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    • 66. 发明授权
    • Semiconductor integrated electronic device and corresponding manufacturing method
    • 半导体集成电子器件及相应的制造方法
    • US06724009B2
    • 2004-04-20
    • US10199964
    • 2002-07-18
    • Gianfranco CerofoliniGiuseppe Ferla
    • Gianfranco CerofoliniGiuseppe Ferla
    • H01L3524
    • H01L21/28167H01L29/51
    • A method of fabricating a MOS transistor with a controllable and modulatable conduction path through a dielectric gate oxide is disclosed, wherein the transistor structure comprises a dielectric oxide layer formed between two silicon plates, and wherein the silicon plates overhang the oxide layer all around to define an undercut having a substantially rectangular cross-sectional shape. The method comprises the steps of: chemically altering the surfaces of the silicon plates to have different functional groups provided in the undercut from those in the remainder of the surfaces; and selectively reacting the functional groups provided in the undercut with an organic molecule having a reversibly reducible center and a molecular length substantially equal to the width of the undercut, thereby to establish a covalent bond to each end of the organic molecule.
    • 公开了一种通过电介质栅极氧化物制造具有可控和可调制传导路径的MOS晶体管的方法,其中晶体管结构包括在两个硅板之间形成的电介质氧化物层,并且其中硅板全部悬垂在氧化物层周围以限定 具有基本上矩形横截面形状的底切。 该方法包括以下步骤:将硅板的表面化学改变成在底切中提供的不同的官能团与其余表面中的不同的官能团; 并且将底切中提供的官能团选择性地与具有可逆还原中心和分子长度基本上等于底切宽度的有机分子反应,从而与有机分子的每个末端建立共价键。
    • 67. 发明授权
    • Low-noise amplifier stage with matching network
    • 具有匹配网络的低噪声放大器级
    • US06278329B1
    • 2001-08-21
    • US09466573
    • 1999-12-21
    • Giuseppe PalmisanoGiuseppe FerlaGiovanni Girlando
    • Giuseppe PalmisanoGiuseppe FerlaGiovanni Girlando
    • H03F304
    • H03F1/22H03F1/565H03F2200/294H03F2200/372
    • An amplifier stage having a first and a second transistor connected in series to each other between a first and a second reference potential line. The first transistor has a control terminal connected to an input of the amplifier stage through a first inductor, a first terminal connected to the second reference potential line through a second inductor, and a third terminal connected to a first terminal of the second transistor. The second transistor has a second terminal forming an output of the amplifier stage, and connected to the first reference potential line through a load resistor. To improve the noise figure, a matching capacitor is connected between the control terminal and the first terminal of the first transistor.
    • 具有在第一和第二参考电位线之间彼此串联连接的第一和第二晶体管的放大器级。 第一晶体管具有通过第一电感器连接到放大器级的输入的控制端子,通过第二电感器连接到第二参考电位线的第一端子和连接到第二晶体管的第一端子的第三端子。 第二晶体管具有形成放大器级的输出的第二端子,并通过负载电阻器连接到第一参考电位线。 为了提高噪声系数,在控制端子与第一晶体管的第一端子之间连接有匹配电容器。
    • 68. 发明授权
    • Zero thermal budget manufacturing process for MOS-technology power
devices
    • 用于MOS技术功率器件的零热预算制造工艺
    • US6140679A
    • 2000-10-31
    • US856109
    • 1997-05-14
    • Giuseppe FerlaFerruccio Frisina
    • Giuseppe FerlaFerruccio Frisina
    • H01L21/265H01L21/336H01L29/10H01L29/78H01L29/76H01L29/94H01L31/113H01L31/119
    • H01L29/66712H01L29/1095H01L21/26586
    • A zero thermal budget manufacturing process for a MOS-technology power device. The method comprises the steps of: forming a conductive insulated gate layer on a surface of a lightly doped semiconductor material layer of a first conductivity type; removing the insulated gate layer from selected portions of the semiconductor material layer surface; implanting a first dopant of a second conductivity type into the selected portions of the semiconductor material layer, the insulated gate layer acting as a mask and the first dopant of the first conductivity type being implanted in a dose and with an implantation energy suitable to obtain heavily doped regions substantially aligned with the edges of the insulated gate layer; implanting a second dopant of the second conductivity type along directions at prescribed angles with respect to a direction orthogonal to the semiconductor material layer surface, the insulated gate layer acting as a mask, the second dopant being implanted in a dose and with an implantation energy suitable to obtain lightly doped channel regions extending under the insulated gate layer; and implanting a third dopant of the first conductivity type into the heavily doped regions, to form source regions substantially aligned with the edges of the insulated gate layer.
    • 用于MOS技术功率器件的零热预算制造过程。 该方法包括以下步骤:在第一导电类型的轻掺杂半导体材料层的表面上形成导电绝缘栅极层; 从半导体材料层表面的选定部分去除绝缘栅极层; 将第二导电类型的第一掺杂剂注入到半导体材料层的选定部分中,用作掩模的绝缘栅极层和以剂量注入的第一导电类型的第一掺杂剂和适于大量获得的注入能量 掺杂区域基本上与绝缘栅极层的边缘对准; 沿相对于与半导体材料层表面正交的方向以规定角度的方向注入第二导电类型的第二掺杂剂,所述绝缘栅极层用作掩模,所述第二掺杂剂以适合的植入能量注入, 以获得在绝缘栅极层下延伸的轻掺杂沟道区; 以及将第一导电类型的第三掺杂剂注入到重掺杂区域中,以形成基本上与绝缘栅极层的边缘对准的源极区域。