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51. 发明专利

JP2010258462A Composite material for wiring board and production method thereof 审中-公开
标题翻译：接线板复合材料及其生产方法
公开(公告)号：JP2010258462A
公开(公告)日：2010-11-11
申请号：JP2010135504
申请日：2010-06-14
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： BABA AKIO , TAKANO MARE , MADARAME TAKESHI , SAITO TETSUYA
IPC分类号： H05K1/03 , B32B9/00 , B32B15/08
摘要： PROBLEM TO BE SOLVED: To provide a composite material including an insulation material having advantages of both inorganic materials and organic materials, and to provide a novel composite material for a wiring board which has superior heat resistance, moisture resistance and electrolytic corrosion resistance, and also has both superior low stress properties and a low coefficient of thermal expansion. SOLUTION: The composite material for the wiring board comprises a layer of an inorganic material and a resin layer, and the difference in coefficient of thermal expansion between the inorganic material and resin is ≤10×10 -6 /°C. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种具有无机材料和有机材料的优点的绝缘材料的复合材料，并提供具有优异的耐热性，耐湿性和耐电腐蚀性的新颖的用于布线板的复合材料，并且还具有优异的低应力性能和低的热膨胀系数。解决方案：用于布线板的复合材料包括无机材料层和树脂层，无机材料和树脂之间的热膨胀系数差为≤10×10 -6 < SP> /℃。版权所有（C）2011，JPO＆INPIT

52. 发明专利

JP2010159427A Resin composition, prepreg, laminate and printed wiring board using the same 有权
标题翻译：树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2010159427A
公开(公告)日：2010-07-22
申请号：JP2010066892
申请日：2010-03-23
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , FUKUDA TOMIO , TAKANO MARE , KOBAYASHI KAZUHITO
IPC分类号： C08L63/00 , C08G59/40 , C08J5/24 , C08K3/22 , C08L83/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which contains a highly dispersed inorganic filler such as a metal hydrate, has high heat resistance, does not contain a halogen, and has flame retardancy, and to provide a laminate and a printed wiring board each using the same. SOLUTION: This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent, (C) a metal hydrate, (D) a silicone polymer having phenyl groups in the siloxane skeleton and having two or more functional groups at least one terminal, as essential components, wherein the content of the component (C) is 50 to 150 wt.% based on the total amount of the components (A) and (B). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：待解决的问题：为了提供一种包含高度分散的无机填料如金属水合物的树脂组合物，具有高耐热性，不含卤素并具有阻燃性，并且提供层压体和印刷接线板各使用相同。解决方案：该树脂组合物的特征在于含有（A）环氧树脂，（B）固化剂，（C）金属水合物，（D）在硅氧烷骨架中具有苯基的硅氧烷聚合物，并具有两个或更多官能团至少一个末端作为必需成分，其中组分（C）的含量相对于组分（A）和（B）的总量为50至150重量％。版权所有（C）2010，JPO＆INPIT

53. 发明专利

JP2007136835A Method and apparatus for producing laminate 审中-公开
标题翻译：生产层压板的方法和装置
公开(公告)号：JP2007136835A
公开(公告)日：2007-06-07
申请号：JP2005333317
申请日：2005-11-17
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： KIKUCHI TSUTOMU , OYAMA YUJI , TAKANO MARE
IPC分类号： B29C63/02 , B29C65/02 , B32B37/10 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a laminate in which conductive thin members are laminated on both sides of a sheet-shaped substrate 60 μm or below in thickness and the occurrence of wrinkles is suppressed. SOLUTION: The method includes a conveyance process in which the sheet-shaped substrate 60 μm or below in thickness is conveyed while tension in the conveyance direction is applied to the substrate, a first heating/pressurization process in which in order to make conductive sheet-shaped members adhere provisionally to both sides of the substrate conveyed in the conveyance process, the substrate and the conductive members are heated/pressurized simultaneously, a cutting process in which the members and the substrate laminated by the provisional adhesion in the first heating/pressurization process are cut in a prescribed length, and a second heating/pressurization process in which a plurality of the cut materials are piled and heated/pressurized simultaneously so that the members and the substrate of a cut material constituted of the members and the substrate cut in the cutting process adhere to each other. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案：提供一种层压体的制造方法，其中导电薄片层压在厚度为60μm或以下的片状基片的两侧，并且抑制皱纹的发生。解决方案：该方法包括一种输送过程，其中输送方向的张力在厚度为60μm或以下的片状基底被施加到基底上，第一加热/加压过程中，为了制备导电片状构件暂时粘附到在输送过程中输送的基板的两侧，基板和导电构件同时加热/加压，其中通过第一加热中的临时粘合层压的构件和基板的切割工艺切割规定长度的加压工序和同时堆叠加热加压的多个切割材料的第二加热加压工序，使由构件和基板构成的切断材料的构件和基板在切割过程中切割相互依存。版权所有（C）2007，JPO＆INPIT

54. 发明专利

JP2007013113A Multilayer wiring board 审中-公开
标题翻译：多层接线板
公开(公告)号：JP2007013113A
公开(公告)日：2007-01-18
申请号：JP2006145458
申请日：2006-05-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , TAKANO MARE , YAMAGUCHI MAKI , YANAGIDA MAKOTO
IPC分类号： H05K3/46
CPC分类号： H05K3/4691 , H05K1/0278 , H05K1/0366 , H05K3/281 , H05K3/4611 , H05K3/4626 , H05K3/4688 , H05K2203/0571 , H05K2203/063
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can be contained in a case of an electronic device with a high density.
SOLUTION: A multilayer wiring board 12 has a structure in which printed wiring boards 6 having no flexibility are laminated via coverlays 10 on both sides of a printed wiring board 1 having a flexibility. In this multilayer wiring board 12, the coverlay 10 protects a portion of the printed wiring board 1 where no printed wiring board 6 is arranged, and functions as an adhesive layer 11 for bonding the printed wiring board 6. That is, in the multilayer wiring board 12, the coverlay 10 and the adhesive layer 11 are the same layer.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以包含在具有高密度的电子设备的情况下的多层布线板。解决方案：多层布线板12具有这样的结构，其中具有柔性的印刷线路板1的两侧上通过覆盖层10层压没有柔性的印刷布线板6。在这种多层布线板12中，覆盖层10保护印刷布线板1的没有印刷布线板6的部分，并且用作用于粘合印刷布线板6的粘合剂层11.也就是说，在多层布线板12，覆盖层10和粘合剂层11是相同的层。版权所有（C）2007，JPO＆INPIT

55. 发明专利

JP2006148072A Wiring board 审中-公开
标题翻译：接线板
公开(公告)号：JP2006148072A
公开(公告)日：2006-06-08
申请号：JP2005292833
申请日：2005-10-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , OBATA KAZUHITO , IWASAKI YORIO , MINAGAWA ICHIJI
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a wiring board capable of improving reliability in junction of the wiring board and parts by improving accuracy in the position of a connection land.
SOLUTION: The wiring board 50 is provided with an insulating layer 52, a connection land 54 provided on one surface 52a of the insulating layer 52, and a copper layer 58 provided in a predetermined region R2 on the other surface 52b of the insulating layer 52. The connection land 54 is disposed in a region R1 corresponding to the predetermined rejoin R2 on the surface 54a.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种能够通过提高连接平台的位置的精度来提高布线基板和部件的接合的可靠性的布线基板。解决方案：布线板50设置有绝缘层52，设置在绝缘层52的一个表面52a上的连接接合区54和设置在绝缘层52的另一个表面52b上的预定区域R2中的铜层58 绝缘层52.连接区域54设置在与表面54a上的预定重合R2相对应的区域R1中。版权所有（C）2006，JPO＆NCIPI

56. 发明专利

JP2006131749A Resin composition, prepreg, laminate and printed wiring board using the same 有权
标题翻译：树脂组合物，PREPREG，层压板和印刷线路板
公开(公告)号：JP2006131749A
公开(公告)日：2006-05-25
申请号：JP2004322176
申请日：2004-11-05
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MIYATAKE MASATO , FUKUDA TOMIO , TAKANO MARE , KOBAYASHI KAZUHITO
IPC分类号： C08L63/00 , B32B15/092 , C08J5/24 , C08K3/20 , C08L83/04 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a resin composition which contains a highly dispersed inorganic filler such as a metal hydroxide, has high heat resistance, does not contain a halogen, and has flame retardancy, and to provide a laminate and a printed wiring board each using the same. SOLUTION: This resin composition is characterized by containing (A) an epoxy resin, (B) a curing agent, (C) a metal hydroxide, (D) a silicone polymer having phenyl groups in the siloxane skeleton and having two or more functional groups at at least one terminal, as essential components, wherein the content of the component (C) is 50 to 150 wt.% based on the total amount of the components (A) and (B). COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供含有高度分散的无机填料如金属氢氧化物的树脂组合物，具有高耐热性，不含卤素并且具有阻燃性，并且提供层压体和印刷接线板各使用相同。该树脂组合物的特征在于含有（A）环氧树脂，（B）固化剂，（C）金属氢氧化物，（D）在硅氧烷骨架中具有苯基的硅氧烷聚合物，其具有两个或至少一个末端的更多官能团作为必要组分，其中组分（C）的含量相对于组分（A）和（B）的总量为50至150重量％。版权所有（C）2006，JPO＆NCIPI

57. 发明专利

JP2006117888A Composite, prepreg using the same, metal foil-clad laminate plate, circuit board and method for producing the circuit board 审中-公开
标题翻译：使用它们的复合材料，PREPREG，金属箔层压板，电路板和生产电路板的方法
公开(公告)号：JP2006117888A
公开(公告)日：2006-05-11
申请号：JP2004310030
申请日：2004-10-25
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , KAMIYA MASAMI
IPC分类号： C08J5/24 , B32B15/08 , C08L63/00 , H05K1/03 , H05K1/11 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a composite sufficiently excellent in adhesive reliability, sufficiently suppressed in generation of resin powder and fiber liable to fall off, to provide a prepreg using the composite, and to provide a metal foil-clad laminate plate using the composite.
SOLUTION: The composite settling the above problems is a composite 100 which is obtained by impregnating a fiber sheet 101 with a curable resin composition 102 and gives a cured product of the curable resin composition and having 100-2,000 MPa storage elastic modulus at 20°C. The curable resin composition has ≥30,000 weight-average molecular weight, contains an acrylic polymer containing 2-20 mass% glycidyl acrylate as a polymerizable component and has 2-36 epoxy number.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供粘合可靠性足够优异的复合材料，能够充分抑制树脂粉末和易脱落的纤维的产生，提供使用该复合体的预浸料坯，并提供覆盖金属箔的层压板使用复合材料。解决方案：解决上述问题的复合物是通过用固化性树脂组合物102浸渍纤维片101而获得的复合物100，并将固化性树脂组合物的固化产物具有100-2,000MPa的储能弹性模量 20℃。该固化性树脂组合物的重均分子量为30,000以上，含有2-20质量％丙烯酸缩水甘油酯作为聚合性成分的丙烯酸系聚合物，环氧树脂数为2-36。版权所有（C）2006，JPO＆NCIPI

58. 发明专利

JP2006066894A Printed-circuit board 审中-公开
标题翻译：印刷电路板
公开(公告)号：JP2006066894A
公开(公告)日：2006-03-09
申请号：JP2005207333
申请日：2005-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , TAKANO MARE , MASUDA KATSUYUKI , TANAKA MASASHI , OYAMA YUJI , MATSUURA YOSHITSUGU , HASHIMOTO KAZUAKI , KITAJIMA TAKAYO , OBATA KAZUHITO
IPC分类号： H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed-circuit board having excellent dimensional stability, heat resistance, dusting-resisting properties and impact resistance and being capable of being arbitrarily bent.
SOLUTION: The printed-circuit board is formed of a substrate composed of an insulating resin layer containing a fiber base material. In the printed-circuit board, the tensile modulus of an elasticity of the substrate is 0.5 GPa to 10 GPa at 25°C.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有优异的尺寸稳定性，耐热性，防尘性和抗冲击性并且能够任意弯曲的印刷电路板。解决方案：印刷电路板由包含纤维基材的绝缘树脂层构成的基板形成。在印刷电路板中，基板的拉伸弹性模量在25℃为0.5GPa至10GPa。版权所有（C）2006，JPO＆NCIPI

59. 发明专利

JP2005036242A Flame retardant resin composition, and prepreg, laminate, metal-clad laminate, printed wiring board and multilayer printed wiring board using the same 有权
标题翻译：阻燃树脂组合物和PREPREG，层压板，金属层压板，印刷线路板和多层印刷线路板
公开(公告)号：JP2005036242A
公开(公告)日：2005-02-10
申请号：JP2004295821
申请日：2004-10-08
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , FUKUDA TOMIO , MIYATAKE MASATO
IPC分类号： C08J5/24 , B32B15/08 , C08K3/22 , C08K9/06 , C08L83/04 , C08L101/00 , H05K1/03
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a prepreg, a laminate, a copper-clad laminate, a printed wiring board, a multilayer printed wiring board and the like which express excellent flame retardance without requiring a bromine-containing material and realize high heat resistance. SOLUTION: The flame-retardant resin composition contains a silicone polymer, a metal hydrate and a resin material as the essential constituents, wherein the metal hydrate accounts for at least 20 wt.% of the total solids of the composition. COPYRIGHT: (C)2005,JPO&NCIPI

60. 发明专利

JP2012122081A Flame retardant resin composition, and prepreg, laminate, metal-clad laminate, printed wirirng board and multi-layer printed wiring board using the same 审中-公开
标题翻译：阻燃树脂组合物和PREPREG，层压板，金属层压板，印刷线路板和多层印刷线路板
公开(公告)号：JP2012122081A
公开(公告)日：2012-06-28
申请号：JP2012069248
申请日：2012-03-26
申请人： Hitachi Chemical Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , FUKUDA TOMIO , MIYATAKE MASATO
IPC分类号： C08K3/22 , C08L63/00 , B32B15/08 , C08J5/24 , C08K5/5415 , C08K9/06 , C08K13/02 , C08L83/04 , C08L83/06 , H01L23/14 , H01L23/29 , H05K1/03
CPC分类号： B32B15/08 , C08K9/06 , H01L23/145 , H01L23/296 , H01L2924/0002 , H05K1/0373 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , Y10S428/901 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31663 , Y10T428/31721 , Y10T428/31862 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To fabricate a prepreg, a laminate, a metal-clad laminate, a printed wirirng board, a multi-layer printed wiring board and the like, which have excellent flame retardancy without any need for a material containing bromine, and have high heat resistance.SOLUTION: A flame retardant resin composition contains essentially a silicone polymer, a metal hydrate and a resin material, wherein the metal hydrate is ≥20 wt.% in the whole solid content of the resin composition.

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