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    • 24. 发明申请
    • Zone polishing using variable slurry solid content
    • 使用可变浆料固体含量进行区域抛光
    • US20050026549A1
    • 2005-02-03
    • US10633131
    • 2003-08-01
    • Alvaro MauryJovin LimNace LayadiSebastian Quek
    • Alvaro MauryJovin LimNace LayadiSebastian Quek
    • B24B37/04B24B57/02B24B49/00B24B51/00
    • B24B37/04B24B57/02
    • A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
    • 一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。 该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。 浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。 每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。 供应浆料的第一分支和供应去离子水的第二分支。 根据其表面拓扑结构,每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。