会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 13. 发明授权
    • Method for vaporization of liquid organic feedstock and method for growth of insulation film
    • 液体有机原料汽化方法及绝缘膜生长方法
    • US06784118B2
    • 2004-08-31
    • US09838343
    • 2001-04-20
    • Yoshihiro HayashiJun KawaharaHirofumi Ono
    • Yoshihiro HayashiJun KawaharaHirofumi Ono
    • H01L2131
    • B05D1/62C23C16/4481
    • In order to vaporize an organic monomer at a high temperature and a high saturated vapor pressure in good efficiency and to grow an organic polymer film at a high rate in high vacuum by a plasma polymerization reaction of the resulting organic monomer gas, a liquid divinylsiloxanebisbenzocyclobutene (DVS-BCB) monomer is mixed with a carrier gas, and the mixture is then sprayed on a vaporization vacuum chamber held at a high temperature to form an aerosol made of liquid fine particles of the organic monomer, and a BCB monomer (organic monomer) is instantaneously vaporized via the aerosol to generate a BCB monomer gas (organic monomer gas). Consequently, the aerosol having a large specific surface area has a large vaporization area, and vaporization occurs by heating at a high temperature before a polymerization reaction occurs. Thus, 0.1 g/min or more of the BCB monomer gas can be formed at 200° C. and a high saturated vapor pressure, and a plasma polymerization BCB film can be formed at a high rate which is at least 5 times higher than in the ordinary film formation.
    • 为了在高温和高饱和蒸气压下以高效率汽化有机单体,并通过所得有机单体气体的等离子体聚合反应在高真空中高效率地生长有机聚合物膜,液体二乙烯基硅氧烷双苯并环丁烯( DVS-BCB)单体与载气混合,然后将该混合物喷在保持在高温下的蒸发真空室中,形成由有机单体的液体细颗粒制成的气溶胶,以及BCB单体(有机单体) 通过气溶胶瞬间蒸发以产生BCB单体气体(有机单体气体)。 因此,具有大的比表面积的气溶胶具有大的蒸发面积,并且在聚合反应发生之前在高温下加热发生蒸发。 因此,可以在200℃,高饱和蒸气压下形成0.1g /分钟以上的BCB单体气体,能够以比率高至少高5倍的高速度形成等离子体聚合BCB膜 普通电影形成。
    • 18. 发明授权
    • Production method for copolymer film, copolymer film produced by the forming method and semiconductor device using copolymer film
    • 共聚膜的制造方法,通过成型方法制造的共聚物膜和使用共聚物膜的半导体装置
    • US07101591B2
    • 2006-09-05
    • US10250329
    • 2002-07-01
    • Yoshihiro HayashiJun Kawahara
    • Yoshihiro HayashiJun Kawahara
    • B05D3/02C23C4/04
    • H01L21/76835C08G61/12C09D4/00H01L21/02126H01L21/02216H01L21/02274H01L21/312H01L21/3122H01L21/76829Y10S428/901Y10S428/938Y10T428/31663C08G77/00
    • This invention provides a process for producing an organic polymer film whereby when using it as an interlayer insulating film in a semiconductor device, the film exhibits higher adhesiveness at its interfaces where other semiconductor materials are in contact with the lower and the upper surface of the film while an effective dielectric constant in the whole organic polymer film can be further reduced. Specifically, a plurality of organic monomers vaporized is sprayed onto a heated substrate surface via plasma generated in a reaction chamber to form a copolymer film comprising frame composed of a plurality of organic monomer units. During the process, relative ratio between the feeding rate of the organic monomer molecules is varied along the progress of the film growth to continuously grow an interlayer insulating film in which films having good mechanical strength and adhesiveness with rich content of siloxane-structure are set near the interfaces (91a,c, 92a,c or 93a,c) and a film having a lower bulk density are arranged as an intermediate layer (91b, 92b or 93b) sandwiched therebetween.
    • 本发明提供一种制造有机聚合物膜的方法,其中当在半导体器件中使用它作为层间绝缘膜时,该膜在其界面处表现出较高的粘附性,其中其它半导体材料与膜的下表面和上表面接触 同时可以进一步降低整个有机聚合物膜中的有效介电常数。 具体地说,蒸发的多个有机单体通过在反应室中产生的等离子体喷射到加热的基板表面上,形成由多个有机单体单元组成的框架的共聚物膜。 在该过程中,有机单体分子的进料速率之间的相对比例随着膜生长的进行而变化,以连续生长其中具有机械强度和密合性好的硅树脂结构的含量较高的膜的层间绝缘膜 界面(91a,c,92a,c或93a,c)和具有较低堆积密度的膜被布置为夹在其间的中间层(91b,92b或93b)。
    • 19. 发明授权
    • Method of fabricating semiconductor device with capacitor
    • 制造具有电容器的半导体器件的方法
    • US06709991B1
    • 2004-03-23
    • US09084578
    • 1998-05-26
    • Jun KawaharaShinobu SaitoYukihiko MaejimaYoshihiro Hayashi
    • Jun KawaharaShinobu SaitoYukihiko MaejimaYoshihiro Hayashi
    • H01L21469
    • H01L28/57H01L21/02164H01L21/0217H01L21/02216H01L21/02219H01L21/02271H01L21/31612H01L21/76801H01L21/76802
    • A fabrication method of a semiconductor device with a capacitor is provided, which prevents leakage current from increasing and dielectric breakdown resistance from decreasing during a CVD or dry etching process for forming an insulating film to cover the capacitor. In this method, a lower electrode of a capacitor is formed on a first insulating film. The first insulating film is typically formed on or over a semiconductor substrate. A dielectric film of the capacitor is formed on the lower electrode to be overlapped therewith. An upper electrode of the capacitor is formed on the dielectric film to be overlapped therewith. A second insulating film is formed to cover the capacitor by a thermal CVD process in an atmosphere containing no plasma at a substrate temperature in which hydrogen is prevented from being activated due to heat. A source material of the second insulating film has a property that no hydrogen is generated in the atmosphere through decomposition of the source material during the thermal CVD process.
    • 提供了具有电容器的半导体器件的制造方法,其防止了在用于形成绝缘膜以覆盖电容器的CVD或干蚀刻工艺期间泄漏电流增加和绝缘击穿电阻降低。 在该方法中,在第一绝缘膜上形成电容器的下电极。 第一绝缘膜通常形成在半导体衬底上或上方。 电容器的电介质膜形成在下电极上以与其重叠。 电容器的上电极形成在电介质膜上以与其重叠。 形成第二绝缘膜,通过热CVD法在不防止由于热而被活化的基板温度下的不含等离子体的气氛中覆盖电容器。 第二绝缘膜的源材料具有通过在热CVD工艺期间源材料分解而在大气中不产生氢的性质。