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41. 发明申请

US20050258366A1 Scanning electron microscope and a method for adjusting a focal point of an electron beam of said scanning electron microscope 有权
标题翻译：扫描电子显微镜和用于调整所述扫描电子显微镜的电子束焦点的方法
公开(公告)号：US20050258366A1
公开(公告)日：2005-11-24
申请号：US11130121
申请日：2005-05-17
申请人： Toshifumi Honda , Munenori Fukunishi , Kenji Obara
发明人： Toshifumi Honda , Munenori Fukunishi , Kenji Obara
IPC分类号： H01J37/20 , G21K7/00 , H01J37/21
CPC分类号： H01J37/21 , H01J2237/216
摘要： In a scanning electron microscope, scanning region is set to be narrow, upon which focused electron beam is scanned, so that the focused electron beam can be irradiated at the almost same position by plural numbers of times, irrespective of movement of the stage or of moving of the stage during braking thereof, and upon that region to be scanned is irradiated the focused electron beam, by plural numbers of times, while changing the focal position, thereby forming an image thereof. From the image formed is calculated out a section, from which a focus-in position can be calculated out, and then the focus-in position is calculated out from that calculated section.
摘要翻译：在扫描电子显微镜中，扫描区域被设置为窄，扫描聚焦电子束，使得聚焦电子束可以几乎相同的位置被照射多次，而不管平台的移动或者是在改变焦点位置的同时，在聚焦电子束多次照射被扫描的区域的同时，在其制动期间移动舞台，从而形成其图像。从形成的图像中计算出可从其计算聚焦位置的部分，然后从该计算部分计算聚焦位置。

42. 发明授权

US06249598B1 Solder testing apparatus 失效
标题翻译：焊接试验装置
公开(公告)号：US06249598B1
公开(公告)日：2001-06-19
申请号：US08968125
申请日：1997-11-12
申请人： Toshifumi Honda , Yukio Matsuyama , Guenter Doemens , Peter Mengel , Ludwig Listl
发明人： Toshifumi Honda , Yukio Matsuyama , Guenter Doemens , Peter Mengel , Ludwig Listl
IPC分类号： G06K900
CPC分类号： G01R31/048 , G01R31/309
摘要： A solder testing apparatus comprising image processing means for performing image processing on an image of an appearance of a soldered portion to identify shape characterizing amounts for the soldered portion; and defect determining means for performing good/bad determination on the soldered portion from data derived by the image processing means and data from test parameter storing means for storing shape characterizing amounts at design time, wherein tested-object standard shape estimating means is included for extracting shape characterizing amounts of a non-defective soldered portion by statistically processing shape characterizing amounts for soldered portions identified by the image processing means, and defect determining parameters stored in the test parameter storing means are updated based on standard shape values from the tested-object standard shape estimating means, so that a highly reliable test is realized by setting defect determining parameters based on actual shapes and dimensions of leads and pads of electronic components on a printed circuit board.
摘要翻译：一种焊料测试装置，包括图像处理装置，用于对焊接部分的外观的图像进行图像处理，以识别焊接部分的形状特征量; 以及缺陷确定装置，用于根据由图像处理装置导出的数据对焊接部分进行良好/不良确定，以及用于在设计时存储形状特征量的测试参数存储装置的数据，其中包括用于提取的测试对象标准形状估计装置通过统计处理由图像处理装置识别的焊接部分的形状特征量的无缺陷焊接部分的形状特征量，以及存储在测试参数存储装置中的缺陷确定参数基于来自测试对象标准的标准形状值而被更新形状估计装置，使得通过基于印刷电路板上的电子部件的引线和焊盘的实际形状和尺寸设置缺陷确定参数来实现高度可靠的测试。

43. 发明授权

US09239283B2 Defect inspection method and device therefor 有权
标题翻译：缺陷检查方法及其设备
公开(公告)号：US09239283B2
公开(公告)日：2016-01-19
申请号：US13993888
申请日：2011-11-08
申请人： Toshifumi Honda , Yukihiro Shibata , Atsushi Taniguchi
发明人： Toshifumi Honda , Yukihiro Shibata , Atsushi Taniguchi
IPC分类号： G01N21/00 , G01N21/956 , G01N21/95 , G01N21/88
CPC分类号： G01N21/00 , G01N21/8851 , G01N21/9501 , G01N21/956 , G01N2021/8896
摘要： To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen.
摘要翻译：为了处理来自多个检测器的信号而不受基板高度的变化的影响，并且在基板上检测更多的微小缺陷，缺陷检查装置设置有具有多行光学传感器的光电转换器在第一和第二集光/检测单元中的每一个中的阵列，以及处理单元，用于处理来自第一和第二聚光/检测单元的检测信号，以确定第一和第二聚光/ 第二聚光/检测单元相对于试样的表面不对准，并且处理检测信号以校正第一和第二聚光/检测单元之间的未对准，并且校正的检测信号从第一和第二聚光/检测单元组合在一起以检测试样上的缺陷。

44. 发明授权

US08975582B2 Method and apparatus for reviewing defects 有权
标题翻译：检查缺陷的方法和装置
公开(公告)号：US08975582B2
公开(公告)日：2015-03-10
申请号：US13311734
申请日：2011-12-06
申请人： Hidetoshi Nishiyama , Toshifumi Honda , Sachio Uto
发明人： Hidetoshi Nishiyama , Toshifumi Honda , Sachio Uto
IPC分类号： G01N23/225 , G02B15/14 , G02B21/00 , H01J37/22 , H01J37/28 , H01K3/02
CPC分类号： G01N23/225 , G02B15/14 , G02B21/0016 , H01J37/226 , H01J37/28 , H01J2237/216 , H01J2237/2482 , H01J2237/2817 , H01K3/02
摘要： A method of inspecting defects of a sample on a movable table includes a first step for, on a basis of position information of the defects which is previously detected by an other inspection system, driving the table so that the defects come into a viewing field of an optical microscope having a focus which is adjusted, a second step for re-detecting the defects to obtain a first detection result, a third step for correcting the position information of defects on a basis of position information of the re-detected defects, and a fourth step for reviewing the defects whose position information is corrected to obtain a second detection result. At the second step, re-detecting is performed using reflection light or scattered light from the sample which passes an optical filter which includes a light shielding portion and a light transmitting portion.
摘要翻译：一种在可移动台上检查样本的缺陷的方法包括：第一步骤，用于基于先前由另一检查系统检测到的缺陷的位置信息来驱动该表，使得缺陷进入到具有调整焦点的光学显微镜，用于重新检测缺陷以获得第一检测结果的第二步骤，基于重新检测到的缺陷的位置信息来校正缺陷的位置信息的第三步骤，以及检查位置信息被校正以获得第二检测结果的缺陷的第四步骤。在第二步骤中，使用来自通过包括遮光部分和透光部分的滤光器的样品的反射光或散射光进行再检测。

45. 发明授权

US08970836B2 Defect inspecting apparatus and defect inspecting method 有权
标题翻译：缺陷检查装置和缺陷检查方法
公开(公告)号：US08970836B2
公开(公告)日：2015-03-03
申请号：US14235916
申请日：2012-05-14
申请人： Atsushi Taniguchi , Taketo Ueno , Shunichi Matsumoto , Yukihiro Shibata , Toshifumi Honda
发明人： Atsushi Taniguchi , Taketo Ueno , Shunichi Matsumoto , Yukihiro Shibata , Toshifumi Honda
IPC分类号： G01N21/00 , G01N21/95 , G01N21/956 , G01N21/21 , G01N21/88 , G01B11/06
CPC分类号： G01N21/95 , G01B11/0641 , G01N21/211 , G01N21/9501 , G01N21/95607 , G01N21/95623 , G01N2021/8822 , G01N2021/9513 , G02F1/1303 , G02F1/136259
摘要： An invention being applied is a defect detecting apparatus that has: an illuminating optical system with a laser light source for irradiating a sample on whose surface a pattern is formed with light; a detecting optical system with a sensor for detecting light generated from the sample illuminated by the illuminating optical system; and a signal processing unit that extracts a defect from an image based on the light detected by the detecting optical system, in which an amplification rate of the sensor is dynamically changed during a time when the light is detected by the detecting optical system.
摘要翻译：一种应用的发明是一种缺陷检测装置，其具有：具有激光光源的照明光学系统，用于对其表面形成有图案的样品进行照射; 检测光学系统，其具有用于检测由照明光学系统照射的样本产生的光的传感器; 以及信号处理单元，其基于由检测光学系统检测到的光的时间期间传感器的放大率动态地改变的检测光学系统检测到的光，从图像中提取缺陷。

46. 发明授权

US08908172B2 Defect inspection device and method of inspecting defect 有权
标题翻译：缺陷检查装置及缺陷检查方法
公开(公告)号：US08908172B2
公开(公告)日：2014-12-09
申请号：US13575050
申请日：2011-02-09
申请人： Takahiro Urano , Toshifumi Honda
发明人： Takahiro Urano , Toshifumi Honda
IPC分类号： G01N21/00 , G01N21/95
CPC分类号： G01N21/9501
摘要： Disclosed is a defect inspection device comprising: an illumination optical portion which illuminates an object to be inspected with illuminating light; a detection optical portion system illuminated by the illumination optical portion and provided with a plurality of detectors which respectively detects components of scattering light which scatter from the inspected object each in a different direction of azimuthal angle or in a different direction of angle of elevation with respect to a surface of the inspected object; and a signal processing portion which makes gain adjustments and defect decisions in parallel on plural signals based on the components of the scattering light from the inspected object detected by the detectors, respectively, the defect decisions being based on a threshold value decision, and which extracts defects based on results of the gain adjustments and of the defect decisions.
摘要翻译：公开了一种缺陷检查装置，包括：照明光学部，其利用照明光照射被检查物体; 由照明光学部分照射的检测光学部分系统，并且设置有多个检测器，其分别检测沿着方位角的不同方向或与不同的仰角方向相对地从被检查物体散射的散射光的分量到被检查物体的表面; 以及信号处理部分，分别基于由检测器检测到的来自被检查对象的散射光的分量，对多个信号并行地进行增益调整和缺陷判定，所述缺陷判定基于阈值判定，并且提取基于增益调整结果和缺陷决定的缺陷。

47. 发明申请

US20130329227A1 OPTICAL INSPECTION METHOD AND OPTICAL INSPECTION APPARATUS 有权
标题翻译：光学检测方法和光学检测装置
公开(公告)号：US20130329227A1
公开(公告)日：2013-12-12
申请号：US13983077
申请日：2011-12-20
申请人： Kenji Nakahira , Toshifumi Honda , Toshihiko Nakata
发明人： Kenji Nakahira , Toshifumi Honda , Toshihiko Nakata
IPC分类号： G01N21/88
CPC分类号： G01N21/88 , G01N21/9501 , G01N21/956 , G01N2021/8835
摘要： An optical inspection apparatus is provided which suppresses the influence of quantum noise including: light irradiator which irradiates a sample with light; reference light emitter which emits reference light; light interference unit which generates interfering light through interference between transmitted light, scattered light, or reflected light from the sample irradiated with light by the light irradiator, and the reference light emitted by the reference light emitter; light detector which detects the interfering light generated by the light interference unit; defect identifier which identifies the presence or absence of a defect based on a detection signal obtained by the light detector detecting the interfering light; and light convertor which converts at least the state of the transmitted, scattered, or reflected light from the sample, the state of the reference light emitted by the reference light emitter, or the state of the interfering light generated by the light interference unit.
摘要翻译：提供抑制量子噪声影响的光学检查装置，包括：用光照射样品的光照射器; 发射参考光的参考光发射器; 光干涉单元，其通过光照射器照射的样品的透射光，散射光或反射光之间的干涉产生干涉光，以及由参考光发射器发射的参考光; 光检测器，其检测由光干涉单元产生的干涉光; 缺陷识别器，其基于由所述光检测器检测到所述干扰光获得的检测信号来识别缺陷的存在或不存在; 以及光转换器，其至少转换来自样品的透射，散射或反射光的状态，由参考光发射器发射的参考光的状态或由光干涉单元产生的干涉光的状态。

48. 发明授权

US08547429B2 Apparatus and method for monitoring semiconductor device manufacturing process 有权
标题翻译：用于监测半导体器件制造工艺的装置和方法
公开(公告)号：US08547429B2
公开(公告)日：2013-10-01
申请号：US12379645
申请日：2009-02-26
申请人： Toshifumi Honda , Yuuji Takagi
发明人： Toshifumi Honda , Yuuji Takagi
IPC分类号： H04N5/253 , G06K9/00
CPC分类号： G06T7/0006 , G06T2207/10061 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A hotspot searching apparatus manufactures a small number of chips or regions on a semiconductor wafer under respectively different manufacturing process conditions, compares SEM images of their external appearances to output a point having large differences as a narrow process window, that is, a process monitoring point that should be managed in mass production, the narrow process window having a narrow manufacturing process condition (exposure condition) in the manufacturing of the semiconductor wafer, and sets the point as a measurement point by a CD-SEM apparatus, such that it extracts and determines plural circuit pattern parts having a narrow manufacturing process margin as the process monitoring point in a short time and a process monitoring point monitoring performs shape inspection or shape length measurement in detail at high resolution.
摘要翻译：热点搜索装置分别在不同的制造工艺条件下制造半导体晶片上的少量芯片或区域，比较其外观的SEM图像以输出具有较大差异的点作为窄工艺窗口，即处理监视点应在大规模生产中进行管理，在半导体晶片的制造中具有窄制造工艺条件（曝光条件）的窄工艺窗口，并且通过CD-SEM装置将点设定为测量点，使得其提取和在短时间内确定具有窄制造工艺余量的多个电路图形部分作为处理监视点，并且处理监视点监视以高分辨率详细地进行形状检查或形状长度测量。

49. 发明授权

US08509516B2 Circuit pattern examining apparatus and circuit pattern examining method 有权
标题翻译：电路图案检查装置及电路图案检查方法
公开(公告)号：US08509516B2
公开(公告)日：2013-08-13
申请号：US13056046
申请日：2009-07-13
申请人： Takashi Hiroi , Takeyuki Yoshida , Naoki Hosoya , Toshifumi Honda
发明人： Takashi Hiroi , Takeyuki Yoshida , Naoki Hosoya , Toshifumi Honda
IPC分类号： G06K9/00
CPC分类号： G01N21/9501 , G01N21/95607 , G06T7/001 , G06T2207/10061 , G06T2207/30148 , H01L22/12
摘要： Provided is an examination technique to detect defects with high sensitivity at an outer-most repetitive portion of a memory mat of a semiconductor device and even in a peripheral circuit having no repetitiveness.A circuit pattern inspection apparatus comprises an image detection unit for acquiring an image of a circuit pattern composed of multiple die having a repetitive pattern, a defect judgment unit which composes, in respect of an acquired detected image, reference images by switching addition objectives depending on regions of repetitive pattern and the other regions and compares a composed reference image with the detected image to detect a defect, and a display unit for displaying the image of the detected defect.
摘要翻译：提供了一种检测技术，用于在半导体器件的存储器垫的最外侧重复部分以及甚至在不具有重复性的外围电路中检测高灵敏度的缺陷。电路图案检查装置包括：图像检测单元，用于获取由具有重复图案的多个模具组成的电路图案的图像;缺陷判断单元，其针对所获取的检测图像构成参考图像，其根据重复图案的区域和其他区域，并且将组合的参考图像与检测到的图像进行比较以检测缺陷;以及显示单元，用于显示检测到的缺陷的图像。

50. 发明申请

US20130070078A1 METHOD AND DEVICE FOR TESTING DEFECT USING SEM 有权
标题翻译：使用SEM测试缺陷的方法和装置
公开(公告)号：US20130070078A1
公开(公告)日：2013-03-21
申请号：US13520210
申请日：2010-12-22
申请人： Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
发明人： Yuji Takagi , Minoru Harada , Ryo Nakagaki , Naoki Hosoya , Toshifumi Honda , Takehiro Hirai
IPC分类号： H04N7/18
CPC分类号： G06T7/001 , G06T2207/10061 , G06T2207/20081 , G06T2207/30148 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： In performing a programmed-point inspection of a circuit pattern using a review SEM, stable inspection can be performed while suppressing the generation of a false report even when a variation in a circuit pattern to be inspected is large. SEM images that are obtained by sequentially imaging a predetermined circuit pattern using the review SEM are stored into a storage unit. Images that meet a set condition are selected from the stored SEM images, and averaged to create an average image (GP image). By performing pattern check by GP comparison using this GP image, an inspection can be performed while suppressing the generation of a false report even when a variation in the circuit patterns is large.
摘要翻译：在使用复查SEM执行电路图案的编程点检查时，即使在要检查的电路图案的变化大的情况下，也可以抑制误报的产生而进行稳定的检查。通过使用评价SEM将预定电路图案顺序成像获得的SEM图像存储在存储单元中。从存储的SEM图像中选择满足设定条件的图像，并平均以创建平均图像（GP图像）。通过使用该GP图像通过GP比较进行模式检查，即使当电路图案的变化大时也可以在抑制伪报告的产生的同时执行检查。

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