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51. 发明授权

US06412680B1 Dual-in-line BGA ball mounter 有权
标题翻译：双列直插式BGA球安装机
公开(公告)号：US06412680B1
公开(公告)日：2002-07-02
申请号：US09669278
申请日：2000-09-26
申请人： Kok Hua Chua , Suharto Leo , Hak Meng Tan , Yew Chung Wong
发明人： Kok Hua Chua , Suharto Leo , Hak Meng Tan , Yew Chung Wong
IPC分类号： B23K100
CPC分类号： H01L21/4853 , H05K3/3478
摘要： A BGA ball mount line with a dual in-line mounter flowing into one reflow oven and one in-line cleaner. The dual in-line mounter comprises a first ball mount cell and a second ball mount cell. The second ball mount cell is parallel to and a mirror image of the first ball mount cell. The first ball mount cell and the second ball mount cell can be run by a single operator located between them. In one embodiment of the invention, the BGA ball mount line with dual in-line mounters is implemented in three phases to provide a smooth transition. In the first phase, a proto-line is set-up with a first ball mount cell, a loading cell, a diverter cell, and an unloading cell, to optimize the first ball mount cell. In the second phase, a reflow oven and a flux cleaner are added to form a production line. In the third phase, a second ball mount cell is added to form a BGA ball mount line with a dual in-line mounter.
摘要翻译：一个BGA球安装线，带有一个双列直插式安装器，流入一个回流炉和一个在线清洁器。双列直插式安装器包括第一球形安装单元和第二球形安装单元。第二球形安装单元平行于第一球形安装单元的镜像。第一球形电池和第二球形电池可以由位于它们之间的单个操作器运行。在本发明的一个实施例中，具有双列直插式计数器的BGA球安装线分三个阶段实现，以提供平滑过渡。在第一阶段，用第一球形电池，负载电池，分流器电池和卸载电池来设置原线，以优化第一球形电池。在第二阶段，添加回流炉和助焊剂清洁剂以形成生产线。在第三阶段，添加第二个球形安装单元以形成具有双列直插式安装机的BGA球安装线。

52. 发明授权

US06382500B1 Solder reflow furnace with flux effluent collector and method of preventing flux contamination 有权
标题翻译：焊剂回流炉，助焊剂废液收集器及防止焊剂污染的方法
公开(公告)号：US06382500B1
公开(公告)日：2002-05-07
申请号：US09642835
申请日：2000-08-22
申请人： Raj N. Master , Mohammad Zubair Khan , Maria Guardado , Sp Lee , Sofi Mohd
发明人： Raj N. Master , Mohammad Zubair Khan , Maria Guardado , Sp Lee , Sofi Mohd
IPC分类号： B23K100
CPC分类号： B23K1/203 , B23K1/0016 , B23K1/008 , B23K2101/40
摘要： When soldering semiconductor devices in a solder reflow furnace flux is vaporized and carried to the furnace exhaust pipe. The flux condenses on the walls of the exhaust pipe and drips back into the furnace contaminating production parts. A solder reflow furnace with a flux effluent collector prevents flux drip-back. The flux effluent collector has an exhaust gas heater that maintains flux effluent in a gaseous state, a flux cooler, to subsequently condense flux, and a flux condensation region where the flux condenses. The flux condensation region is offset from the furnace's exhaust opening so that condensed flux cannot drip back into the furnace.
摘要翻译：当在焊料回流炉中焊接半导体器件时，助熔剂被蒸发并运送到炉排气管。助焊剂在排气管的壁上冷凝并滴入炉中，污染生产部件。具有助焊剂流出物收集器的焊料回流炉防止焊剂滴落。助焊剂流出物收集器具有一个废气加热器，其保持处于气态的助熔剂流出物，助熔剂冷却器，随后冷凝助熔剂，以及通量冷凝的助熔剂冷凝区域。助熔剂冷凝区域与炉的排气口偏离，使得冷凝的通量不能滴入炉中。

53. 发明授权

US06364196B1 Method and apparatus for aligning and attaching balls to a substrate 失效
标题翻译：用于将球对准和附着到基底的方法和装置
公开(公告)号：US06364196B1
公开(公告)日：2002-04-02
申请号：US09519583
申请日：2000-03-06
申请人： Alan G. Wood , Salman Akram , Mike Hess , David R. Hembree
发明人： Alan G. Wood , Salman Akram , Mike Hess , David R. Hembree
IPC分类号： B23K100
CPC分类号： H05K3/3478 , H01L21/4853 , H01L24/742 , H01L2224/11003 , H01L2224/11334 , H01L2224/4824 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01046 , H01L2924/01072 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H05K2203/041 , H05K2203/082 , Y10S438/975 , H01L2924/00 , H01L2224/0401
摘要： A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addition, a substrate alignment member attached to the ball retaining plate, aligns the substrate to the balls. Using the substrate alignment member, bonding sites on the substrate can be placed in physical contact with the balls which are held by vacuum on the ball retaining plate. Next, the ball alignment plate and substrate can be place in a furnace for reflowing and bonding the balls to the bonding sites. An apparatus for performing the method includes the ball retaining plate and the substrate alignment member. A system for performing the method includes a ball loader mechanism for loading balls onto the ball retaining plate, and a vacuum fixture for applying a vacuum to the ball retaining cavities.
摘要翻译：提供了用于将球对准和结合到诸如半导体晶片，骰子和封装之类的衬底的方法。该方法采用具有微加工空腔图案的球保持板和用于保持球的真空管道。此外，附接到球保持板的基板对准部件将基板对准球。使用基板对准部件，可以将基板上的接合部位与通过真空保持在球保持板上的球物理接触。接下来，可以将球定位板和基板放置在炉中以将球回弹并结合到结合位置。用于执行该方法的装置包括球保持板和基板对准构件。用于执行该方法的系统包括用于将球装载到球保持板上的球加载机构，以及用于向球保持腔施加真空的真空夹具。

54. 发明授权

US06360934B1 Apparatus and method for removing a soldered device from a printed circuit board 有权
公开(公告)号：US06360934B1
公开(公告)日：2002-03-26
申请号：US09502188
申请日：2000-02-10
申请人： Michael C. Cilia , Gurpreet S. Dayal , Don Nguyen , Arthur K. May
发明人： Michael C. Cilia , Gurpreet S. Dayal , Don Nguyen , Arthur K. May
IPC分类号： B23K100
CPC分类号： H05K13/0486 , B23K1/018 , Y10S269/903
摘要： A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

55. 发明授权

US06357648B1 Method and apparatus for removal of solder 失效
标题翻译：去除焊料的方法和设备
公开(公告)号：US06357648B1
公开(公告)日：2002-03-19
申请号：US09489634
申请日：2000-01-24
申请人： Bernd Monno
发明人： Bernd Monno
IPC分类号： B23K100
CPC分类号： B23K1/018 , B23K2101/42
摘要： The invention relates to a method and an apparatus (22) for removing solder from a circuit board (5) from which electrical or electronic components have been removed at soldering points. The invention is addressed to the problem of offering a method and an apparatus by which the residual solder can be entirely removed from the circuit board (5) and by which even a large area on the circuit board (5) can be freed quickly and easily of the residual solder. This problem is solved by a method in which the solder after melting is pushed away from the soldering points by at least one pushing means (13a) or displaced therefrom by a plunger element, and is then removed from the circuit board (5). The apparatus (22) according to the invention makes available the means needed for the purpose.
摘要翻译：本发明涉及一种用于从电路板（5）去除焊料的方法和装置（22），电焊或电子部件在该焊接点处被去除。本发明涉及提供一种方法和装置的问题，通过该方法和设备可以将剩余的焊料从电路板（5）中完全去除，并且通过该方法和装置，即使电路板（5）上的大面积可以快速且容易地被释放的残留焊料。该问题通过以下方法解决：熔融后的焊料通过至少一个推动装置（13a）从焊接点被推离或者通过柱塞元件从其移出，然后从电路板（5）移除。根据本发明的装置（22）提供了用于该目的所需的手段。

56. 发明授权

US06340108B1 Hot rolling method and equipment 有权
标题翻译：热轧方法和设备
公开(公告)号：US06340108B1
公开(公告)日：2002-01-22
申请号：US09623086
申请日：2000-08-28
申请人： Shigeru Isoyama , Takeshi Hirabayashi , Takahiro Yamasaki , Takushi Kagawa , Kazunori Nagai , Naohiko Ishibashi , Takashi Okai
发明人： Shigeru Isoyama , Takeshi Hirabayashi , Takahiro Yamasaki , Takushi Kagawa , Kazunori Nagai , Naohiko Ishibashi , Takashi Okai
IPC分类号： B23K100
CPC分类号： B21B15/0085 , B21B1/26 , B21B37/005 , B21B2273/18 , B23K20/028 , B23K20/04 , B23K20/24
摘要： Assuming that the processes of joining, rolling, coiling, etc. of a material is evaluated by a preset speed pattern after the extraction from a heating furnace, the required time is predicted and calculated for both of a preceding material and a following material. At the time when the following material can catch up with the preceding material at an aiming position on the line, the following material is extracted from the heating furnace according to the result of the above prediction calculation. Control is carried out so that both of the preceding material and the following material finish the process at a preset speed. Also, the traveling speed of the following material is controlled according to the position and the speed of the tail edge of the preceding material in a section close to the catch-up position so that a distance between the tail edge of the preceding material and the leading edge of the following material be closed. Thereby, three of the tail edge of the preceding material, the leading edge of the following material, and a movable joining apparatus are controlled at the aiming position on the hot rolling line so as to be in a positional relationship suitable for joining, by which the joining operation is completed properly in the travel zone of the joining apparatus.
摘要翻译：假设在从加热炉中取出之后，通过预先设定的速度模式对材料的接合，轧制，卷取等进行评价，对于前述材料和后续材料，预测和计算所需时间。在以下材料可以在线上的瞄准位置赶上前述材料时，根据上述预测计算的结果从加热炉中提取以下材料。进行控制，使得前述材料和以下材料都以预定速度完成该过程。此外，根据在接近追赶位置的部分中的先前材料的尾部的位置和速度来控制以下材料的移动速度，使得在先前材料的尾部边缘与以下材料的前缘关闭。由此，将前一种材料的尾部边缘，以下材料的前缘中的三条和可动接合装置控制在热轧生产线上的瞄准位置，以便处于适于接合的位置关系，由此接合操作在接合设备的行进区域中正确地完成。

57. 发明授权

US06318621B1 Method and apparatus for sealing a chip carrier and lid 有权
标题翻译：用于密封芯片载体和盖子的方法和装置
公开(公告)号：US06318621B1
公开(公告)日：2001-11-20
申请号：US09871028
申请日：2001-05-31
申请人： Thomas F. Marinis , Cathy McEleney , Gregory M. Romano
发明人： Thomas F. Marinis , Cathy McEleney , Gregory M. Romano
IPC分类号： B23K100
CPC分类号： H01L21/50
摘要： A chip carrier and lid are sealed by mounting the chip carrier in an inverted position and mounting a lid having a sealing preform in an inverted position beneath and facing the chip carrier. The chip carrier and lid are then heated to melt the sealing preform and the chip carrier and lid are moved together to join them at the sealing preform.
摘要翻译：芯片载体和盖子通过将芯片载体安装在倒立的位置并将具有密封预制件的盖子安装在下面并面向芯片载体的倒置位置而被密封。然后加热芯片载体和盖子以熔化密封预制件，并且将芯片载体和盖子一起移动以将它们连接在密封预制件上。

58. 发明授权

US06215104B1 Soldering iron 有权
标题翻译：烙铁
公开(公告)号：US06215104B1
公开(公告)日：2001-04-10
申请号：US09101506
申请日：1998-09-17
申请人： Gerhard Kurpiela , Jürgen Staiger , Ralf Zerweck
发明人： Gerhard Kurpiela , Jürgen Staiger , Ralf Zerweck
IPC分类号： B23K100
CPC分类号： B23K3/0369
摘要： A soldering iron includes a housing for accommodating therein at least one heating element and a soldering bit which is releasably secured to the housing. The heating element includes a heat-transmitting contact surface provided on an end face thereof which faces the soldering bit. A heat reception surface of said soldering bit is located opposite the contact surface and in direct contact therewith with no intermediate layer therebetween. A temperature sensor is located adjacent the contact surface and between the contact surface and a filament winding of the heating element.
摘要翻译：烙铁包括用于容纳至少一个加热元件的壳体和可释放地固定到壳体上的烙铁头。加热元件包括设置在其面向焊接头的端面上的透热接触表面。所述焊接头的热接收表面位于与接触表面相对的位置，与其直接接触，其间没有中间层。温度传感器位于接触表面附近并且位于接触表面和加热元件的细丝绕组之间。

59. 发明授权

US06213374B1 Feeder of wire solder 有权
标题翻译：电焊丝馈线
公开(公告)号：US06213374B1
公开(公告)日：2001-04-10
申请号：US09299003
申请日：1999-04-26
申请人： Masayoshi Ueda , Moriaki Kawasaki
发明人： Masayoshi Ueda , Moriaki Kawasaki
IPC分类号： B23K100
CPC分类号： B23K3/063 , B23K9/1336
摘要： Beads or ridges formed by metal work such as knurling provide peaks and valleys on a shaft of a rotary disc, which is part of an abnormal detector of wire solder, so that frictional force between the wire solder is strengthened. Further, the same peaks and valleys mating with those on the shaft are provided on a surface of a feeding roller of the wire solder. The wire solder fed by the feeding roller is provided with the peaks and valleys due to plastic deformation. Both the peaks and valleys on the shaft and on the wire-solder mate with each other so that slipping therebetween can be prevented. Since the shaft is integrated with the rotary disc which is part of the abnormal detector, the accuracy of detecting abnormalities such as clogging wire-solder or crimped wire-solder can be improved. As a result, a feeder of wire solder with better accuracy in abnormality detection can be realized.
摘要翻译：通过诸如滚花等金属加工形成的珠或脊在旋转盘的轴上提供峰和谷，这是作为焊丝异常检测器的一部分，从而加强了焊丝之间的摩擦力。此外，在焊丝的进料辊的表面上设置与轴上的相同的峰和谷。由进给辊供给的焊丝由于塑性变形而具有峰和谷。轴和焊丝上的峰和谷彼此配合，从而可以防止它们之间的滑动。由于轴与作为异常检测器的一部分的旋转盘一体化，因此可以提高检测诸如堵塞焊丝或卷曲焊丝的异常的精度。结果，可以实现异常检测中具有更好精度的焊丝馈电器。

60. 发明授权

US06193135B1 System for providing back-lighting of components during fluxless soldering 失效
标题翻译：在无焊接焊接期间提供部件背光照明的系统
公开(公告)号：US06193135B1
公开(公告)日：2001-02-27
申请号：US09394983
申请日：1999-09-13
申请人： Lu Fang , Brian Dale Pottelger , Dominic Paul Rinaudo , Frederick Arthur Yeagle
发明人： Lu Fang , Brian Dale Pottelger , Dominic Paul Rinaudo , Frederick Arthur Yeagle
IPC分类号： B23K100
CPC分类号： B23K1/012 , B23H1/00 , B23K35/383 , B23K2101/36
摘要： An apparatus for performing fluxless soldering includes an enclosure having a gas inlet through which an inert gas is introduced to create an inert gas-rich environment. Components are placed in the enclosure via an access port which also functions as a vent for allowing purge gases to vent from the enclosure. In one embodiment, a heating stage is provided in the enclosure which provides sufficient heat to reflow solder provided between two or more components. The inert gas is constantly flowing, or purging the enclosure in order to displace oxygen that would initially be present in the system. The presence of inert gas exclusive of other materials provides an oxygen-free environment, i.e., the inert gases provide a “shield” or environment around the parts to be soldered to inhibit the formation of additional oxides during soldering. The apparatus may also include an optics holder for transmitting light from an external light source into the enclosure, to permit visual alignment of component parts.
摘要翻译：用于进行无流动焊接的装置包括具有气体入口的外壳，惰性气体通过该入口引入以产生惰性气体富含环境。组件通过一个进入口放置在外壳中，该进入口也起排气口的作用，以便吹扫气体从外壳排出。在一个实施例中，在外壳中提供加热台，其提供足够的热量以回流在两个或更多个部件之间提供的焊料。惰性气体不断流动，或者吹扫外壳以便置换最初存在于系统中的氧气。不含其它材料的惰性气体的存在提供无氧环境，即，惰性气体在待焊接的部件周围提供“屏蔽”或环境，以在焊接期间抑制附加氧化物的形成。该装置还可以包括用于将光从外部光源传输到外壳中的光学保持器，以允许组件的视觉对准。

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