means such as a vacuum pump.SOLUTION: The vacuum heating furnace is provided which is connected with pressure reducing means, includes a heater inside thereof and heats a sample 1 in a pressure-reduced vacuum. The vacuum heating furnace includes: a chamber CH which is composed of a substantially-cylindrical container-shaped chamber body 11 closed at one end and opened at the other end, and a bottom plate 12 closing an opening portion of the chamber body 11 and houses a sample; a sample support which is disposed inside the chamber body 11 and holds the sample 1; and the heater 14 disposed in the chamber CH and heating the sample 1.
摘要翻译：要解决的问题：提供一种能够通过以低功耗加热各种样品（材料）而能够进行各种样品（材料）中包含的含水量，溶剂等的真空干燥处理的小型真空加热炉，同时压力在真空泵中通过减压装置减压室。解决方案：提供与减压装置连接的真空加热炉，其中包括加热器，并在减压真空中加热样品1。真空加热炉包括：室CH，其由在一端封闭并在另一端开口的大致圆柱形的容器形室室主体11和封闭室主体11的开口部分的底板12构成，一个样品; 样品支撑体，其设置在室主体11的内部并保持样品1; 以及设置在室CH中并加热样品1的加热器14。

79. 发明专利

JP2007308807A Electrolytic treating device and electric field state control method 审中-公开
标题翻译：电解处理装置和电场状态控制方法
公开(公告)号：JP2007308807A
公开(公告)日：2007-11-29
申请号：JP2007213896
申请日：2007-08-20
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： MAKINO NATSUKI , MISHIMA KOJI , KUNISAWA JUNJI , INOUE HIROAKI , KIMURA NORIO , ODAGAKI MITSUKO , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , MORITA TOSHIYUKI , OKUMURA KATSUYA
IPC分类号： C25D17/10 , C25D7/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electrolytic treating device which makes it possible to obtain the in-plane distribution of a desired plating film thickness by positively controlling the electric field state of the surface of a substrate to be treated and an electric field state control method for the same.
SOLUTION: A plating liquid 10 is filled between an anode 38 and the substrate W to be treated and a high-resistance structure 4 having the electrical conductivity lower than the electrical conductivity of the plating liquid 10 is installed between the anode 38 and the substrate W. The electric field on the surface of the substrate W is controlled by adjusting the thickness of the high resistant structure 4 or the shape of the high resistant structure 4 on a plane surface.
COPYRIGHT: (C)2008,JPO&INPIT

80. 发明专利

JP2006339665A Apparatus for manufacturing semiconductor substrate 审中-公开
标题翻译：制造半导体基板的装置
公开(公告)号：JP2006339665A
公开(公告)日：2006-12-14
申请号：JP2006169432
申请日：2006-06-19
申请人： Ebara Corp , Toshiba Corp , 株式会社東芝 , 株式会社荏原製作所
发明人： KIMURA NORIO , MISHIMA KOJI , KUNISAWA JUNJI , MAKINO NATSUKI , TSUJIMURA MANABU , MATSUDA TETSURO , KANEKO HISAFUMI , OKUMURA KATSUYA
IPC分类号： H01L21/288 , C25D7/12 , C25D19/00 , H01L21/304 , H01L21/677
摘要： PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a semiconductor substrate suitable for a small-scaled manufacturing line, which can produce various products in small amounts, cope with a large change of the number of products, produce products having a short product life, and is capable of changing the function flexibly or updating the apparatus. SOLUTION: The apparatus for manufacturing the semiconductor substrate is equipped with a loader/unloader 120, a plurality of treatment units such as a plating film-forming film unit 113, and a transfer mechanism (robots 131-134) which transfers the semiconductor substrate between the units. The mounting portion of each unit has a guide. Each unit can be loaded to the apparatus for manufacturing the semiconductor substrate, or removed from the apparatus for manufacturing the semiconductor substrate, and exchanged for other units, by moving along the guide. The apparatus for manufacturing the semiconductor substrate is comprised by freely combining the units needed in the semiconductor manufacturing processes. And the units performing distinct treatments in the apparatus for manufacturing the semiconductor substrate can be exchanged each other. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供适合于能够少量生产各种产品的适合于小规模生产线的半导体基板的设备，可以应对产品数量的大量变化，生产具有产品寿命短，并且能够灵活地改变功能或更新设备。解决方案：用于制造半导体衬底的装置装备有装载器/卸载器120，多个处理单元如镀膜形成膜单元113和转移机构（机器人131-134）半导体衬底之间的单元。每个单元的安装部分都有一个导轨。每个单元可以被加载到用于制造半导体衬底的装置中，或者从用于制造半导体衬底的装置中移除，并且通过沿导向件移动而被交换到其它单元。用于制造半导体衬底的装置包括通过自由组合半导体制造工艺中所需的单元。并且在用于制造半导体衬底的装置中执行不同处理的单元可以彼此交换。版权所有（C）2007，JPO＆INPIT

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