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    • 4. 发明授权
    • Method and apparatus for reviewing defects
    • 检查缺陷的方法和装置
    • US08093557B2
    • 2012-01-10
    • US12573479
    • 2009-10-05
    • Hidetoshi NishiyamaToshifumi HondaSachio Uto
    • Hidetoshi NishiyamaToshifumi HondaSachio Uto
    • G01N23/00
    • G01N23/225G02B15/14G02B21/0016H01J37/226H01J37/28H01J2237/216H01J2237/2482H01J2237/2817H01K3/02
    • A method of inspecting defects of a sample includes a first step for, on a basis of position information of defects on a sample placed on a movable table which is previously detected and obtained by an other inspection system, driving the table so that the defects come into a viewing field of an optical microscope having a focus which is adjusted, a second step for re-detecting the defects to obtain a first detection result, a third step for correcting the position information of defects on a basis of position information of defects re-detected of the first detection result, and a fourth step for reviewing the defects whose position information is corrected to obtain a second detection result. The method includes classifying types of defects on basis of the first detection result and the second detection result.
    • 检查样本缺陷的方法包括:第一步骤,基于放置在可移动台上的样本上的缺陷的位置信息,该样本预先由另一检查系统检测并获得,驱动所述台,使得缺陷到达 进入具有调整焦点的光学显微镜的观察区域,第二步骤,用于重新检测缺陷以获得第一检测结果;第三步骤,基于缺陷的位置信息来校正缺陷的位置信息 - 检测到第一检测结果,以及第四步骤,用于检查其位置信息被校正以获得第二检测结果的缺陷。 该方法包括基于第一检测结果和第二检测结果对缺陷的类型进行分类。
    • 6. 发明授权
    • Apparatus and method for inspecting defect on object surface
    • 检测物体表面缺陷的装置和方法
    • US08482728B2
    • 2013-07-09
    • US12244958
    • 2008-10-03
    • Sachio UtoHidetoshi NishiyamaMinori Noguchi
    • Sachio UtoHidetoshi NishiyamaMinori Noguchi
    • G01N21/00
    • H01L21/02334B08B6/00G01B11/0625G01B11/303G01N3/04G01N21/15G01N21/94G01N21/9501G01N21/95623G01N2021/9563H01L21/02057H01L21/02082
    • An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. In a foreign matter anti-adhesive means 180, a transparent plate 187 is placed on a placement table 34 through a frame 185. In the foreign matter anti-adhesive means 180, a shaft 181 which is rotatably supported by two columnar supports 184 fixed onto a base 186 is coupled to a motor 182 by a coupling 183. The shaft 181 is inserted into a part of a frame 185 between the two columnar supports 184 such that the frame 185 and the transparent plate 187 are turnable about the shaft 181. Therefore, the whole of the frame 185 is opened and closed in a Z-direction about the shaft 181, and a wafer 1 on the placement table 34 can be covered with the frame 185 and the transparent plate 187.
    • 本发明的一个方面提供了一种缺陷检查装置,其能够精确地检查混合有重复图案和非重复图案的检查对象基板的高速微细异物或缺陷。 在异物防粘连装置180中,通过框架185将透明板187放置在放置台34上。在异物防粘装置180中,轴181可旋转地由两个柱状支撑件184支撑固定到 基座186通过联轴器183联接到马达18.轴181插入到两个柱状支撑件184之间的框架185的一部分中,使得框架185和透明板187围绕轴181可转动。因此 ,整个框架185围绕轴181沿Z方向打开和关闭,并且放置台34上的晶片1可以被框架185和透明板187覆盖。
    • 8. 发明申请
    • PATTERN DEFECT INSPECTING APPARATUS AND METHOD
    • 图案缺陷检查装置及方法
    • US20110221886A1
    • 2011-09-15
    • US13059908
    • 2009-07-08
    • Hidetoshi NishiyamaMasaaki ItoSachio UtoKei Shimura
    • Hidetoshi NishiyamaMasaaki ItoSachio UtoKei Shimura
    • H04N7/18
    • G01N21/956G01N21/94H01L22/12
    • In recent years, a wafer inspection time in semiconductor manufacturing processes is being required to be reduced for reduction in manufacturing time and for early detection of yield reduction factors. To meet this requirement, there is a need to reduce the time required for inspection parameter setup, as well as the time actually required for inspection. Based on the speed or position change information relating to a transport system 2, inspection is also conducted during acceleration/deceleration of the transport system 2 by controlling an accumulation time and/or operational speed of a detector or by correcting acquired images. Alternate display of review images of a detection region at fixed time intervals improves visibility of the detection region and makes it possible to confirm within a short time whether a defect is present.
    • 近年来,为了减少制造时间和减少因素的早期检测,需要减少半导体制造工序中的晶片检查时间。 为了满足这一要求,需要减少检查参数设置所需的时间以及检查所需的时间。 基于与运输系统2有关的速度或位置变化信息,通过控制检测器的累积时间和/或操作速度或通过校正所获取的图像,也可以在运输系统2的加速/减速期间进行检查。 以固定的时间间隔交替显示检测区域的检查图像提高了检测区域的可视性,并且使得可以在短时间内确认是否存在缺陷。
    • 9. 发明申请
    • APPARATUS AND METHOD FOR INSPECTING AN OBJECT SURFACE DEFECT
    • 用于检查物体表面缺陷的装置和方法
    • US20110141272A1
    • 2011-06-16
    • US13059523
    • 2009-07-10
    • Sachio UtoHidetoshi NishiyamaKei ShimuraMasaaki Ito
    • Sachio UtoHidetoshi NishiyamaKei ShimuraMasaaki Ito
    • H04N7/18G01N21/956
    • G01N21/95607G01N21/94G01N21/9501
    • Disclosed is an apparatus having a light source of a deep ultraviolet ray for detecting a small foreign matter or pattern defect, which may arise during a process for manufacturing a semiconductor device or the like, in high resolution. The apparatus comprises a means for detecting a damage on an optical system due to a wavelength reduction thereby to save a damaged portion, and a means for comparing an optical system arrangement with that at the manufacturing time and detecting the abnormality thereof, to thereby make a correction, so that the apparatus can inspect the defect on an object substrate stably at a high speed and in high sensitivity. Also disclosed is a method for the stable inspection. The apparatus is provided, in the optical path of the optical system, with a means for detecting the intensity and the convergent state of an illumination light, and a means for detecting the abnormality of the optics system and for saving an abnormal portion from alignment with an optical axis. The apparatus is constituted such that the optical system is adjusted to make corrections for the optical conditions at the manufacturing time, thereby to elongate the lifetime of the optical system in the inspecting apparatus and to detect the small defect stably.
    • 公开了一种具有用于检测在高分辨率的半导体器件等的制造工艺期间可能出现的小异物或图案缺陷的深紫外线光源的装置。 该装置包括用于检测由于波长减小而导致的光学系统的损坏从而节省损坏部分的装置,以及用于将光学系统布置与制造时间布置进行比较并检测其异常的装置,从而使 校正,使得设备可以高速和高灵敏度稳定地检查对象基板上的缺陷。 还公开了用于稳定检查的方法。 该装置在光学系统的光路中设置有用于检测照明光的强度和收敛状态的装置,以及用于检测光学系统的异常并且用于保存异常部分与对准的装置 光轴。 该装置被构造成使得光学系统被调整以对制造时的光学条件进行校正,从而延长了检查装置中的光学系统的寿命并且稳定地检测小缺陷。
    • 10. 发明授权
    • Pattern defect inspection apparatus and method
    • 图案缺陷检查装置及方法
    • US07746453B2
    • 2010-06-29
    • US12113781
    • 2008-05-01
    • Hidetoshi NishiyamaKei ShimuraSachio UtoMinori Noguchi
    • Hidetoshi NishiyamaKei ShimuraSachio UtoMinori Noguchi
    • G01N21/00
    • G01N21/95607G01N21/94G01N21/9501G01N2021/4711
    • A pattern defect inspection apparatus capable of detecting minute defects on a sample with high sensitivity without generating speckle noise in signals is realized. Substantially the same region on a surface of a wafer is detected by using two detectors at mutually different timings. Output signals from the two detectors are summed and averaged to eliminate noise. Since a large number of rays of illumination light are not simultaneously irradiated to the same region on the wafer, a pattern defect inspection apparatus capable of suppressing noise resulting from interference of a large number of rays, eliminating noise owing to other causes and detecting with high sensitivity minute defects on the sample without the occurrence of speckle noise in the signal can be accomplished.
    • 实现能够以高灵敏度检测样品上的微小缺陷而不产生信号中的斑点噪声的图案缺陷检查装置。 通过在相互不同的定时使用两个检测器来检测晶片表面上的基本上相同的区域。 来自两个检测器的输出信号被相加和平均以消除噪声。 由于大量的照明光线不能同时照射到晶片上的相同区域,所以能够抑制由于大量光线的干扰而产生的噪声的图案缺陷检查装置,消除由于其它原因引起的噪声和高检测 可以实现样品上的灵敏度微小缺陷,而不会在信号中发生斑点噪声。