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1. 发明专利

JP2011103480A Method for manufacturing multi-layer printed wiring board 审中-公开
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2011103480A
公开(公告)日：2011-05-26
申请号：JP2011002262
申请日：2011-01-07
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , TANAKA MASASHI , OBATA KAZUHITO , OYAMA YUJI , MATSUURA YOSHITSUGU
IPC分类号： H05K3/46
CPC分类号： B32B27/04 , B29K2105/0872 , H05K1/0366 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/53883
摘要： PROBLEM TO BE SOLVED: To provide a prepreg for a printed wiring board and a metal foil clad laminate that are small in water absorption rate and dimensional change rate and that exhibit superior bending characteristics when the printed wiring board is molded, and to provide a method for manufacturing the multi-layer printed wiring board using the same. SOLUTION: The invention relates to the method for preparing the multilayer printed circuit board arranging the prepreg for the printed wiring board including a base material on a surface of the printed wiring board including the base material, further arranging a metal foil or the metal foil clad laminate including the base material on a surface of the prepreg for the printed wiring board, and heating and pressing them, at least one or more of printed wiring boards being larger in size than the prepreg for the multilayer printed wiring board, and the printed wiring board being characterized in that no crack is caused in the base material included in the printed wiring board even when it is bent by an angle of 90°. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于印刷线路板和覆盖金属箔的叠层板，其吸水率和尺寸变化率小，并且当印刷线路板被模制时表现出优异的弯曲特性，并且提供一种使用其制造多层印刷线路板的方法。解决方案：本发明涉及一种制备多层印刷电路板的方法，该多层印刷电路板在包括基材的印刷线路板的表面上布置包括基材的印刷线路板的预浸料，进一步布置金属箔或在印刷电路板用预浸料坯的表面上具有基材的金属箔覆层压板，对其进行加热加压，至少一个以上的印刷电路板的尺寸大于多层印刷电路板的预浸料，印刷电路板的特征在于，即使当其弯曲90°的角度时，也不会在包含在印刷线路板中的基材中产生裂纹。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2006066894A Printed-circuit board 审中-公开
标题翻译：印刷电路板
公开(公告)号：JP2006066894A
公开(公告)日：2006-03-09
申请号：JP2005207333
申请日：2005-07-15
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , TAKANO MARE , MASUDA KATSUYUKI , TANAKA MASASHI , OYAMA YUJI , MATSUURA YOSHITSUGU , HASHIMOTO KAZUAKI , KITAJIMA TAKAYO , OBATA KAZUHITO
IPC分类号： H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed-circuit board having excellent dimensional stability, heat resistance, dusting-resisting properties and impact resistance and being capable of being arbitrarily bent.
SOLUTION: The printed-circuit board is formed of a substrate composed of an insulating resin layer containing a fiber base material. In the printed-circuit board, the tensile modulus of an elasticity of the substrate is 0.5 GPa to 10 GPa at 25°C.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供具有优异的尺寸稳定性，耐热性，防尘性和抗冲击性并且能够任意弯曲的印刷电路板。解决方案：印刷电路板由包含纤维基材的绝缘树脂层构成的基板形成。在印刷电路板中，基板的拉伸弹性模量在25℃为0.5GPa至10GPa。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2013012779A Method for manufacturing multilayer printed wiring board 审中-公开
标题翻译：制造多层印刷线路板的方法
公开(公告)号：JP2013012779A
公开(公告)日：2013-01-17
申请号：JP2012220552
申请日：2012-10-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , TAKEUCHI KAZUMASA , MASUDA KATSUYUKI , TANAKA MASASHI , OBATA KAZUHITO , OYAMA YUJI , MATSUURA YOSHITSUGU
IPC分类号： H05K3/46
CPC分类号： B32B27/04 , B29K2105/0872 , H05K1/0366 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/53883
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board using a prepreg for a printed wiring board in which the amount of a resin oozing from the prepreg to an inner layer board is small, in molding a multilayer printed wiring board having an inner layer board, such as a rigid-flexible board, protruding therefrom.SOLUTION: A method for manufacturing a multilayer printed wiring board includes the steps of: arranging a prepreg for a printed wiring board on a surface of the printed wiring board; and arranging a metal foil or a metal foil clad laminate on the surface of the prepreg for the printed wiring board, and heating and pressure molding the printed wiring board. At least one or more of the printed wiring boards are larger than the prepreg for the printed wiring board, and the amount of a resin oozing from the prepreg for the printed wiring board is 3 mm or less under heating and pressure molding conditions of 250°C or less and 10 MPa or less.
摘要翻译：要解决的问题：提供一种使用预浸料坯制备多层印刷线路板的方法，所述多层印刷线路板使用从预浸料坯向内层板渗出的树脂量小的印刷线路板的预浸料，具有从其突出的诸如刚性柔性板的内层板的印刷线路板。解决方案：一种制造多层印刷线路板的方法包括以下步骤：在印刷线路板的表面上布置用于印刷线路板的预浸料; 并且在印刷线路板的预浸料坯的表面上布置金属箔或覆盖金属箔的层叠体，并且对印刷线路板进行加热和加压成型。至少一个或多个印刷线路板比印刷线路板的预浸料坯大，并且在加热和加压成型条件为250°时，从印刷线路板的预浸料坯渗出的树脂的量为3mm以下 ℃以下，10MPa以下。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2007146121A Viscoelastic resin composition, metal foil-clad laminate using same, prepreg, resin-coated metal foil, and resin film 审中-公开
标题翻译：粘胶树脂组合物，使用相同的金属箔层压板，PREPREG，树脂涂层金属箔和树脂膜
公开(公告)号：JP2007146121A
公开(公告)日：2007-06-14
申请号：JP2006256157
申请日：2006-09-21
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： MATSUURA YOSHITSUGU , TAKANO MARE , NISHIKATA HIROMI , TANAKA MASASHI
IPC分类号： C08L33/14 , B32B15/08 , B32B15/082 , C08J5/24 , C08K5/1515
CPC分类号： H05K3/386 , H05K2201/0154
摘要： PROBLEM TO BE SOLVED: To provide a viscoelastic resin composition capable of forming a material for a printed circuit board which satisfies fully excellent flexibility, heat resistance, and dimensional stability in combination.
SOLUTION: This viscoelastic resin composition contains an acrylic rubber polymer and has a Tg of -20°C-0°C, and the acrylic rubber polymer contains 1-15 mass% glycidyl(meth)acrylate relative to the total as a monomer unit, and its weight average molecular weight is 300,000 to 1,000,000.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够形成印刷电路板材料的粘弹性树脂组合物，该组合物具有充分优异的柔性，耐热性和尺寸稳定性。解决方案：该粘弹性树脂组合物含有丙烯酸橡胶聚合物，Tg为-20℃〜0℃，丙烯酸橡胶聚合物相对于总量为1-15质量％的（甲基）丙烯酸缩水甘油酯单体单元，其重均分子量为30万〜100万。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006219669A Curable resin composition, prepreg, substrate, metal foil-clad laminated plate, metal foil with resin, and printed wiring board 审中-公开
标题翻译：可固化树脂组合物，PREPREG，基材，金属箔层压板，带树脂的金属箔和印刷线路板
公开(公告)号：JP2006219669A
公开(公告)日：2006-08-24
申请号：JP2006005265
申请日：2006-01-12
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , OBATA KAZUHITO , MATSUURA YOSHITSUGU , TANAKA MASASHI
IPC分类号： C08L63/00 , C08G59/62 , C08J5/24 , C08K5/21 , H01L23/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a printed wiring board exhibiting sufficiently excellent adhesion between wirings and a substrate and a prepreg sufficiently suppressed in breakage or cracks.
SOLUTION: The curable resin composition for a printed wiring board comprises a component (a): an acrylic polymer having a monomer unit derived from glycidyl (meth)acrylate, a component (b): an epoxy resin, a component (c): a phenolic resin, a component (d): a curing accelerator, and a component (e): urea and/or a derivative thereof.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够形成印刷线路板的固化性树脂组合物，该印刷线路板在布线和基板之间表现出充分优异的粘合性，并且预浸料被充分抑制破裂或裂纹。＆lt; P＆gt;解决方案：印刷线路板用固化性树脂组合物包含成分（a）：具有来自（甲基）丙烯酸缩水甘油酯的单体单元的丙烯酸类聚合物，（b）成分：环氧树脂，）：酚醛树脂，组分（d）：固化促进剂和组分（e）：脲和/或其衍生物。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2006219664A Curable resin composition, prepreg, substrate, metal foil-clad laminated plate, metal foil with resin, and printed wiring board 审中-公开
标题翻译：可固化树脂组合物，PREPREG，基材，金属箔层压板，带树脂的金属箔和印刷线路板
公开(公告)号：JP2006219664A
公开(公告)日：2006-08-24
申请号：JP2006003819
申请日：2006-01-11
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , OBATA KAZUHITO , MATSUURA YOSHITSUGU , TANAKA MASASHI
IPC分类号： C08L63/00 , C08G59/62 , C08J5/24 , C08K5/00 , H01L23/14 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a curable resin composition capable of forming a printed wiring board exhibiting sufficient insulation reliability and a prepreg sufficiently suppressed in breakage or cracks.
SOLUTION: The curable resin composition for the printed wiring board comprises a component (a): an acrylic polymer having a monomer unit derived from glycidyl (meth)acrylate, a component (b): an epoxy resin, a component (c): a phenolic resin, a component (d): a curing accelerator, and a component (e): an antioxidant.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够形成表现出足够的绝缘可靠性的印刷线路板和能够充分抑制断裂或裂纹的预浸料的固化性树脂组合物。解决方案：印刷线路板用固化性树脂组合物包含成分（a）：具有来源于（甲基）丙烯酸缩水甘油酯的单体单元的丙烯酸类聚合物，（b）成分：环氧树脂，成分（c ）：酚醛树脂，组分（d）：固化促进剂和组分（e）：抗氧化剂。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006054443A Printed-circuit board 有权
标题翻译：印刷电路板
公开(公告)号：JP2006054443A
公开(公告)日：2006-02-23
申请号：JP2005204868
申请日：2005-07-13
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , TAKANO MARE , MASUDA KATSUYUKI , TANAKA MASASHI , OYAMA YUJI , MATSUURA YOSHITSUGU , HASHIMOTO KAZUAKI , KITAJIMA TAKAYO , OBATA KAZUHITO
IPC分类号： H05K1/02 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed-circuit board, superior in both size stability and heat-resisting properties and capable of allowing desired bending and high-density accommodation inside the chassis of an electronic device. SOLUTION: The printed-circuit board has a bending portion and at least one continuous insulating resin layer, including a fiber-based material, wherein a 180° bend is feasible, when the bending portion is bent at a desired position and the radius of curvature of the bending portion sizes at largest 1 mm, when the bending portion is bent. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种印刷电路板，其尺寸稳定性和耐热性都优异，并且能够允许电子设备的底盘内的期望的弯曲和高密度的容纳。解决方案：当弯曲部分弯曲到期望位置时，印刷电路板具有弯曲部分和至少一个连续的绝缘树脂层，包括纤维基材料，其中可弯曲180°，当弯曲部分弯曲时，弯曲部分的曲率半径最大为1mm。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005303243A Printed circuit board 有权
标题翻译：印刷电路板
公开(公告)号：JP2005303243A
公开(公告)日：2005-10-27
申请号：JP2004167742
申请日：2004-06-04
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKEUCHI KAZUMASA , TAKANO MARE , MASUDA KATSUYUKI , TANAKA MASASHI , OYAMA YUJI , MATSUURA YOSHITSUGU , HASHIMOTO KAZUAKI , KITAJIMA TAKAYO , OBATA KAZUHITO
IPC分类号： H05K1/02 , H05K7/14
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board which can be mounted in the inside of an electronic apparatus at a high density. SOLUTION: The printed circuit board includes a substrate composed of a fiber substrate and insulating resin layer impregnated into it and a printed circuit positioned one side or both sides, and can be mounted in the case, being folded. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供可以以高密度安装在电子设备内部的印刷电路板。解决方案：印刷电路板包括由纤维基板和浸渍在其中的绝缘树脂层构成的基板和位于一侧或两侧的印刷电路，并且可以安装在壳体中，被折叠。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2012054464A Multilayer printed wiring board, method of manufacturing the same, prepreg, metal foil with resin, resin film, and metal foil-clad laminate 有权
标题翻译：多层印刷线路板，其制造方法，PREPREG，具有树脂的金属箔，树脂膜和金属箔层压板
公开(公告)号：JP2012054464A
公开(公告)日：2012-03-15
申请号：JP2010196910
申请日：2010-09-02
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , IIJIMA TOSHIYUKI , TANAKA MASASHI , OBATA KAZUHITO , TAKEUCHI KAZUMASA
IPC分类号： H05K3/46 , C08J5/24
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of suppressing rising of a resistance value of an interlayer connection even if a bending part is provided to a region containing a through hole.SOLUTION: The multilayer printed wiring board includes a circuit board which includes a first insulating layer 100 comprising a cured resin originating from a first thermosetting resin, and a metal foil with a thickness of 1-35 μm arranged on both surfaces of the first insulating layer; and which is formed with a through hole 20 mutually connecting the metal foils arranged on both surfaces of a circuit layer 26 comprising the metal foil and the first insulating layer 100. The multilayer printed wiring board also includes a second insulating layer 200 which is provided at least on one surface of the circuit board, and has a thickness of 80 μm or less, comprising a cured resin originating from a second thermosetting resin which is at least one kind selected from a glycidyl acrylate resin and a polyamide imide resin. A bending part is provided to a region where the circuit board and the second insulating layer 200 are stacked.
摘要翻译：解决的问题：即使在包含通孔的区域设置弯曲部，也能够提供能够抑制层间连接的电阻值上升的多层印刷电路板。解决方案：多层印刷线路板包括电路板，该电路板包括第一绝缘层100，第一绝缘层100包括源自第一热固性树脂的固化树脂和布置在第二热固性树脂的两个表面上的厚度为1-35μm的金属箔第一绝缘层; 并且其形成有相互连接布置在包括金属箔的电路层26的两个表面上的金属箔和第一绝缘层100的通孔20.多层印刷线路板还包括第二绝缘层200，其设置在至少在电路板的一个表面上，并且具有80μm或更小的厚度，包括源自选自丙烯酸缩水甘油酯树脂和聚酰胺酰亚胺树脂中的至少一种的第二热固性树脂的固化树脂。将弯曲部设置在层叠电路基板和第二绝缘层200的区域。版权所有（C）2012，JPO＆INPIT

10. 发明专利

JP2012025161A Metal foil with resin 审中-公开
标题翻译：金属箔与树脂
公开(公告)号：JP2012025161A
公开(公告)日：2012-02-09
申请号：JP2011170438
申请日：2011-08-03
申请人： Hitachi Chem Co Ltd , 日立化成工業株式会社
发明人： TAKANO MARE , OBATA KAZUHITO , MATSUURA YOSHITSUGU , TANAKA MASASHI
IPC分类号： B32B15/092 , B32B15/08 , C08G59/40 , C08J5/24 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board having sufficient adhesiveness between wiring and a substrate and sufficient heat resistance and to provide metal foil with a resin using a curable resin composition which can form a prepreg having sufficiently suppressed breakages or cracks.SOLUTION: The metal foil with the resin includes a resin film comprising the curable resin composition and the metal foil arranged on at least one surface of the resin film. The curable resin composition contains a component (a): an acrylic polymer having a monomer unit derived from glycidyl (meth)acrylate, a component (b): an epoxy resin, a component (c): a phenolic resin, a component (d): a curing promotor, and a component (e): one or more thiol compounds selected from the group comprising alkyl thiols, phenyl thiols and thiol-based coupling agents.
摘要翻译：要解决的问题：提供一种印刷线路板，其在布线和基板之间具有足够的粘合性并具有足够的耐热性，并且可以使用可以形成具有充分抑制断裂或裂纹的预浸料的可固化树脂组合物来提供金属箔的树脂。解决方案：具有树脂的金属箔包括包含可固化树脂组合物和布置在树脂膜的至少一个表面上的金属箔的树脂膜。固化性树脂组合物含有成分（a）：具有源自（甲基）丙烯酸缩水甘油酯的单体单元的丙烯酸类聚合物，成分（b）：环氧树脂，（c）成分：酚醛树脂，成分（d ）：固化促进剂和组分（e）：一种或多种选自包括烷基硫醇，苯基硫醇和硫醇基偶联剂的硫醇化合物。版权所有（C）2012，JPO＆INPIT

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