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1. 发明授权

US06607113B2 Apparatus and method for removing a soldered device from a printed circuit board 有权
公开(公告)号：US06607113B2
公开(公告)日：2003-08-19
申请号：US09992609
申请日：2001-11-14
申请人： Michael C. Cilia , Gurpreet S. Dayal , Don Nguyen , Arthur K. May
发明人： Michael C. Cilia , Gurpreet S. Dayal , Don Nguyen , Arthur K. May
IPC分类号： B23K3704
CPC分类号： H05K13/0486 , B23K1/018 , Y10S269/903
摘要： A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

2. 发明授权

US06360934B1 Apparatus and method for removing a soldered device from a printed circuit board 有权
公开(公告)号：US06360934B1
公开(公告)日：2002-03-26
申请号：US09502188
申请日：2000-02-10
申请人： Michael C. Cilia , Gurpreet S. Dayal , Don Nguyen , Arthur K. May
发明人： Michael C. Cilia , Gurpreet S. Dayal , Don Nguyen , Arthur K. May
IPC分类号： B23K100
CPC分类号： H05K13/0486 , B23K1/018 , Y10S269/903
摘要： A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.

3. 发明授权

US06172879B2 BGA pin isolation and signal routing process 失效
标题翻译： BGA引脚隔离和信号路由过程
公开(公告)号：US06172879B2
公开(公告)日：2001-01-09
申请号：US09107757
申请日：1998-06-30
申请人： Michael C. Cilia , Don Nguyen , Gurpreet S. Dayal
发明人： Michael C. Cilia , Don Nguyen , Gurpreet S. Dayal
IPC分类号： H05K118
CPC分类号： H05K3/225 , H05K3/3436 , Y10T29/49144 , Y10T29/49162
摘要： A method for isolating a pin of a ball grid array (BGA) device mounted on a printed circuit board, and routing the signal carried by the isolated pin to an alternate location. The BGA device pin is isolated by removing the solder ball to expose the device pad. A rework or engineering wire is then soldered to the BGA device pad using a high temperature solder. The rework wire is then routed between the other solder pads to the edge of the BGA device package. The BGA device is then reflowed at a temperature lower than the reflow temperature of the high temperature solder. The rework wire is used to route the signal carried by the isolated BGA pin to an alternate location. The present invention provides for higher process yields than conventional rework processes.
摘要翻译：一种用于隔离安装在印刷电路板上的球栅阵列（BGA）装置的引脚的方法，以及将由隔离引脚承载的信号路由到备用位置。通过去除焊球以露出设备焊盘，可以隔离BGA器件引脚。然后使用高温焊料将返工或工程线焊接到BGA器件焊盘。然后，返工线在其他焊盘之间布置到BGA器件封装的边缘。然后在低于高温焊料的回流温度的温度下回流BGA器件。返工线用于将隔离的BGA引脚承载的信号路由到备用位置。本发明提供比常规返工工艺更高的工艺产量。

4. 发明授权

US07892019B2 SAS panel mount connector cable assembly with LEDs and a system including the same 有权
标题翻译：带有LED的SAS面板安装连接器电缆组件和包括它的系统
公开(公告)号：US07892019B2
公开(公告)日：2011-02-22
申请号：US12265517
申请日：2008-11-05
申请人： Deepak Rao , Alan L. Winick , Gurpreet S. Dayal
发明人： Deepak Rao , Alan L. Winick , Gurpreet S. Dayal
IPC分类号： H01R12/24
CPC分类号： H01R31/005 , H01R12/59 , H01R13/7175 , H01R2201/06
摘要： A SAS panel mount cable assembly for providing access of target hard-drive resources to an initiator-host includes an initiator-side connector, two target-side connectors, and a wire-harness. Each of the two target-side connectors includes a power-link portion, a signal-link portion, an interface separating the power-link portion and the signal-link portion, and a plurality of LEDs for indicating activity and fault-detection. A plurality of power-wires electrically connects the wire-harness to the power-link portions of the two target-side connectors, and two signal-link cables connect the initiator-side connector to the signal-link portions of the two target-side connectors.
摘要翻译：用于向目标主机提供对目标硬盘驱动器资源的访问的SAS面板安装电缆组件包括启动器侧连接器，两个目标侧连接器和线束。两个目标侧连接器中的每一个包括功率链路部分，信号链路部分，分离功率链路部分和信号链路部分的接口，以及用于指示活动和故障检测的多个LED。多个电源线将线束电连接到两个目标侧连接器的电力连接部分，并且两个信号链路电缆将起动器侧连接器连接到两个目标侧连接器的信号链接部分连接器

5. 发明申请

US20100271793A1 PRINTED CIRCUIT BOARD WITH OPTIMIZED MOUNTING HOLES AND ALIGNMENT PINS 有权
标题翻译：印刷电路板，具有优化的安装孔和对准针
公开(公告)号：US20100271793A1
公开(公告)日：2010-10-28
申请号：US12429915
申请日：2009-04-24
申请人： Drew G. Doblar , Gurpreet S. Dayal
发明人： Drew G. Doblar , Gurpreet S. Dayal
IPC分类号： H01R12/18 , H05K1/14
CPC分类号： H05K7/1454 , H05K1/0271 , H05K3/366 , H05K2201/044 , H05K2201/10189 , H05K2201/10303 , H05K2201/10409 , H05K2201/10545 , H05K2201/2009 , H05K2203/167
摘要： A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.
摘要翻译：提供了一种安装平面组件（例如背板或中平面），用于互连服务器计算机中的多个子板。安装平面组件包括印刷电路板（“PCB”），该印刷电路板具有多个共用的安装孔，用于将连接器对准销连接到PCB的正面以及通过其连接到PCB背面的机械支撑元件安装孔。

6. 发明授权

US07835155B2 Computer memory socket particulate management system and method 有权
标题翻译：计算机内存插座微粒管理系统及方法
公开(公告)号：US07835155B2
公开(公告)日：2010-11-16
申请号：US11946992
申请日：2007-11-29
申请人： Yefim Gelfond , Gurpreet S. Dayal
发明人： Yefim Gelfond , Gurpreet S. Dayal
IPC分类号： H05K5/00
CPC分类号： G06F1/185
摘要： A cover for memory sockets of a computer memory module includes a face panel spaced away from the memory sockets. The cover is held in place via latches associated with the memory sockets. Tabs are spaced along opposite sides of the cover to define openings for the memory sockets. Members span between opposite pairs of tabs to define air passageways underneath the cover. Each member resides between an adjacent pair of memory sockets.
摘要翻译：计算机存储器模块的存储器插座的盖子包括与存储器插座间隔开的面板。盖通过与存储器插槽相关联的锁存器保持在适当位置。突出部分沿着盖的相对侧隔开以限定用于存储器插槽的开口。构件跨在相对的突出部之间以限定盖下方的空气通道。每个成员驻留在相邻的一对存储器插槽之间。

7. 发明申请

US20100112850A1 SAS PANEL MOUNT CONNECTOR CABLE ASSEMBLY WITH LEDs AND A SYSTEM INCLUDING THE SAME 有权
标题翻译： SAS面板安装连接器电缆组件，包括LED和包括其的系统
公开(公告)号：US20100112850A1
公开(公告)日：2010-05-06
申请号：US12265517
申请日：2008-11-05
申请人： Deepak Rao , Alan L. Winick , Gurpreet S. Dayal
发明人： Deepak Rao , Alan L. Winick , Gurpreet S. Dayal
IPC分类号： H01R12/24
CPC分类号： H01R31/005 , H01R12/59 , H01R13/7175 , H01R2201/06
摘要： A SAS panel mount cable assembly for providing access of target hard-drive resources to an initiator-host includes an initiator-side connector, two target-side connectors, and a wire-harness. Each of the two target-side connectors includes a power-link portion, a signal-link portion, an interface separating the power-link portion and the signal-link portion, and a plurality of LEDs for indicating activity and fault-detection. A plurality of power-wires electrically connects the wire-harness to the power-link portions of the two target-side connectors, and two signal-link cables connect the initiator-side connector to the signal-link portions of the two target-side connectors.
摘要翻译：用于向目标主机提供对目标硬盘驱动器资源的访问的SAS面板安装电缆组件包括启动器侧连接器，两个目标侧连接器和线束。两个目标侧连接器中的每一个包括功率链路部分，信号链路部分，分离功率链路部分和信号链路部分的接口，以及用于指示活动和故障检测的多个LED。多个电源线将线束电连接到两个目标侧连接器的电力连接部分，并且两个信号链路电缆将起动器侧连接器连接到两个目标侧连接器的信号链接部分连接器

8. 发明申请

US20090141434A1 COMPUTER MEMORY SOCKET PARTICULATE MANAGEMENT SYSTEM AND METHOD 有权
标题翻译：计算机存储器插件管理系统和方法
公开(公告)号：US20090141434A1
公开(公告)日：2009-06-04
申请号：US11946992
申请日：2007-11-29
申请人： Yefim Gelfond , Gurpreet S. Dayal
发明人： Yefim Gelfond , Gurpreet S. Dayal
IPC分类号： H05K5/03 , H05K5/00
CPC分类号： G06F1/185
摘要： A cover for memory sockets of a computer memory module includes a face panel spaced away from the memory sockets. The cover is held in place via latches associated with the memory sockets. Tabs are spaced along opposite sides of the cover to define openings for the memory sockets. Members span between opposite pairs of tabs to define air passageways underneath the cover. Each member resides between an adjacent pair of memory sockets.
摘要翻译：计算机存储器模块的存储器插座的盖子包括与存储器插座间隔开的面板。盖通过与存储器插槽相关联的锁存器保持在适当位置。突出部分沿着盖的相对侧隔开以限定用于存储器插槽的开口。构件跨在相对的突出部之间以限定盖下方的空气通道。每个成员驻留在相邻的一对存储器插槽之间。

9. 发明授权

US08014159B2 Printed circuit board with optimized mounting holes and alignment pins 有权
标题翻译：印刷电路板，具有优化的安装孔和对准针
公开(公告)号：US08014159B2
公开(公告)日：2011-09-06
申请号：US12429915
申请日：2009-04-24
申请人： Drew G. Doblar , Gurpreet S. Dayal
发明人： Drew G. Doblar , Gurpreet S. Dayal
IPC分类号： H05K5/00
CPC分类号： H05K7/1454 , H05K1/0271 , H05K3/366 , H05K2201/044 , H05K2201/10189 , H05K2201/10303 , H05K2201/10409 , H05K2201/10545 , H05K2201/2009 , H05K2203/167
摘要： A mounting plane assembly (e.g., backplane or midplane) is provided for interconnecting a plurality of daughterboards in a server computer. The mounting plane assembly includes a printed circuit board (“PCB”) that has a plurality of shared mounting holes for attaching connector alignment pins to a front side of the PCB as well as mechanical support elements to a back side of the PCB through the same mounting holes.
摘要翻译：提供了一种安装平面组件（例如背板或中平面），用于互连服务器计算机中的多个子板。安装平面组件包括印刷电路板（“PCB”），该印刷电路板具有多个共用的安装孔，用于将连接器对准销连接到PCB的正面以及通过其连接到PCB背面的机械支撑元件安装孔。

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