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1. 发明申请

US20050134857A1 Method to monitor silicide formation on product wafers 审中-公开
标题翻译：监测产品晶圆上硅化物形成的方法
公开(公告)号：US20050134857A1
公开(公告)日：2005-06-23
申请号：US10742986
申请日：2003-12-22
申请人： Alvaro Maury , Nace Layadi , Jovin Lim
发明人： Alvaro Maury , Nace Layadi , Jovin Lim
IPC分类号： G01N21/17 , G01R31/28 , H01L21/66 , G01N21/00 , G01R31/26
CPC分类号： G01R31/2831 , G01N21/1717
摘要： A new method to monitor sheet resistance of a metal silicide layer in the manufacture of an integrated circuit device is achieved. The method comprises providing a metal silicide layer overlying an exposed silicon layer on a substrate. A thermal wave intensity signal is generated for the metal silicide layer by an optical measurement system. The optical measurement system comprises a first laser beam that is intensity modulated and a second laser beam. The first and second laser beams comprise different wavelengths. A dichroic mirror is used to combine the first and second laser beams and to project the first and second laser beams onto the metal silicide layer. A detector is used to gather the second laser beam reflected from the metal silicide layer and to generate a thermal wave intensity signal based on the reflected second laser beam. Sheet resistance of the metal silicide layer is calculated by a linear equation based on the thermal wave intensity signal.
摘要翻译：实现了在制造集成电路器件时监测金属硅化物层的薄层电阻的新方法。该方法包括提供覆盖衬底上暴露的硅层的金属硅化物层。通过光学测量系统为金属硅化物层产生热波强度信号。光学测量系统包括强度调制的第一激光束和第二激光束。第一和第二激光束包括不同的波长。分色镜用于组合第一和第二激光束并将第一和第二激光束投影到金属硅化物层上。检测器用于收集从金属硅化物层反射的第二激光束，并产生基于反射的第二激光束的热波强度信号。通过基于热波强度信号的线性方程来计算金属硅化物层的薄层电阻。

2. 发明授权

US06548906B2 Method for reducing a metal seam in an interconnect structure and a device manufactured thereby 有权
标题翻译：用于减少互连结构中的金属接缝的方法和由此制造的器件
公开(公告)号：US06548906B2
公开(公告)日：2003-04-15
申请号：US09935241
申请日：2001-08-22
申请人： Nace Layadi , Alvaro Maury
发明人： Nace Layadi , Alvaro Maury
IPC分类号： H01L2348
CPC分类号： H01L21/76877 , H01L21/76847 , H01L23/485 , H01L23/53266 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a method of manufacturing an interconnect structure. The method may include forming a nucleation layer, including a first metal, over a barrier layer and within an opening formed in a dielectric layer, forming an intermediate layer, including a second metal such as titanium nitride, over the nucleation layer and within the opening, and forming a plug portion layer, including the first metal, over the intermediate layer and within the opening. The first metal may be tungsten and the second metal may be a titanium nitride layer.
摘要翻译：本发明提供一种制造互连结构的方法。该方法可以包括在阻挡层上形成包含第一金属的成核层，并在形成于电介质层中的开口内形成包括第二金属如氮化钛在内的中间层，并在开口内并且在中间层之上和开口内形成包括第一金属的塞子部分层。第一金属可以是钨，第二金属可以是氮化钛层。

3. 发明授权

US07163438B2 Zone polishing using variable slurry solid content 有权
标题翻译：使用可变浆料固体含量进行区域抛光
公开(公告)号：US07163438B2
公开(公告)日：2007-01-16
申请号：US11208829
申请日：2005-08-22
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
IPC分类号： B24B49/00 , B24B7/00 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
摘要翻译：一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。供应浆料的第一分支和供应去离子水的第二分支。根据其表面拓扑结构，每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。

4. 发明授权

US06910907B2 Contact for use in an integrated circuit and a method of manufacture therefor 失效
标题翻译：用于集成电路的接触及其制造方法
公开(公告)号：US06910907B2
公开(公告)日：2005-06-28
申请号：US10716299
申请日：2003-11-18
申请人： Nace Layadi , Alvaro Maury
发明人： Nace Layadi , Alvaro Maury
IPC分类号： H01L21/768 , H01R13/28 , H01R25/00
CPC分类号： H01L21/76877
摘要： The present invention provides a contact for use in an integrated circuit, a method of manufacture therefor, and an integrated circuit including the aforementioned contact. The contact, in accordance with the principles of the present invention, may include a via located in a substrate, and a contact plug located in the via, wherein the contact plug has a first portion having a notch removed therefrom and a second portion filling the notch.
摘要翻译：本发明提供了一种用于集成电路的接点及其制造方法，以及包括上述接触的集成电路。根据本发明的原理的触点可以包括位于基板中的通孔和位于通孔中的接触塞，其中接触插塞具有从其中移除的凹口的第一部分和填充该通孔的第二部分缺口。

5. 发明授权

US06984166B2 Zone polishing using variable slurry solid content 失效
标题翻译：使用可变浆料固体含量进行区域抛光
公开(公告)号：US06984166B2
公开(公告)日：2006-01-10
申请号：US10633131
申请日：2003-08-01
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
IPC分类号： B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
摘要翻译：一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。供应浆料的第一分支和供应去离子水的第二分支。根据其表面拓扑结构，每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区域区域中的抛光速率。

6. 发明申请

US20050106835A1 Trench isolation structure and method of manufacture therefor 审中-公开
标题翻译：沟槽隔离结构及其制造方法
公开(公告)号：US20050106835A1
公开(公告)日：2005-05-19
申请号：US10716278
申请日：2003-11-18
申请人： Nace Layadi , Alvaro Maury
发明人： Nace Layadi , Alvaro Maury
IPC分类号： H01L21/762 , H01L21/8234 , H01L21/76
CPC分类号： H01L21/76224 , H01L21/823481
摘要： The present invention provides a trench isolation structure, a method for manufacturing a trench isolation structure, and a method for manufacturing an integrated circuit including the trench isolation structure. The trench isolation structure, in accordance with the principles of the present invention, may include a substrate having a trench located therein, and an isolation material located within the trench, wherein the isolation material has no undercut at corners where the isolation material meets the substrate.
摘要翻译：本发明提供一种沟槽隔离结构，一种用于制造沟槽隔离结构的方法，以及一种用于制造包括沟槽隔离结构的集成电路的方法。根据本发明的原理，沟槽隔离结构可以包括其中具有沟槽的衬底和位于沟槽内的隔离材料，其中隔离材料在隔离材料与衬底相遇的拐角处没有底切。

7. 发明申请

US20050277372A1 Zone polishing using variable slurry solid content 有权
公开(公告)号：US20050277372A1
公开(公告)日：2005-12-15
申请号：US11208829
申请日：2005-08-22
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Ouek
IPC分类号： B24B37/04 , B24B57/02 , B24B1/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.

8. 发明申请

US20050106919A1 CONTACT FOR USE IN AN INTEGRATED CIRCUIT AND A METHOD OF MANUFACTURE THEREFOR 失效
标题翻译：联系用于集成电路及其制造方法
公开(公告)号：US20050106919A1
公开(公告)日：2005-05-19
申请号：US10716299
申请日：2003-11-18
申请人： Nace Layadi , Alvaro Maury
发明人： Nace Layadi , Alvaro Maury
IPC分类号： H01L21/768 , H01R13/28 , H01R25/00
CPC分类号： H01L21/76877
摘要： The present invention provides a contact for use in an integrated circuit, a method of manufacture therefor, and an integrated circuit including the aforementioned contact. The contact, in accordance with the principles of the present invention, may include a via located in a substrate, and a contact plug located in the via, wherein the contact plug has a first portion having a notch removed therefrom and a second portion filling the notch.
摘要翻译：本发明提供了一种用于集成电路的接点及其制造方法，以及包括上述接触的集成电路。根据本发明的原理的触点可以包括位于基板中的通孔和位于通孔中的接触塞，其中接触插塞具有从其中移除的凹口的第一部分和填充该通孔的第二部分缺口。

9. 发明申请

US20050026549A1 Zone polishing using variable slurry solid content 失效
标题翻译：使用可变浆料固体含量进行区域抛光
公开(公告)号：US20050026549A1
公开(公告)日：2005-02-03
申请号：US10633131
申请日：2003-08-01
申请人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
发明人： Alvaro Maury , Jovin Lim , Nace Layadi , Sebastian Quek
IPC分类号： B24B37/04 , B24B57/02 , B24B49/00 , B24B51/00
CPC分类号： B24B37/04 , B24B57/02
摘要： A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing manifold has a linear array of nozzles positioned under the suspended manifold. Each nozzle provides an adjusted slurry mixture that is supplied from bifurcated supply lines. A first branch supplying a slurry, and a second branch supplying deionized water. Each nozzle is capable of providing a particular slurry concentration to either decrease or to increase polishing rate in specific zonal areas on a substrate according to its surface topology.
摘要翻译：一种用于与化学机械抛光工具一起用于平坦化具有不规则拓扑的半导体衬底的浆料分配装置。该设备包括具有悬挂在抛光垫上的第一端的浆料分配歧管和用于安装到化学机械抛光工具的第二端。浆料分配歧管具有位于悬浮歧管下方的线性阵列的喷嘴。每个喷嘴提供从分叉供应管线供应的经调节的浆料混合物。供应浆料的第一分支和供应去离子水的第二分支。根据其表面拓扑结构，每个喷嘴能够提供特定的浆料浓度以降低或提高基材上特定区带区域的抛光速率。

10. 发明授权

US06821886B1 IMP TiN barrier metal process 失效
标题翻译： IMP TiN阻挡金属工艺
公开(公告)号：US06821886B1
公开(公告)日：2004-11-23
申请号：US10655690
申请日：2003-09-05
申请人： Nace Layadi , Alvaro Maury , Jovin Lim
发明人： Nace Layadi , Alvaro Maury , Jovin Lim
IPC分类号： H01L2144
CPC分类号： H01L21/76846 , H01L21/76805 , H01L23/53266 , H01L2924/0002 , H01L2924/00
摘要： A new method is provided for the creation of an adhesion/barrier layer over which a tungsten interconnect is created. The invention reduces metal extrusion and effects of pin-holes by dividing the process of barrier material of TiN deposition into phases, whereby after about half the thickness of the required layer of TiN has been deposited, an intermediate and very thin layer of Ti is deposited. After the thin layer of Ti has been deposited, the deposition of the barrier layer of TiN is continued to the point where the required thickness for the layer of TiN has been reached.
摘要翻译：提供了一种新的方法来创建粘附/阻挡层，在其上形成钨互连。本发明通过将TiN沉积的阻挡材料的工艺分成相来减少金属挤出和针孔的影响，由此在所需的TiN层的厚度的大约一半已经沉积之后，沉积中间层和非常薄的Ti层。在沉积薄层的Ti之后，TiN阻挡层的沉积继续到达到TiN层所需厚度的程度。

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