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1. 发明授权

US07776648B2 High thermal performance packaging for circuit dies 有权
标题翻译：电路芯片的高热性能封装
公开(公告)号：US07776648B2
公开(公告)日：2010-08-17
申请号：US12160233
申请日：2006-12-21
申请人： Kok Hua Chua , Budi Njoman , Zheng Peng Xiong
发明人： Kok Hua Chua , Budi Njoman , Zheng Peng Xiong
IPC分类号： H01L21/00
CPC分类号： H01L23/4334 , H01L23/16 , H01L23/3128 , H01L23/36 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit die is disposed into a region defined by a mold. A molding material is then introduced into the region to encapsulate the circuit die. Prior to substantial curing of the molding material, at least a portion of the molding material is removed from over a surface of the circuit die, creating a recessed region in the encapsulating material. A heat spreader may then be disposed within the recessed region, as well as over the top surface of the encapsulating material. The heat spreader may have a downset that substantially aligns with the recessed region and reduces the distance between the heat spreader and the spacer for better heat dissipation.
摘要翻译：电路芯片设置在由模具限定的区域中。然后将成型材料引入该区域以封装电路管芯。在模制材料的大量固化之前，至少一部分成型材料从电路管芯的表面上去除，从而在封装材料中产生凹陷区域。然后可以将散热器设置在凹陷区域内以及封装材料的顶表面之上。散热器可能具有基本上与凹陷区域对齐的凹陷，并且减小散热器和间隔件之间的距离以获得更好的散热。

2. 发明授权

US06412680B1 Dual-in-line BGA ball mounter 有权
标题翻译：双列直插式BGA球安装机
公开(公告)号：US06412680B1
公开(公告)日：2002-07-02
申请号：US09669278
申请日：2000-09-26
申请人： Kok Hua Chua , Suharto Leo , Hak Meng Tan , Yew Chung Wong
发明人： Kok Hua Chua , Suharto Leo , Hak Meng Tan , Yew Chung Wong
IPC分类号： B23K100
CPC分类号： H01L21/4853 , H05K3/3478
摘要： A BGA ball mount line with a dual in-line mounter flowing into one reflow oven and one in-line cleaner. The dual in-line mounter comprises a first ball mount cell and a second ball mount cell. The second ball mount cell is parallel to and a mirror image of the first ball mount cell. The first ball mount cell and the second ball mount cell can be run by a single operator located between them. In one embodiment of the invention, the BGA ball mount line with dual in-line mounters is implemented in three phases to provide a smooth transition. In the first phase, a proto-line is set-up with a first ball mount cell, a loading cell, a diverter cell, and an unloading cell, to optimize the first ball mount cell. In the second phase, a reflow oven and a flux cleaner are added to form a production line. In the third phase, a second ball mount cell is added to form a BGA ball mount line with a dual in-line mounter.
摘要翻译：一个BGA球安装线，带有一个双列直插式安装器，流入一个回流炉和一个在线清洁器。双列直插式安装器包括第一球形安装单元和第二球形安装单元。第二球形安装单元平行于第一球形安装单元的镜像。第一球形电池和第二球形电池可以由位于它们之间的单个操作器运行。在本发明的一个实施例中，具有双列直插式计数器的BGA球安装线分三个阶段实现，以提供平滑过渡。在第一阶段，用第一球形电池，负载电池，分流器电池和卸载电池来设置原线，以优化第一球形电池。在第二阶段，添加回流炉和助焊剂清洁剂以形成生产线。在第三阶段，添加第二个球形安装单元以形成具有双列直插式安装机的BGA球安装线。

3. 发明授权

US06199464B1 Method and apparatus for cutting a substrate 有权
标题翻译：切割基材的方法和装置
公开(公告)号：US06199464B1
公开(公告)日：2001-03-13
申请号：US09351546
申请日：1999-07-12
申请人： Kok Hua Chua , Jinhan Ju , Kim Hwee Tan
发明人： Kok Hua Chua , Jinhan Ju , Kim Hwee Tan
IPC分类号： B26D300
CPC分类号： B26F1/02 , B26F1/14 , B26F2210/08 , H05K3/005 , H05K3/0052 , H05K3/28 , H05K2201/09036 , Y10T83/04 , Y10T83/2159 , Y10T83/9437
摘要： An apparatus cuts a substrate having first and second portions, each portion having a respectively different level. A first support surface is located at a first level. The first portion of the substrate is supported by the first support surface. A second support surface is located at a second level different from the first level. The second portion of the substrate is supported by the second support surface. The first and second support surfaces are first and second die surfaces, respectively. A punch cuts the substrate between the first support surface and the second support surface. The punch has a V-shaped cross section. A stripper plate has first and second portions. The punch is positioned between the first and second portions of the stripper plate. The first portion of the substrate is clamped between the first portion of the stripper plate and the first die surface. The second portion of the substrate is clamped between the second portion of the stripper plate and the second die surface. The punch punches a cut in the substrate in the form of a straight line segment, without causing cracks in the solder resist layer of the substrate.
摘要翻译：一种设备切割具有第一和第二部分的基底，每个部分具有分别不同的水平。第一支撑表面位于第一级。基板的第一部分由第一支撑表面支撑。第二支撑表面位于与第一水平不同的第二水平处。基板的第二部分由第二支撑表面支撑。第一和第二支撑表面分别是第一和第二模具表面。冲头在第一支撑表面和第二支撑表面之间切割基板。冲头具有V形横截面。剥离板具有第一和第二部分。冲头位于剥离板的第一和第二部分之间。衬底的第一部分夹在剥离板的第一部分和第一模具表面之间。衬底的第二部分夹在剥离板的第二部分和第二模具表面之间。该冲头以直线段的形式冲压基板上的切口，而不会在基板的阻焊层中产生裂纹。

4. 发明申请

US20100120206A1 INTEGRATED CIRCUIT PACKAGE AND A METHOD FOR DISSIPATING HEAT IN AN INTEGRATED CIRCUIT PACKAGE 有权
标题翻译：集成电路封装和集成电路封装散热方法
公开(公告)号：US20100120206A1
公开(公告)日：2010-05-13
申请号：US12518877
申请日：2006-12-12
申请人： Kok Hua Chua , Budi Njoman
发明人： Kok Hua Chua , Budi Njoman
IPC分类号： H01L21/50 , H01L21/60
CPC分类号： H01L23/3675 , H01L21/565 , H01L23/13 , H01L23/3128 , H01L23/4334 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： An IC package that is suitable for surface mounting arrangements includes a heat spreader device that is coupled to a bottom portion of the package below the IC die. Coupling the heat spreader device to the bottom portion of the package reduces or eliminates the possibility that placement of the heat spreader device will result in the molding compound bleeding on top of the heat spreader device, and delamination at the footings of the heat spreader device that can cause the package to delaminate, or “popcorn”.
摘要翻译：适用于表面安装布置的IC封装包括散热器装置，其耦合到IC芯片下面的封装的底部。将散热器装置耦合到封装的底部部分减少或消除了散热装置的放置将导致模制化合物在散热装置的顶部渗出的可能性，以及散热装置的基部处的分层，可能导致包装分层，或“爆米花”。

5. 发明申请

US20090001561A1 High Thermal Performance Packaging for Circuit Dies 有权
标题翻译：电路芯片的高热性能封装
公开(公告)号：US20090001561A1
公开(公告)日：2009-01-01
申请号：US12160233
申请日：2006-12-21
申请人： Kok Hua Chua , Budi Njoman , Zheng Peng Xiong
发明人： Kok Hua Chua , Budi Njoman , Zheng Peng Xiong
IPC分类号： H01L23/36 , H01L21/56
CPC分类号： H01L23/4334 , H01L23/16 , H01L23/3128 , H01L23/36 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A circuit die is disposed into a region defined by a mold. A molding material is then introduced into the region to encapsulate the circuit die. Prior to substantial curing of the molding material, at least a portion of the molding material is removed from over a surface of the circuit die, creating a recessed region in the encapsulating material. A heat spreader may then be disposed within the recessed region, as well as over the top surface of the encapsulating material. The heat spreader may have a downset that substantially aligns with the recessed region and reduces the distance between the heat spreader and the spacer for better heat dissipation.
摘要翻译：电路芯片设置在由模具限定的区域中。然后将成型材料引入该区域以封装电路管芯。在模制材料的大量固化之前，至少一部分成型材料从电路管芯的表面上去除，从而在封装材料中产生凹陷区域。然后可以将散热器设置在凹陷区域内以及封装材料的顶表面之上。散热器可能具有基本上与凹陷区域对齐的凹陷并且减小散热器和间隔件之间的距离，以获得更好的散热。

6. 发明授权

US06319450B1 Encapsulated circuit using vented mold 有权
标题翻译：使用排气模的封装电路
公开(公告)号：US06319450B1
公开(公告)日：2001-11-20
申请号：US09351945
申请日：1999-07-12
申请人： Kok Hua Chua , Ching Meng Fang , Kim Hwee Tan
发明人： Kok Hua Chua , Ching Meng Fang , Kim Hwee Tan
IPC分类号： B29C3310
CPC分类号： B29C45/34 , B29C45/14655 , Y10S425/812
摘要： A mold has at least one vent hole formed in the mold. The vent hole is positioned to allow egress of air from the mold. The vent hole has an inside end and an outside end. The vent hole has a cross section that increases in area from the inside end to the outside end. The vent hole may have a shape of a trapezoidal prism, a truncated pyramid or a truncated cone; the cross section of the vent hole may be a rectangle. A preferred mold has three air vent holes at three corners of the mold. An integrated circuit is placed within the mold. A material to be molded is injected into the mold to encapsulate the integrated circuit. Mold cleaning is facilitated by the shape of the vent, and plastic flashes may be easily removed through the vent hole.
摘要翻译：模具具有在模具中形成的至少一个通气孔。排气孔被定位成允许从模具排出空气。通气孔具有内端和外端。通气孔具有从内端到外端的面积增加的横截面。通气孔可以具有梯形棱柱，截锥体或截锥体的形状; 通气孔的横截面可以是矩形。优选的模具在模具的三个角处具有三个通气孔。集成电路放置在模具内。将待模制的材料注入模具以封装集成电路。通过排气口的形状促进了模具清洗，并且可以通过通气孔容易地去除塑料闪光。

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