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    • 21. 发明专利
    • Sticking device, and method for manufacturing shield structure
    • 制造装置及制造屏蔽结构的方法
    • JP2010177519A
    • 2010-08-12
    • JP2009019772
    • 2009-01-30
    • Toshiba Corp株式会社東芝
    • AIZAWA TAKAHIROTOMIOKA TAIZOKIMURA AKIYA
    • H01L21/56
    • PROBLEM TO BE SOLVED: To provide a sticking device suitable for obtaining a fixation effect of sheet-like resin and further achieving miniaturization and height reduction when a shield material is stuck to an electronic circuit module.
      SOLUTION: The sticking device is provided with: a stage 11 for mounting a stuck member; and a head 8 on which a plurality of pins 9 each elastically supported by independent elastic member are implanted, which is arranged opposite to the stage, and movable in the direction for approaching to and separating from the stage, pressurizes an insulating resin sheet 2 which is a shield member 3 to the stuck member by the head 8, fills the insulating resin along the shapes of electronic components 6, 7, etc., to be hardened between the electronic components.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供适于获得片状树脂的固定效果的粘合装置,并且当屏蔽材料粘附到电子电路模块时进一步实现小型化和高度降低。

      解决方案:贴装装置设有:用于安装卡住部件的台架11; 以及头部8,其上植入有由独立的弹性构件弹性地支撑的多个销9,其与台架相对设置并且可以在与台架接近和分离的方向上移动,对绝缘树脂片材2加压,绝缘树脂片材 是通过头部8到卡定构件的屏蔽构件3,沿着电子部件6,7等的形状填充绝缘树脂,以在电子部件之间硬化。 版权所有(C)2010,JPO&INPIT

    • 22. 发明专利
    • Cellular phone terminal
    • 蜂窝电话终端
    • JP2010081125A
    • 2010-04-08
    • JP2008245086
    • 2008-09-25
    • Toshiba Corp株式会社東芝
    • TOMIOKA TAIZOWATANABE NAOTAKE
    • H04M1/02H05K5/06
    • H04M1/026
    • PROBLEM TO BE SOLVED: To provide a cellular phone terminal which can be made thinner while securing rigidity.
      SOLUTION: The cellular phone terminal is provided with: a plate-like part which contains a metal material, forms a plate shape, one main surface side on which at least one of a display part and an input key is arranged; a frame side in which a long and thin member containing an insulating material is constituted like a frame and which is arranged at the outer circumference of the plate-like part. A dimensions in the thickness direction of the long and thin member constituting the frame side has a feature of being smaller than the dimension in the width direction crossing the thickness direction.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种可以在确保刚性的同时制造得更薄的蜂窝电话终端。 解决方案:蜂窝电话终端设置有:包含金属材料的板状部分,形成板状,一个主表面侧,其上布置有显示部分和输入键中的至少一个; 框架侧,其中包含绝缘材料的长而薄的构件构成为框架并且布置在板状部分的外周。 构成框架侧的长薄部件的厚度方向的尺寸小于与厚度方向交叉的宽度方向的尺寸。 版权所有(C)2010,JPO&INPIT
    • 25. 发明专利
    • Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
    • 半导体器件,制造半导体器件的方法和电子设备
    • JP2007250749A
    • 2007-09-27
    • JP2006070934
    • 2006-03-15
    • Toshiba Corp株式会社東芝
    • SUGA KENTAROTOMIOKA TAIZOKITANI TOMOYUKINISHIUCHI HIDEO
    • H01L21/60
    • H01L2224/16225
    • PROBLEM TO BE SOLVED: To provide a semiconductor device which improves the stress resistance while maintaining the characteristic of its semiconductor element and the degree of design freedom. SOLUTION: The semiconductor device 1 comprises plate-shaped leads 2a-2d extending in one direction, a plurality of projective electrodes 3a-3j on the surface of the leads 2a-2d, a semiconductor element 4 provided on the surface of the leads 2a-2d through the plurality of projective electrodes 3a-3j, and a seal resin 5 provided between the leads 2a-2d and the semiconductor element 4. The projective electrodes 3a-3j are shifted in mutually different widthwise directions from a reference line K extending the lengthwise direction of the leads 2a-2d along a straight line on the surface of the leads 2a-2d. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种在保持其半导体元件的特性和设计自由度的同时提高耐应力的半导体器件。 解决方案:半导体器件1包括在一个方向上延伸的板状引线2a-2d,引线2a-2d的表面上的多个突出电极3a-3j,设置在引线2a-2d的表面上的半导体元件4 引线2a-2d通过多个投影电极3a-3j,以及设置在引线2a-2d和半导体元件4之间的密封树脂5.投射电极3a-3j从参考线K 沿引线2a-2d的表面沿直线延伸引线2a-2d的长度方向。 版权所有(C)2007,JPO&INPIT
    • 27. 发明专利
    • Optical coupling semiconductor device
    • 光耦合半导体器件
    • JP2005123274A
    • 2005-05-12
    • JP2003354178
    • 2003-10-14
    • Toshiba Corp株式会社東芝
    • ITO KENJITOMIOKA TAIZOSUEMATSU MUTSUMIMORI IKUOSAITO YASUTOARAKAWA MASAYUKI
    • H01L31/12
    • H01L2224/48091H01L2224/48137H01L2224/48465H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide an optical coupling semiconductor device capable of reducing component mounting area to a printed wiring board and volume of a package without miniaturizing each built-in component. SOLUTION: The optical coupling semiconductor device is provided with a light receiving element 23 and switching elements 24, 25 which are mounted on a first lead frame 21; a light emitting element 27 which is mounted on a second lead frame 22, and so arranged that the luminescence surface H of the element 27 faces the light receiving surface J of the light receiving element 23; an optical guide 28 which is arranged between the light emitting element 27 and the light receiving element 23, and transmits an optical signal from the light emitting element 27 to the light receiving element 23; and the package 29 which collectively seals the switching elements 24, 25, the light receiving element 23, the light emitting element 27, and the light guiding part 28. Moving direction of the optical signal from the light emitting element 27 to the light receiving element 23 is parallel to a component mounting surface Pa of the printed wiring board P. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供一种光耦合半导体器件,其能够减少组件安装面积到印刷线路板和封装体积,而不使每个内置部件小型化。 解决方案:光耦合半导体器件设置有光接收元件23和安装在第一引线框架21上的开关元件24,25; 安装在第二引线框架22上的发光元件27,并且被配置为使得元件27的发光面H面对光接收元件23的受光面J; 布置在发光元件27和光接收元件23之间的光导28,并将光信号从发光元件27发送到光接收元件23; 以及将开关元件24,25,受光元件23,发光元件27以及导光部28共同密封的封装29.从光发射元件27到光接收元件的光信号的移动方向 23与印刷电路板P的部件安装面Pa平行。版权所有(C)2005,JPO&NCIPI
    • 28. 发明专利
    • Bonding method and bonding apparatus
    • 接合方法和接合装置
    • JP2003077955A
    • 2003-03-14
    • JP2001269298
    • 2001-09-05
    • Toshiba Corp株式会社東芝
    • IKETANI YUKIHIROSUEMATSU MUTSUMIWATANABE TAKAOKOBAYASHI DAISUKESHIBATA MOTOJIROKUBO TETSUYATOMIOKA TAIZO
    • H01L21/60
    • PROBLEM TO BE SOLVED: To provide a bonding method for accurately detecting a chip at a front-end position to bond all chips without fail.
      SOLUTION: The method which sequentially takes out multiple chips formed on a semiconductor wafer 5 and bonds them on a substrate 25 comprises steps of imaging a plurality of chips on the semiconductor wafer; recognizing the plurality of chips from the image acquired by the imaging step; determining whether the recognized plurality of chips have any defect thereon; picking up the chips for bonding on the substrate; and carrying the chips while controlling such that chips determined to have a defect based on the determining step are omitted before being carried.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:提供一种用于精确地检测前端位置处的芯片以便结合所有芯片的接合方法。 解决方案:顺序取出在半导体晶片5上形成的多个芯片并将其粘合在基板25上的方法包括以下步骤:在半导体晶片上成像多个芯片; 从由所述成像步骤获取的图像识别所述多​​个芯片; 确定所识别的多个芯片在其上是否有任何缺陷; 拾取用于在基板上粘合的芯片; 并且在进行控制的同时携带芯片,以便在携带之前省略基于确定步骤确定为具有缺陷的芯片。
    • 29. 发明专利
    • Battery and ultrasonic bonding method of battery
    • 电池和超声波电池联结方法
    • JP2013101977A
    • 2013-05-23
    • JP2013035991
    • 2013-02-26
    • Toshiba Corp株式会社東芝
    • AIZAWA TAKAHIROIKETANI YUKIHIROTOMIOKA TAIZO
    • H01M2/26
    • Y02E60/12
    • PROBLEM TO BE SOLVED: To provide a battery capable of combining the low resistance of lead and the guarantee of ultrasonic bonding strength by using ultrasonic bonding, and to provide an ultrasonic bonding method.SOLUTION: The battery includes a container 12, an electrode group 1 housed in the container and including positive electrodes and negative electrodes, a plurality of collector tabs 2a, 2b extending from the positive electrodes or negative electrodes in the electrode group and being overlapped by a metal foil, leads 5a-5c, 6a-6c being bonded to at least one of the collector tabs by ultrasonic bonding, a lid 11 closing the aperture of the container, and external terminals 9, 10 provided on the lid and connected with the collector tabs via the leads. The lead increases the cross sectional area in the way from the ultrasonic joint to the collector tab to the external terminal, and has a planar surface on the side facing the collector tab of the lead.
    • 要解决的问题:提供一种能够通过使用超声波接合来结合铅的低电阻和超声波接合强度的保证的电池,并提供超声波接合方法。 解决方案:电池包括容器12,容纳在容器中的电极组1,包括正极和负极,从电极组中的正极或负极延伸的多个集电片2a,2b,并且 由金属箔重叠,引线5a-5c,6a-6c通过超声波接合结合到至少一个收集片上,封闭容器孔径的盖子11和设在盖子上并连接的外部端子9,10 通过引线与收集器标签。 引线增加了从超声波接头到收集器舌片到外部端子的横截面积,并且在面向引线的收集器舌片的一侧上具有平坦表面。 版权所有(C)2013,JPO&INPIT
    • 30. 发明专利
    • Mobile phone terminal
    • 移动电话终端
    • JP2010226628A
    • 2010-10-07
    • JP2009073899
    • 2009-03-25
    • Toshiba Corp株式会社東芝
    • AIZAWA TAKAHIROTOMIOKA TAIZOWATANABE NAOTAKEKIMURA AKIYA
    • H04M1/02H05K7/14
    • PROBLEM TO BE SOLVED: To provide a mobile phone terminal that has been reduced in thickness while maintaining rigidity and is capable of protecting internal components.
      SOLUTION: The mobile phone terminal 10 includes a base 13 having a plate 11 containing metal material formed as a plate and a side 12 of frame arranged in the external circumferential part of the plate 11 to be formed like a frame containing an insulating material. A bending allowable part 13c is provided to allow bending deformation of the base 13 and components are arranged to the region surrounded by the base 13, avoiding the bending allowable part 13c.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种在保持刚性并且能够保护内部部件的同时减小厚度的移动电话终端。 解决方案:移动电话终端10包括:基座13,其具有包含形成为板的金属材料的板11和布置在板11的外周部分中的框架的侧面12,其形成为类似于包含绝缘体 材料。 弯曲允许部分13c设置成允许基部13的弯曲变形,并且部件被布置到由基部13包围的区域中,从而避免弯曲允许部分13c。 版权所有(C)2011,JPO&INPIT