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    • 34. 发明申请
    • DIAMOND-LIKE CARBON (DLC) HARDMASK AND METHODS OF FABRICATION USING SAME
    • 类金刚石(DLC)HARDMASK及其制造方法
    • US20090184091A1
    • 2009-07-23
    • US12018084
    • 2008-01-22
    • Yi Zheng
    • Yi Zheng
    • B44C1/22
    • G11B5/3116G11B5/3163
    • A method according to one embodiment comprises forming a thin film layer; forming a hardmask layer above the thin film layer, the hardmask layer comprising laminated layers of diamond-like carbon; removing a portion of the hardmask layer; and removing a portion of the thin film layer that is unprotected by the hardmask layer. A method according to another embodiment comprises forming a thin film layer; forming a patterned hardmask layer above the thin film layer, the hardmask layer comprising laminated layers of diamond-like carbon; and implanting a material into a portion of the thin film layer that is unprotected by the patterned hardmask layer. Additional methods are disclosed.
    • 根据一个实施方案的方法包括形成薄膜层; 在所述薄膜层上形成硬掩模层,所述硬掩模层包括类金刚石碳的叠层; 去除硬掩模层的一部分; 以及去除未被硬掩模层保护的薄膜层的一部分。 根据另一实施例的方法包括形成薄膜层; 在薄膜层上形成图案化的硬掩模层,硬掩模层包括类金刚石碳的层压层; 以及将材料注入到未被图案化的硬掩模层保护的薄膜层的一部分中。 公开了另外的方法。
    • 40. 发明授权
    • Method for fabricating a magnetic head for perpendicular recording using a CMP lift-off and resistant layer
    • 使用CMP剥离层和耐电层制造用于垂直记录的磁头的方法
    • US07429493B2
    • 2008-09-30
    • US11184364
    • 2005-07-18
    • Ming JiangSue Siyang ZhangYi Zheng
    • Ming JiangSue Siyang ZhangYi Zheng
    • H01L21/00
    • G11B5/3163G11B5/1278
    • A method using a CMP resistant hardmask in a process of fabricating a pole piece for a magnetic head is described. A set of layers used as the mask for milling the pole piece preferably includes a CMP resistant hardmask of silicon dioxide, a resist hardmask, an upper hardmask and a photoresist mask respectively. A multi-step reactive-ion etching (RIE) process is preferably used to sequentially remove the excess materials in the layer stack to ultimately define the multilayer mask for the pole piece. The excess pole piece material is then milled away. The wafer is then refilled with a nonmagnetic material such as alumina. A CMP liftoff is used to remove the resist hardmask. The material for the CMP resistant hardmask is selected to have a high resistance to the CMP liftoff process in comparison to the refill material. The CMP resistant hardmask is preferably then removed by a RIE process.
    • 描述了在制造用于磁头的极片的工艺中使用CMP耐磨硬掩模的方法。 作为用于研磨极片的掩模的一组层优选分别包括二氧化硅的CMP耐磨硬掩模,抗蚀剂硬掩模,上硬掩模和光致抗蚀剂掩模。 优选使用多步反应离子蚀刻(RIE)工艺来顺序地去除层叠中的多余材料以最终限定极片的多层掩模。 然后将多余的极片材料磨掉。 然后用非磁性材料如氧化铝再填充晶片。 CMP剥离用于去除抗蚀剂硬掩模。 选择用于CMP耐磨硬掩模的材料以与补充材料相比具有对CMP剥离工艺的高抗性。 然后优选通过RIE工艺去除CMP耐磨硬掩模。