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    • 1. 发明授权
    • Zone polishing using variable slurry solid content
    • 使用可变浆料固体含量进行区域抛光
    • US07163438B2
    • 2007-01-16
    • US11208829
    • 2005-08-22
    • Alvaro MauryJovin LimNace LayadiSebastian Ouek
    • Alvaro MauryJovin LimNace LayadiSebastian Ouek
    • B24B49/00B24B7/00B24B1/00
    • B24B37/04B24B57/02
    • A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
    • 一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。 该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。 浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。 每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。 供应浆料的第一分支和供应去离子水的第二分支。 根据其表面拓扑结构,每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。
    • 2. 发明申请
    • Method to monitor silicide formation on product wafers
    • 监测产品晶圆上硅化物形成的方法
    • US20050134857A1
    • 2005-06-23
    • US10742986
    • 2003-12-22
    • Alvaro MauryNace LayadiJovin Lim
    • Alvaro MauryNace LayadiJovin Lim
    • G01N21/17G01R31/28H01L21/66G01N21/00G01R31/26
    • G01R31/2831G01N21/1717
    • A new method to monitor sheet resistance of a metal silicide layer in the manufacture of an integrated circuit device is achieved. The method comprises providing a metal silicide layer overlying an exposed silicon layer on a substrate. A thermal wave intensity signal is generated for the metal silicide layer by an optical measurement system. The optical measurement system comprises a first laser beam that is intensity modulated and a second laser beam. The first and second laser beams comprise different wavelengths. A dichroic mirror is used to combine the first and second laser beams and to project the first and second laser beams onto the metal silicide layer. A detector is used to gather the second laser beam reflected from the metal silicide layer and to generate a thermal wave intensity signal based on the reflected second laser beam. Sheet resistance of the metal silicide layer is calculated by a linear equation based on the thermal wave intensity signal.
    • 实现了在制造集成电路器件时监测金属硅化物层的薄层电阻的新方法。 该方法包括提供覆盖衬底上暴露的硅层的金属硅化物层。 通过光学测量系统为金属硅化物层产生热波强度信号。 光学测量系统包括强度调制的第一激光束和第二激光束。 第一和第二激光束包括不同的波长。 分色镜用于组合第一和第二激光束并将第一和第二激光束投影到金属硅化物层上。 检测器用于收集从金属硅化物层反射的第二激光束,并产生基于反射的第二激光束的热波强度信号。 通过基于热波强度信号的线性方程来计算金属硅化物层的薄层电阻。
    • 3. 发明授权
    • Zone polishing using variable slurry solid content
    • 使用可变浆料固体含量进行区域抛光
    • US06984166B2
    • 2006-01-10
    • US10633131
    • 2003-08-01
    • Alvaro MauryJovin LimNace LayadiSebastian Quek
    • Alvaro MauryJovin LimNace LayadiSebastian Quek
    • B24B1/00
    • B24B37/04B24B57/02
    • A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
    • 一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。 该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。 浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。 每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。 供应浆料的第一分支和供应去离子水的第二分支。 根据其表面拓扑结构,每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区域区域中的抛光速率。
    • 5. 发明申请
    • Zone polishing using variable slurry solid content
    • 使用可变浆料固体含量进行区域抛光
    • US20050026549A1
    • 2005-02-03
    • US10633131
    • 2003-08-01
    • Alvaro MauryJovin LimNace LayadiSebastian Quek
    • Alvaro MauryJovin LimNace LayadiSebastian Quek
    • B24B37/04B24B57/02B24B49/00B24B51/00
    • B24B37/04B24B57/02
    • A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
    • 一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。 该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。 浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。 每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。 供应浆料的第一分支和供应去离子水的第二分支。 根据其表面拓扑结构,每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。