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    • 31. 发明申请
    • Electrostatic chuck for track thermal plates
    • 轨道热板用静电吸盘
    • US20060238954A1
    • 2006-10-26
    • US11153974
    • 2005-06-15
    • Tetsuya IshikawaBrian Lue
    • Tetsuya IshikawaBrian Lue
    • H01H1/00
    • H02N13/00H01L21/67103H01L21/6831
    • A chuck for a semiconductor workpiece features integrated resistive heating and electrostatic bipolar chucking elements on a thermal pedestal. These integrated heating and chucking elements maintain wafer flatness, as well as uniformity of an underlying gap accommodating a thermal gas between the workpiece and the chuck. In accordance with one embodiment of the present invention, a laminated Kapton wafer heater is attached to the top of the thermal surface, under the wafer: At least two electrical voltage zones are isolated within the heater, in order to create a chucking force between the chuck and the wafer without having to contact the wafer with an electrical conductor. These voltage zones can be created by using separate conducting elements as well as by imposing a DC bias on zones including the resistive heating elements.
    • 用于半导体工件的卡盘在热基座上具有集成的电阻加热和静电双极夹紧元件。 这些集成的加热和夹紧元件保持晶圆平坦度,以及在工件和卡盘之间容纳热气体的底部间隙的均匀性。 根据本发明的一个实施例,层压的Kapton晶片加热器附着在晶片下面的热表面的顶部:至少两个电压区在加热器内隔离,以便在加热器之间产生夹紧力 卡盘和晶片,而不必与电导体接触晶片。 这些电压区可以通过使用分离的导电元件以及通过在包括电阻加热元件的区域上施加DC偏压来产生。
    • 32. 发明申请
    • Capacitively coupled plasma reactor with magnetic plasma control
    • 具有磁等离子体控制的电容耦合等离子体反应器
    • US20060157201A1
    • 2006-07-20
    • US11360944
    • 2006-02-23
    • Daniel HoffmanMatthew MillerJang YangHeeyeop ChaeMichael BarnesTetsuya IshikawaYan Ye
    • Daniel HoffmanMatthew MillerJang YangHeeyeop ChaeMichael BarnesTetsuya IshikawaYan Ye
    • C23F1/00
    • H01J37/32091H01J37/3244H01J37/32623H01J37/3266
    • A plasma reactor includes a vacuum enclosure including a side wall and a ceiling defining a vacuum chamber, and a workpiece support within the chamber and facing the ceiling for supporting a planar workpiece, the workpiece support and the ceiling together defining a processing region between the workpiece support and the ceiling. Process gas inlets furnish a process gas into the chamber. A plasma source power electrode is connected to an RF power generator for capacitively coupling plasma source power into the chamber for maintaining a plasma within the chamber. The reactor further includes at least a first overhead solenoidal electromagnet adjacent the ceiling, the overhead solenoidal electromagnet, the ceiling, the side wall and the workpiece support being located along a common axis of symmetry. A current source is connected to the first solenoidal electromagnet and furnishes a first electric current in the first solenoidal electromagnet whereby to generate within the chamber a magnetic field which is a function of the first electric current, the first electric current having a value such that the magnetic field increases uniformity of plasma ion density radial distribution about the axis of symmetry near a surface of the workpiece support.
    • 等离子体反应器包括真空外壳,其包括限定真空室的侧壁和顶板,以及腔室内的工件支撑件,并面向天花板以支撑平面工件,工件支撑件和天花板一起限定了工件之间的加工区域 支持和天花板。 工艺气体入口将工艺气体提供到腔室中。 等离子体源功率电极连接到RF功率发生器,用于将等离子体源功率电容耦合到腔室中,以在腔室内维持等离子体。 反应器还包括至少第一架空螺线管电磁体,靠近天花板,架空螺线管电磁体,天花板,侧壁和工件支撑件沿着共同的对称轴线定位。 电流源连接到第一螺线管电磁体并且在第一螺线管电磁体中提供第一电流,从而在腔室内产生与第一电流有关的磁场,第一电流具有使得 磁场增加等离子体离子密度在工件支撑表面附近的对称轴的径向分布的均匀性。
    • 38. 发明授权
    • Capacitively coupled plasma reactor with magnetic plasma control
    • 具有磁等离子体控制的电容耦合等离子体反应器
    • US06853141B2
    • 2005-02-08
    • US10192271
    • 2002-07-09
    • Daniel J. HoffmanMatthew L. MillerJang Gyoo YangHeeyeop ChaeMichael BarnesTetsuya IshikawaYan Ye
    • Daniel J. HoffmanMatthew L. MillerJang Gyoo YangHeeyeop ChaeMichael BarnesTetsuya IshikawaYan Ye
    • H05H1/46H01J27/16H01J37/08H01J37/32H01L21/3065H01J7/24
    • H01J37/32091H01J37/3244H01J37/32623H01J37/3266
    • A plasma reactor includes a vacuum enclosure including a side wall and a ceiling defining a vacuum chamber, and a workpiece support within the chamber and facing the ceiling for supporting a planar workpiece, the workpiece support and the ceiling together defining a processing region between the workpiece support and the ceiling. Process gas inlets furnish a process gas into the chamber. A plasma source power electrode is connected to an RF power generator for capacitively coupling plasma source power into the chamber for maintaining a plasma within the chamber. The reactor further includes at least a first overhead solenoidal electromagnet adjacent the ceiling, the overhead solenoidal electromagnet, the ceiling, the sidewall and the workpiece support being located along a common axis of symmetry. A current source is connected to the first solenoidal electromagnet and furnishes a first electric current in the first solenoidal electromagnet whereby to generate within the chamber a magnetic field which is a function of the first electric current, the first electric current having a value such that the magnetic field increases uniformity of plasma ion density radial distribution about the axis of symmetry near a surface of the workpiece support.
    • 等离子体反应器包括真空外壳,其包括限定真空室的侧壁和顶板,以及腔室内的工件支撑件,并面向天花板以支撑平面工件,工件支撑件和天花板一起限定了工件之间的加工区域 支持和天花板。 工艺气体入口将工艺气体提供到腔室中。 等离子体源功率电极连接到RF功率发生器,用于将等离子体源功率电容耦合到腔室中,以在腔室内维持等离子体。 所述反应器还包括至少邻近所述天花板的顶部螺线管电磁体,所述架空螺线管电磁体,所述天花板,所述侧壁和所述工件支撑件沿着公共对称轴线定位。 电流源连接到第一螺线管电磁体并且在第一螺线管电磁体中提供第一电流,从而在腔室内产生与第一电流有关的磁场,第一电流具有使得 磁场增加等离子体离子密度在工件支撑表面附近的对称轴的径向分布的均匀性。