专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06805281B1 Method of melting material between telescopingly engaged elements 失效
标题翻译：在伸缩接合元件之间熔化材料的方法
公开(公告)号：US06805281B1
公开(公告)日：2004-10-19
申请号：US09722775
申请日：2000-11-27
申请人： Joseph Sirgedas
发明人： Joseph Sirgedas
IPC分类号： B23K100
CPC分类号： B23K1/0008 , B23K2101/06
摘要： A method of forming a meltable material at a joint between telescopingly engaged male and female elements, with the female element having a joint surface that surrounds a joint surface of the male element. The method includes the steps of: placing a ring of the meltable material around one of the male and female elements at a first location spaced from the joint; heating the male and female elements at the joint to a temperature at which the meltable material melts; sliding the ring of meltable material from the first location to a second location; with the ring of meltable material at the second location and the male and female elements of the joint at a temperature at which the meltable material melts, causing the meltable material to flow between the male and female joint surfaces; and cooling the male and female elements at the joint to solidify the meltable material between the male and female joint surfaces.
摘要翻译：在可伸缩接合的阳和阴元件之间的接头处形成可熔材料的方法，其中阴元件具有围绕阳元件的接合表面的接合表面。该方法包括以下步骤：将可熔融材料的环围绕其中一个阳元件和阴元件放置在与接头间隔开的第一位置处; 将接头处的阳元件和阴元件加热到可熔材料熔化的温度; 将可熔材料的环从第一位置滑动到第二位置; 在第二位置处的可熔材料环和接头的阳和女元件处于可熔材料熔化的温度，使可熔材料在阳接头表面和阴接头表面之间流动; 并且在接头处冷却阳元件和阴构件，以使阳和阳接头表面之间的可熔材料固化。

2. 发明授权

US06789720B2 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device 失效
标题翻译：粘性流体传递装置和转移方法，电子部件安装装置和安装方法以及半导体装置
公开(公告)号：US06789720B2
公开(公告)日：2004-09-14
申请号：US10016455
申请日：2001-12-10
申请人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
发明人： Hideki Uchida , Kazuo Kido , Tomoyuki Nakano , Takeshi Kuribayashi , Yoshihiko Misawa
IPC分类号： B23K100
CPC分类号： B23K3/0669 , B23K2101/40 , H01L2924/0002 , H05K3/3484 , H05K13/0469 , Y10T29/49144 , H01L2924/00
摘要： A squeegee unit having a stirring squeegee and a leveling squeegee fixed thereto is rocked with the reciprocating operation of a transfer unit moving mechanism to cause the stirring squeegee and the leveling squeegee to approach the pan surface of a transfer unit on going and returning paths. Consequently, the stirring squeegee stirs a viscous fluid put on the transfer unit on the going path of the transfer unit and the leveling squeegee uniformly flattens the viscous fluid stirred on the going path to have a predetermined thickness on the returning path of the transfer unit, thereby forming a flat viscous fluid transfer surface on the transfer unit. By immersing the terminal portion of the electronic component in the viscous fluid transfer surface, the viscous fluid is transferred to the electronic component and the electronic component is then mounted in a predetermined mounting position.
摘要翻译：具有搅拌刮板和固定在其上的调平刮板的刮板单元通过传送单元移动机构的往复操作而摇摆，使得搅拌刮板和调平刮板在进出路径上接近转印单元的盘表面。因此，搅拌刮板将传送单元上的粘性流体搅拌在传送单元的传送路径上，并且调平刮板将在传送路径上搅动的粘性流体均匀地平坦化，以在转印单元的返回路径上具有预定的厚度，从而在转移单元上形成平坦的粘性流体转移表面。通过将电子部件的端子部分浸渍在粘性流体转移表面中，将粘性流体转移到电子部件，然后将电子部件安装在预定的安装位置。

3. 发明授权

US06742694B2 Solder ball disposing apparatus, solder ball reflow apparatus, and solder ball bonding apparatus 失效
标题翻译：焊球配置装置，焊球回流装置和焊球接合装置
公开(公告)号：US06742694B2
公开(公告)日：2004-06-01
申请号：US10074718
申请日：2002-02-13
申请人： Takuya Satoh , Tatsumi Tsuchiya , Yasuhiro Mita , Lan Shi , Hiroyoshi Yokome , Tatsushi Yoshida , Surya Pattanaik
发明人： Takuya Satoh , Tatsumi Tsuchiya , Yasuhiro Mita , Lan Shi , Hiroyoshi Yokome , Tatsushi Yoshida , Surya Pattanaik
IPC分类号： B23K100
CPC分类号： G11B5/486 , B23K1/0056 , B23K3/0623 , B23K3/08 , B23K2101/40 , B23K2101/42 , H05K3/3442 , H05K3/3478
摘要： An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.
摘要翻译：一种装置将滑块的接合焊盘和引线的引线垫连接在头部万向节组件中，以提高焊球配置装置的效率，小型化和维护，以及用于回流焊球的焊球回流装置。焊球配置装置从通过吸盘抽真空的焊球供给装置的焊球排出孔排出焊球。用于形成无活性气氛的环境空间和惰性气体供应部分形成在桌子上以从光学单元消除惰性气体供应单元，使得会聚的激光束直接辐射到焊球上。

4. 发明授权

US06639170B2 Wire changing in an armature winder 失效
公开(公告)号：US06639170B2
公开(公告)日：2003-10-28
申请号：US10156272
申请日：2002-05-24
申请人： Antonio Becherucci , Rossano Galassi , Antonio Randazzo , Maurizio Mugelli , Gianfranco Stratico
发明人： Antonio Becherucci , Rossano Galassi , Antonio Randazzo , Maurizio Mugelli , Gianfranco Stratico
IPC分类号： B23K100
CPC分类号： H02K15/09
摘要： Methods and apparatus for replacing an old wire threaded through a flyer winder with a new wire are provided. A first end of the old wire is connected to a first end of the new wire. The wires may be connected by twining, clamping, welding or the like. A second end of the old wire that extends from one of the winder's flyers is then connected to a collection device, and the old wire is collected until the new wire has been threaded through the flyer winder along the same path traveled by the old wire. The collection device may be an armature or similar structure having recesses for collecting the old wire during wire change-over or replacement. Preferably the collection device is configured so that conventional coil lead connection operations may be used to expedite wire change-over or replacement.

5. 发明授权

US06607117B1 Solder ball attaching system and method 失效
标题翻译：焊球附着系统及方法
公开(公告)号：US06607117B1
公开(公告)日：2003-08-19
申请号：US09690683
申请日：2000-10-16
申请人： Ju-Il Kang , Hee-Sang Yang
发明人： Ju-Il Kang , Hee-Sang Yang
IPC分类号： B23K100
CPC分类号： B23K3/0623 , B23K1/0016 , B23K1/203 , B23K1/206 , B23K3/08 , B23K3/082 , B23K2101/42 , H01L23/49816 , H01L24/11 , H01L2924/181 , H05K3/3478 , H01L2924/00
摘要： The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.
摘要翻译：本公开是执行与球栅阵列封装制造工艺的最终相对应的焊球附着工艺的复数工艺。例如，焊剂和焊球精确地附着在其上粘附有多个焊盘图案组的基带的基架的焊球焊盘上。在上述状态下，将基架插入到相邻的回流装置中，以使焊球附着在焊球上。在去除焊锡球附着的焊球垫的焊剂之后，将基架储存在容器中。为了在非常小的空间中执行基本帧存储处理，基本帧的传送过程是循环的形式。

6. 发明授权

US06443350B2 Continuous mode solder jet apparatus 有权
标题翻译：连续模式焊料喷射装置
公开(公告)号：US06443350B2
公开(公告)日：2002-09-03
申请号：US09924525
申请日：2001-08-08
申请人： Warren M. Farnworth
发明人： Warren M. Farnworth
IPC分类号： B23K100
CPC分类号： H01L21/6715 , B22F2009/0836 , B23K3/0623 , B23K20/004 , B23K2101/40 , B41J2/085 , B41J2/09 , G01N33/6842 , H01L21/67144 , H05K3/3457 , H05K2203/013 , H05K2203/105
摘要： A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.
摘要翻译：公开了一种焊料喷射装置。焊料喷射装置是包括消隐系统和光栅扫描系统的连续模式焊料喷射。光栅扫描和消隐系统的使用允许将连续的焊料流放置在任何所需的X-Y平面上的任何地方。这允许更高的精度以及更大的产品吞吐量。另外，使用光栅扫描系统，可以使用用于将焊料引导到缺陷的缺陷图快速轻松地进行现有焊接表面的修复。

7. 发明授权

US06386422B1 Solder reflow oven 有权
标题翻译：焊锡回流炉
公开(公告)号：US06386422B1
公开(公告)日：2002-05-14
申请号：US09847278
申请日：2001-05-03
申请人： Chi Wah Cheng , Ping Chun Benson Chong , Hoi Shuen Joseph Tang , Kai Chiu Adam Wu , Ka On Alfred Yue
发明人： Chi Wah Cheng , Ping Chun Benson Chong , Hoi Shuen Joseph Tang , Kai Chiu Adam Wu , Ka On Alfred Yue
IPC分类号： B23K100
CPC分类号： B23K1/008 , B23K2101/40
摘要： A solder reflow oven for the processing of ball grid array substrates bearing solder balls is described, comprising: input means for introducing substrates into the oven, a processing chamber within which the substrates are subject to a solder reflow process, and output means for discharging substrates from the oven for further processing or handling, and means for transferring the substrates through the processing chamber in a first direction towards the output means. The processing chamber comprises a plurality of heating and cooling zones arranged with a constant pitch in the first direction, and the transferring means is adapted to move the substrates in the first direction in stages, with each component moving a distance equal to the pitch between two zones in each stage, whereby the components are moved from zone to zone in stages. In addition each block of each heating zone and each block of each cooling zone is connected to a source of fresh gas, and each block of each heating zone is provided with means for heating the gas, and each block of each cooling zone is provided with means for cooling the gas, and each block is formed with a serpentine channel between the source of fresh gas and at least one opening through which the gas is discharged from the block towards a substrate.
摘要翻译：描述了用于处理支撑焊球的球栅阵列基板的焊料回流炉，包括：用于将基板引入烘箱的输入装置，其中基板经受焊料回流处理的处理室，以及用于放电基板的输出装置从烤箱进一步处理或处理，以及用于将基板沿着第一方向朝向输出装置传送通过处理室的装置。所述处理室包括沿所述第一方向以恒定间距排列的多个加热和冷却区，并且所述传送装置适于分阶段移动所述基板沿所述第一方向，其中每个部件移动距离等于所述第二方向之间的间距每个阶段的区域，从而分量从一个区域逐步移动到另一个区域。此外，每个加热区和每个冷却区的每个块的每个块连接到新鲜气体源，并且每个加热区的每个块设置有用于加热气体的装置，并且每个冷却区的每个块被提供有用于冷却气体的装置，并且每个块在新鲜气体源和至少一个开口之间形成有蛇形通道，气体通过该开口从块向衬底排出。

8. 发明授权

US06250540B1 Fluxless joining process for enriched solders 失效
标题翻译：富集焊剂的无焊接加工工艺
公开(公告)号：US06250540B1
公开(公告)日：2001-06-26
申请号：US09302740
申请日：1999-04-30
申请人： Frank D. Egitto , Luis J. Matienzo
发明人： Frank D. Egitto , Luis J. Matienzo
IPC分类号： B23K100
CPC分类号： B23K35/0244 , B23K1/206 , B23K2101/40 , H05K3/3489
摘要： A process for promoting fluxless soldering of a mass of bulk solder having a bulk ratio of a first metal to a second metal, such as lead-enriched solder that has significantly more lead than tin. The process comprises exposing the bulk solder to energized ions of a sputtering gas in the presence of a halogen, such as fluorine, and forming a surface layer having a desired surface layer ratio of the first to the second metal that is less than the bulk ratio, the surface layer further comprising an uppermost surface film containing the fluorine or other halogen. After the solder exposure and surface-layer formation, the process may further comprise electrically joining the solder to a surface without using externally-applied flux. This process enables the joining step to be performed at less than 300° C., at approximately 180° C.
摘要翻译：一种用于促进具有第一金属与第二金属的体积比的大块焊料的无助焊剂的方法，例如比锡显着更多的铅的富铅焊料。该方法包括在诸如氟的卤素存在下将大块焊料暴露于溅射气体的激发离子，并形成表面层，该表面层具有小于体积比的第一至第二金属的所需表面层比表面层还包含含氟或其它卤素的最上表面膜。在焊料曝光和表面层形成之后，该方法还可以包括将焊料电连接到表面而不使用外部施加的焊剂。该方法使接合步骤能够在低于300℃，约180℃下进行。

9. 发明授权

US06237831B1 Solder collecting capsule and solder extracting desoldering tool using same 有权
标题翻译：焊料采集胶囊和焊料提取脱焊工具使用相同
公开(公告)号：US06237831B1
公开(公告)日：2001-05-29
申请号：US09510682
申请日：2000-02-22
申请人： David W. Lawrence , Dung T. Le , William Jordan Siegel , David Lee Gilbert
发明人： David W. Lawrence , Dung T. Le , William Jordan Siegel , David Lee Gilbert
IPC分类号： B23K100
CPC分类号： B23K3/029 , B23K1/018
摘要： A disposable solder receiving capsule for a hand held vacuum solder extracting desoldering tool is formed of an outer tube which is closed at one end by a porous filter and has an opening at its opposite end, and a hollow solder collection chamber part, having a tubular member with an open end and which is closed with respect to the passage of solder therethrough at an opposite end, forming a solder receiving space within it. The solder collection chamber part is concentrically positioned within the outer tube with an air plenum disposed between the closed end of the chamber part and the filter and with at least one air channel extending the length of solder collection part for providing a path for gases entering the open end of the outer tube to the plenum and the filter that is separated from the solder receiving space. For facilitating solder reclamation, the capsule can be formed entirely of materials which are shape-sustaining when exposed to a temperature of 400° F., are not reactive with either solder and flux, which will burn with little or no residue at a temperature less than 800° F. A desoldering tool for use with the capsule has a detachable, tubular capsule holding part that is open at each of its opposite ends for enabling a solder receiving capsule received in it to be removed from one of the end of the holding tube by pushing another soldering capsule into the opposite end of the holding tube when the detachable holding part is detached from the body of the desoldering tool. In a most preferred embodiment, the tool is designed so that solder cannot be drawn into it if the capsule has not been inserted or has been inserted incorrectly.
摘要翻译：用于手持式真空焊料提取脱焊工具的一次性焊料接收胶囊由外管形成，该外管在一端由多孔过滤器封闭并且在其相对端具有开口，并且具有管状的中空焊料收集室部分构件具有开口端，并且在相对端相对于焊料通过而封闭，在其内形成焊料容纳空间。焊料收集室部分同心地定位在外管内，空气压力室设置在室部分的封闭端和过滤器之间，并且至少一个空气通道延伸长度的焊料收集部分，以提供进入气体的气体的路径将外管的开口端连接到通风室和与焊料接收空间分离的过滤器。为了促进焊料回收，胶囊可以完全由暴露于400°F的温度下保持形状的材料形成，不会与焊料和助焊剂反应，在少量或没有残留物的温度下会燃烧与胶囊一起使用的拆焊工具具有可拆卸的管状胶囊保持部分，其在其每个相对端处开口，用于使容纳在其中的焊料接收胶囊能够从保持的一个端部移除当可拆卸保持部分与脱焊工具的主体分离时，将另一个焊接胶囊推入保持管的相对端。在最优选的实施例中，工具被设计成如果胶囊未被插入或不正确插入，则焊料不能被吸入。

10. 发明授权

US06223968B1 Solder bonding/debonding nozzle insert 失效
标题翻译：焊接/剥离喷嘴插件
公开(公告)号：US06223968B1
公开(公告)日：2001-05-01
申请号：US09481479
申请日：2000-01-11
申请人： Charles Felix Gabriel , Miguel Angel Jimarez , Joseph Edward Zdimal
发明人： Charles Felix Gabriel , Miguel Angel Jimarez , Joseph Edward Zdimal
IPC分类号： B23K100
CPC分类号： B23K1/018 , B23K1/012 , H05K13/0486 , Y10T29/53174 , Y10T29/53191
摘要： In an apparatus for soldering/desoldering components having a nozzle with larger and smaller ends, the larger end for attaching to an exhaust for drawing a vacuum and to a supply of heated gas for at least softening solder, an insert is attached at the smaller end of the nozzle to adjust the size of that opening for receiving each of a plurality of components, fitting different inserts to different sizes of components.
摘要翻译：在用于焊接/拆焊部件的装置中，具有具有较大和较小端部的喷嘴，用于附接到用于抽真空的排气和用于至少软化焊料的加热气体供应的较大端，插入件附接在较小端以调节用于接收多个部件中的每一个的该开口的尺寸，将不同的插入件装配到不同尺寸的部件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式