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    • 71. 发明申请
    • Method for Forming Tantalum Nitride Film
    • 形成钽氮化物膜的方法
    • US20090104775A1
    • 2009-04-23
    • US11885345
    • 2006-03-03
    • Narishi GonoheSatoru ToyodaHarunori UshikawaTomoyasu KondoKyuzo Nakamura
    • Narishi GonoheSatoru ToyodaHarunori UshikawaTomoyasu KondoKyuzo Nakamura
    • H01L21/44
    • H01L21/76843C23C16/34H01L21/28556H01L21/76859H01L23/53238H01L2924/0002H01L2924/00
    • A tantalum nitride film rich in tantalum atoms is formed, according to the CVD technique, by simultaneously introducing a raw gas consisting of a coordination compound constituted by an elemental tantalum (Ta) having a coordinated ligand represented by the general formula: N=(R, R′) (in the formula, R and R′ may be the same or different and each represents an alkyl group having 1 to 6 carbon atoms) and NH3 gas into a film-forming chamber, reacting the raw gas with the NH3 gas and forming a reduced compound having Ta—NH3 on a substrate; and then introducing a hydrogen atom-containing gas into the chamber to thus form a tantalum nitride film rich in tantalum atoms. The resulting tantalum nitride film has a low resistance, low contents of C and N atoms, and a high compositional ratio: Ta/N, can ensure sufficiently high adherence to Cu film and can thus be useful as a barrier film. Moreover, tantalum particles are implanted in the resulting film according to the sputtering technique to thus further enrich the film with tantalum.
    • 根据CVD技术,通过同时引入由由具有由以下通式表示的配位配位体的元素钽(Ta)构成的配位化合物构成的原料气体,形成钽原子的氮化钽膜:N =(R ,R')(式中,R和R'可以相同或不同,各自表示碳原子数为1〜6的烷基)和NH 3气体进入成膜室,使原料气与NH 3气体反应 并在衬底上形成具有Ta-NH 3的还原化合物; 然后将含氢原子的气体引入到室中,从而形成富含钽原子的氮化钽膜。 所得到的氮化钽膜具有低电阻,C原子和N原子含量低,组成比高的Ta / N可以确保对Cu膜的足够高的粘附性,因此可用作阻挡膜。 此外,根据溅射技术将钽颗粒注入到所得的膜中,从而进一步用钽富集膜。