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    • 43. 发明授权
    • Semiconductor structure pattern formation
    • 半导体结构图形形成
    • US07829447B2
    • 2010-11-09
    • US11419304
    • 2006-05-19
    • Leo MathewRode R. MoraTab A. StephensTien Ying Luo
    • Leo MathewRode R. MoraTab A. StephensTien Ying Luo
    • H01L21/22H01L21/38
    • H01L29/785H01L29/66795Y10S438/942
    • Forming structures such as fins in a semiconductor layer according to a pattern formed by oxidizing a sidewall of a layer of oxidizable material. In one embodiment, source/drain pattern structures and a fin pattern structures are patterned in the oxidizable layer. The fin pattern structure is then masked from an oxidation process that grows oxide on the sidewalls of the channel pattern structure and the top surface of the source/drain pattern structures. The remaining oxidizable material of the channel pattern structure is subsequently removed leaving a hole between two portions of the oxide layer. These two portions are used in one embodiment as a mask for patterning the semiconductor layer to form two fins. This patterning also leaves the source/drain structures connected to the fins.
    • 根据通过氧化可氧化材料层的侧壁形成的图案在半导体层中形成诸如翅片的结构。 在一个实施例中,在可氧化层中图案化源极/漏极图案结构和鳍状图案结构。 然后从在沟道图案结构的侧壁和源极/漏极图案结构的顶表面上生长氧化物的氧化过程掩蔽鳍状图案结构。 随后去除沟道图案结构的剩余可氧化材料,留下氧化物层的两个部分之间的孔。 这两个部分在一个实施例中用作用于图案化半导体层以形成两个散热片的掩模。 该图案化还使得源极/漏极结构连接到鳍片。
    • 46. 发明授权
    • Asymmetric spacers and asymmetric source/drain extension layers
    • 非对称隔离层和不对称源极/漏极延伸层
    • US07585735B2
    • 2009-09-08
    • US11047946
    • 2005-02-01
    • Leo MathewYang DuBich-Yen NguyenVoon-Yew Thean
    • Leo MathewYang DuBich-Yen NguyenVoon-Yew Thean
    • H01L21/8234
    • H01L29/4983H01L29/165H01L29/517H01L29/665H01L29/6653H01L29/6656H01L29/66628H01L29/66659H01L29/7843
    • A method of forming a semiconductor device is provided in which a substrate (102) is provided which has a gate dielectric layer (106) disposed thereon, and a gate electrode (116) having first and second sidewalls is formed over the gate dielectric layer. First (146) and second (150) extension spacer structures are formed adjacent the first and second sidewalls, respectively. In the resulting device: (a) the first and second extension spacer structures have different dimensions; (b) the first and second extension spacer structures comprise first and second distinct materials; (c) the device has asymmetric source/drain extensions (162); and/or (d) the device has an oxide layer (160) disposed between the first extension spacer structure and the gate electrode, and either (i) the device has no dielectric layer disposed between the second extension spacer structure and the gate electrode, or (ii) the device has a second dielectric layer disposed between the second extension spacer structure and the gate electrode, and the first dielectric layer is substantially thicker than the second dielectric layer.
    • 提供一种形成半导体器件的方法,其中设置有其上设置有栅介质层(106)的衬底(102),并且在栅极介电层上形成具有第一和第二侧壁的栅电极(116)。 分别在第一和第二侧壁附近形成第一(146)和第二(150)延伸间隔结构。 在所得装置中:(a)第一和第二延伸间隔结构具有不同的尺寸; (b)第一和第二延伸间隔结构包括第一和第二不同材料; (c)该器件具有不对称的源极/漏极延伸部分(162); 和/或(d)所述器件具有设置在所述第一延伸间隔物结构和所述栅电极之间的氧化物层(160),以及(i)所述器件在所述第二延伸间隔物结构和所述栅电极之间没有设置介电层, 或者(ii)该器件具有设置在第二延伸间隔物结构和栅极之间的第二介电层,并且第一介电层基本上比第二介电层更厚。
    • 47. 发明授权
    • Electronic device including a semiconductor fin having a plurality of gate electrodes and a process for forming the electronic device
    • 形成包括具有多个栅电极的半导体鳍片的电子器件的工艺
    • US07566623B2
    • 2009-07-28
    • US11670833
    • 2007-02-02
    • Leo MathewBrian J. GoolsbyTab A. Stephens
    • Leo MathewBrian J. GoolsbyTab A. Stephens
    • H01L21/336
    • H01L29/785H01L29/66795
    • An electronic device can include a semiconductor fin with a first gate electrode adjacent to a first wall, and a second gate electrode adjacent to a second wall. In one embodiment, a conductive member can be formed overlying the semiconductor fin, and a portion of the conductive member can be reacted to form the first and second gate electrodes. In another embodiment, a patterned masking layer can be formed including a masking member over a gate electrode layer, and portion of the masking member overlying the semiconductor fin can be removed. In still another embodiment, a first fin-type transistor structure can include the semiconductor fin, the first and second gate electrodes, and a first insulating cap. The electronic device can also include a second fin-type transistor structure having a second insulating cap thicker than the first insulating cap.
    • 电子设备可以包括具有与第一壁相邻的第一栅电极和与第二壁相邻的第二栅电极的半导体鳍。 在一个实施例中,可以形成覆盖半导体鳍片的导电构件,并且导电构件的一部分可以反应以形成第一和第二栅电极。 在另一个实施例中,可以形成图案化掩模层,其包括在栅极电极层上的掩模构件,并且可以去除覆盖在半导体鳍片上的掩蔽构件的部分。 在另一个实施例中,第一鳍式晶体管结构可以包括半导体鳍片,第一和第二栅电极以及第一绝缘帽。 电子器件还可以包括具有比第一绝缘盖更厚的第二绝缘帽的第二鳍式晶体管结构。
    • 48. 发明授权
    • Semiconductor optical devices and method for forming
    • 半导体光学器件及其形成方法
    • US07494832B2
    • 2009-02-24
    • US11465402
    • 2006-08-17
    • Leo MathewYang DuVoon-Yew Thean
    • Leo MathewYang DuVoon-Yew Thean
    • H01L21/00
    • H01S5/0262B82Y20/00H01L27/14643H01L27/14687H01L29/66803H01L29/785H01L31/0384H01L31/105H01L33/08H01L33/18H01L33/24H01S3/169H01S5/0261H01S5/0421H01S5/0425H01S5/2205H01S5/304Y10S977/95
    • A semiconductor optical device includes an insulating layer, a photoelectric region formed on the insulating layer, a first electrode having a first conductivity type formed on the insulating layer and contacting a first side of the photoelectric region, and a second electrode having a second conductivity type formed on the insulating layer and contacting a second side of the photoelectric region. The photoelectric region may include nanoclusters or porous silicon such that the device operates as a light emitting device. Alternatively, the photoelectric region may include an intrinsic semiconductor material such that the device operates as a light sensing device. The semiconductor optical device may be further characterized as a vertical optical device. In one embodiment, different types of optical devices, including light emitting and light sensing devices, may be integrated together. The optical devices may also be integrated with other types of semiconductor devices, such as vertical field-effect transistors.
    • 半导体光学器件包括绝缘层,形成在绝缘层上的光电区域,形成在绝缘层上并与光电区域的第一侧接触的具有第一导电类型的第一电极和具有第二导电类型的第二电极 形成在绝缘层上并与光电区域的第二面接触。 光电区域可以包括纳米团簇或多孔硅,使得该器件作为发光器件工作。 或者,光电区域可以包括本征半导体材料,使得该器件作为光感测装置工作。 半导体光学器件可以被进一步表征为垂直光学器件。 在一个实施例中,包括发光和光感测装置的不同类型的光学装置可以集成在一起。 光学器件还可以与诸如垂​​直场效应晶体管的其它类型的半导体器件集成。
    • 49. 发明申请
    • FINFET MEMORY CELL HAVING A FLOATING GATE AND METHOD THEREFOR
    • 具有浮动门的FINFET存储单元及其方法
    • US20090039420A1
    • 2009-02-12
    • US11835548
    • 2007-08-08
    • Vishal P. TrivediLeo Mathew
    • Vishal P. TrivediLeo Mathew
    • H01L29/78H01L21/336
    • H01L21/28273H01L29/66795H01L29/66825H01L29/785H01L29/7881
    • A fin field effect transistor (FinFET) memory cell and method of formation has a substrate for providing mechanical support. A first dielectric layer overlies the substrate. A fin structure overlies the dielectric layer and has a first current electrode and a second current electrode separated by a channel. A floating gate has a vertical portion that is adjacent to and electrically insulated from a side of the channel and has a horizontal portion overlying the first dielectric layer and extending laterally away from the channel. The floating gate stores electrical charge. A second dielectric layer is adjacent the floating gate. A control gate adjacent the second dielectric layer and physically separated from the floating gate by the second dielectric layer. The “L-shape” of the floating gate enhances capacitive coupling ratio between the control gate and the floating gate.
    • 鳍状场效应晶体管(FinFET)存储单元和形成方法具有用于提供机械支撑的基板。 第一电介质层覆盖在衬底上。 翅片结构覆盖在电介质层上,并具有由通道分开的第一电流电极和第二电流电极。 浮动栅极具有与沟道的一侧相邻且电绝缘的垂直部分,并且具有覆盖第一介电层并横向延伸离开通道的水平部分。 浮动门存储电荷。 第二电介质层与浮动栅极相邻。 与第二电介质层相邻并且通过第二电介质层物理地与浮置栅极隔离的控制栅极。 浮栅的“L”形增加了控制栅和浮栅之间的电容耦合比。