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11. 发明专利

JP2007332445A Electroless plating method and electroless plating apparatus 审中-公开
标题翻译：电镀方法和电镀镀膜装置
公开(公告)号：JP2007332445A
公开(公告)日：2007-12-27
申请号：JP2006167867
申请日：2006-06-16
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , OWATARI AKIRA , ONO HARUKO , TAKAGI DAISUKE , ISHIBASHI TOMOATSU
IPC分类号： C23C18/18 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating method which can form a protective film with a uniform thickness on the surface of wires by completely removing an anticorrosive agent and/or a metal complex from the surface of a substrate, prior to catalyst-imparting treatment and/or an electroless plating step. SOLUTION: The electroless plating method comprises the steps of: preparing a substrate having embedded wiring formed in the inner part; making a washing member contact with the surface or both sides of the substrate in a wet state; making the washing member supply cleaning fluid onto the surface or both sides of the substrate while relatively moving them to pre-wash the substrate; making the catalyst-imparting liquid contact with the surface of the pre-washed substrate to impart a catalyst onto the surface of the wiring; and then making an electroless plating solution contact with the surface of the substrate to form the protective film selectively on the surface of the wiring. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种化学镀方法，其可以通过从基材表面完全除去防腐剂和/或金属络合物，从而在基材的表面上形成具有均匀厚度的保护膜，催化剂赋予处理和/或化学镀步骤。解决方案：化学镀方法包括以下步骤：制备在内部形成嵌入布线的基板; 使洗涤部件处于湿状态与基板的表面或两侧接触; 使洗涤构件在将衬底相对移动以预清洗衬底的同时将清洁流体供应到衬底的表面或两侧; 使催化剂赋予液体与预洗涤基板的表面接触，以在催化剂表面上施加催化剂; 然后使化学镀溶液与基板的表面接触，以在布线的表面上选择性地形成保护膜。版权所有（C）2008，JPO＆INPIT

12. 发明专利

JP2007126756A Electroless plating apparatus and electroless plating method 审中-公开
标题翻译：电沉积装置和电镀法
公开(公告)号：JP2007126756A
公开(公告)日：2007-05-24
申请号：JP2007028541
申请日：2007-02-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/31
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating apparatus capable of reducing the initial cost and the running cost thereof, and efficiently forming a high-quality protective film on the surface of a metal region without needing a wide installation space.
SOLUTION: The electroless plating apparatus comprises: a pretreatment unit having a treatment unit; an electroless plating unit having a plating tank; and a postcleaning unit, and the pretreatment unit and the electroless plating unit have a common substrate holding head provided with an attraction head 234 and a substrate receiver 236 surrounding the attraction head. An attraction ring 250 with a recess 250a capable of evacuation extending along the circumferential direction is fitted to the attraction head. The substrate receiver has a seal ring 254a disposed on an inner circumferential end thereof and projecting inwardly, and the seal ring is pressed against the peripheral edge of the substrate by the attraction head to seal the peripheral edge of the substrate with the seal ring, so as to hold the substrate. Then, the recess of the attraction ring is evacuated, and, while sealing the peripheral edge of the substrate with the attraction ring, the substrate is attracted and held, so as to release the substrate from the substrate receiver.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种能够降低其初始成本和运行成本，并且在不需要较宽的安装空间的情况下有效地在金属区域的表面上形成高质量的保护膜的化学镀设备。解决方案：化学镀设备包括：具有处理单元的预处理单元; 具有镀槽的化学镀单元; 和后清洗单元，并且预处理单元和化学镀单元具有共同的基板保持头，该基板保持头设置有吸引头234和围绕吸引头的基板接收器236。具有能够沿圆周方向延伸的抽吸的凹部250a的吸引环250安装在吸引头上。衬底接收器具有设置在其内周端上并向内突出的密封环254a，并且通过吸引头将密封环压靠在衬底的周边边缘上，以用密封环密封衬底的周边边缘，因此以保持基板。然后，吸引环的凹部被抽真空，并且在用吸引环密封基板的周缘的同时，吸引并保持基板，以将基板从基板接收体释放。版权所有（C）2007，JPO＆INPIT

13. 发明专利

JP2004346399A Method and apparatus for treating substrate 审中-公开
公开(公告)号：JP2004346399A
公开(公告)日：2004-12-09
申请号：JP2003146867
申请日：2003-05-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： FUKUNAGA AKIRA , TAKAGI DAISUKE , MORIGAMI MASARU
IPC分类号： C23C18/16 , C23C18/18 , C23C18/31 , C23C18/32 , C23C18/50 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L23/52
CPC分类号： C23C18/1608 , C23C18/1879 , C23C18/50
摘要： PROBLEM TO BE SOLVED: To reproducibly form a protective film of high quality without deteriorating particularly electrical characteristics of wiring. SOLUTION: A method for treating a substrate comprises pretreating the surface of a metallic part of the substrate, and selectively forming an alloy film by electroless plating on the surface of the metallic part after having been pretreated, rinsing the substrate having the alloy film formed thereon, and making it into a dry state. The alloy film is electroless plated at a film-forming rate of 10 to 200Å per minute while the fluctuation of the film-forming rate among the substrates is controlled within ±10%. COPYRIGHT: (C)2005,JPO&NCIPI

14. 发明专利

JP2004084056A Electroless plating apparatus and post-electroless plating cleaning method 有权
公开(公告)号：JP2004084056A
公开(公告)日：2004-03-18
申请号：JP2003024944
申请日：2003-01-31
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KATAKABE ICHIRO , INOUE KATSUTAKA , O CHIKAAKI , TAKAGI DAISUKE
IPC分类号： B08B1/04 , C23C18/16 , C23C18/32 , H01L21/00 , H01L21/288 , H01L21/304
CPC分类号： H01L21/67051 , B08B1/04 , C23C18/1632 , C23C18/1689 , C23C18/1893 , C23C18/32 , C23C18/50 , H01L21/67046
摘要： PROBLEM TO BE SOLVED: To provide a technique for removing particles of Co and Ni produced by electroless plating and present on a silicon thermal oxidation film after formation of Cu wiring without affecting the wiring. SOLUTION: An electroless plating apparatus where electroless plating is applied to the surface of wiring in an electronic circuit substrate formed with fine circuit patterns by electroconductive metal wiring is provided with: a substrate transfer means; a loading station arranged in association with the substrate transfer means; one or more electroless plating cells 5 arranged in association with the substrate transfer apparatuses 3a, 3b and 3c; and cleaning devices 6 and 7 arranged in association with the substrate transfer apparatuses and performing cleaning in which cleaning members move to the same direction to scrub substrate surfaces, or cleaning in which the cleaning members rotationally move to a horizontal direction to scrub the substrate surfaces and/or solution cleaning. The particles of Co and Ni produced by electroless plating are removed without affecting the wiring. COPYRIGHT: (C)2004,JPO

15. 发明专利

JP2003260301A METHOD FOR CONCENTRATING CHEMICAL TREATING LIQUID AND DEVICE TO BE USED THEREFOR 审中-公开
公开(公告)号：JP2003260301A
公开(公告)日：2003-09-16
申请号：JP2002065502
申请日：2002-03-11
申请人： EBARA CORP
发明人： O CHIKAAKI , TAKAGI DAISUKE , MISHIMA KOJI , SEKIMOTO MASAHIKO , OWATARI AKIRA
IPC分类号： C02F1/04 , B01D1/14 , B01D1/22 , C23C18/16
摘要： PROBLEM TO BE SOLVED: To provide a means to effectively remove water mixed in a chemical treating liquid while suppressing changes in the component of the chemical treating liquid as much as possible. SOLUTION: The method for concentrating a chemical treating liquid features that the chemical treating liquid is brought into contact with inert gas or reduced pressure gas to vaporize the water component in the chemical treating liquid into the inert gas. The concentration device for a chemical treating liquid is equipped with a reservoir tank of the chemical treating liquid communicating with the chemical treating tank by feed and return pipes, a vaporizer communicating with the reservoir tank of the chemical treating liquid by a circulating means so as to enable the inert gas or reduced pressure gas pass, and a gas/ liquid separating means to enable the inert gas or reduced pressure gas from the vaporizer pass. COPYRIGHT: (C)2003,JPO

16. 发明专利

JP2006241580A Method and apparatus for treating substrate 审中-公开
标题翻译：用于处理基板的方法和装置
公开(公告)号：JP2006241580A
公开(公告)日：2006-09-14
申请号：JP2005062831
申请日：2005-03-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , OWATARI AKIRA , ISHIZAKA MASANORI , FUKUNAGA AKIRA
IPC分类号： C23C18/18 , C23C18/31 , H01L21/28 , H01L21/288 , H01L21/3205
CPC分类号： C23C18/1844 , C23C18/1653 , C23C18/168 , H01L21/288 , H01L21/76849
摘要： PROBLEM TO BE SOLVED: To efficiently form a high-quality metal film (protection film), especially on the surface of wiring etc. without deteriorating the electric property of the wiring by subjecting a substrate to an activation treatment such as catalyst-imparting treatment using an optimized processing liquid.
SOLUTION: The metal film is formed on the surface of the substrate by contacting the surface of the substrate, preferably cooled to a prescribed temperature of ≤15°C, to the processing liquid whose temperature is adjusted to ≤15°C to activate the surface, and then contacting the activated surface of the substrate to a plating solution.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了有效地形成优质的金属膜（保护膜），特别是在布线表面上，而不会使基板经受诸如催化剂 - 载体的活化处理而使布线的电性变差，使用优化的处理液进行处理。解决方案：通过将衬底的表面优选冷却到规定温度≤15℃的方式与基板的表面接触，将温度调节至≤15℃的处理液与激活表面，然后使基底的活化表面接触电镀液。版权所有（C）2006，JPO＆NCIPI

17. 发明专利

JP2006077275A Method and device for depositing metal film 有权
标题翻译：用于沉积金属膜的方法和装置
公开(公告)号：JP2006077275A
公开(公告)日：2006-03-23
申请号：JP2004260527
申请日：2004-09-08
申请人： Ebara Corp , 株式会社荏原製作所
发明人： O CHIKAAKI , TAKAGI DAISUKE , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA , OWATARI AKIRA
IPC分类号： C23C18/16 , H01L21/288
CPC分类号： H01L21/288 , C23C18/1619 , C23C18/1669 , C23C18/32 , H01L21/76846 , H01L21/76849 , H01L21/76874
摘要： PROBLEM TO BE SOLVED: To continuously deposit metal films with different film quality in a film thickness direction using the same treatment liquid.
SOLUTION: A substrate in which buried wiring is formed in a recessed part for wiring at the surface is prepared. As a treatment liquid is contacted with the surface of the substrate, the relative fluidization state of the treatment liquid to the surface of the substrate is changed, so as to continuously deposit metal films with different film quality in a film thickness direction on the surface of the wiring.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：使用相同的处理液体在膜厚度方向上连续沉积具有不同膜质量的金属膜。＆lt; P＆gt;解决方案：准备在表面的布线的凹部形成埋入布线的基板。当处理液与基材表面接触时，改变处理液相对于基材表面的相对流化状态，从而在膜厚度方向上连续沉积具有不同膜质量的金属膜接线。版权所有（C）2006，JPO＆NCIPI

18. 发明专利

JP2006016684A Wiring method and wiring device 审中-公开
标题翻译：接线方法和接线装置
公开(公告)号：JP2006016684A
公开(公告)日：2006-01-19
申请号：JP2004198590
申请日：2004-07-05
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , TASHIRO AKIHIKO , INOUE HIROAKI , SUZAKI AKIRA , SHIMOYAMA TADASHI , YOKOTA HIROSHI
IPC分类号： C23C18/16 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To provide a wiring method and a wiring device capable of continuously and consistently performing a series of wiring treatments after forming small recesses for wiring in a surface of a substrate without through the treatment where the dry treatment and the wet treatment are mixed.
SOLUTION: A substrate W is prepared, in which small recesses 64 for wiring are formed inside an insulating film 62 deposited on the surface. A barrier layer 68 is formed on the surface of the substrate W by the wet treatment. A seed layer 70 is formed on the surface of the barrier layer 68 by the wet treatment, and a wiring layer 72 is formed on the surface of the substrate after forming the seed layer by the wet treatment.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种布线方法和布线装置，其能够在形成用于基板表面的布线的小凹槽之后连续且一致地执行一系列布线处理，而不需要通过干法处理和湿法处理混合。解决方案：制备衬底W，其中用于布线的小凹槽64形成在沉积在表面上的绝缘膜62内部。通过湿处理在衬底W的表面上形成阻挡层68。通过湿式处理在阻挡层68的表面上形成种子层70，并且通过湿法处理形成种子层之后，在基板的表面上形成布线层72。版权所有（C）2006，JPO＆NCIPI

19. 发明专利

JP2005243845A Substrate treatment method and substrate treatment device 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：JP2005243845A
公开(公告)日：2005-09-08
申请号：JP2004050407
申请日：2004-02-25
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , O CHIKAAKI , TASHIRO AKIHIKO , FUKUNAGA YUKIO , FUKUNAGA AKIRA , SHIMOYAMA TADASHI
IPC分类号： C23C18/16 , C23C8/36 , C23C18/31 , H01L21/288 , H01L21/3205 , H01L21/677 , H01L21/68 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To protect wiring by selectively covering the exposed surface of the wiring with a wiring protective film improved in a barrier property to the wiring. SOLUTION: At the time of protecting the wiring formed on the surface of a substrate by selectively forming the protective film on the exposed surface of the wiring, pre-treatment is performed on the base surface to be plated of the substrate, and the protective film is selectively formed on the pre-treated base surface to be plated of the substrate by performing electroless plating. Then the electroless-plated substrate is cleaned and dried and plasma treatment is performed on the surface of the dried substrate. COPYRIGHT: (C)2005,JPO&NCIPI

20. 发明专利

JP2005206905A Substrate treatment method and device, and treatment liquid 审中-公开
标题翻译：基板处理方法和设备，以及处理液体
公开(公告)号：JP2005206905A
公开(公告)日：2005-08-04
申请号：JP2004016379
申请日：2004-01-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： TAKAGI DAISUKE , SAHODA TAKESHI , O CHIKAAKI , TASHIRO AKIHIKO , FUKUNAGA AKIRA
IPC分类号： C23C18/18 , C23C18/16 , H01L21/28 , H01L21/288 , H01L21/3205 , H01L23/52
摘要： PROBLEM TO BE SOLVED: To efficiently form a wiring protective film of high quality particularly without deteriorating the electrical properties of wiring by performing pretreatment such as the application of a catalyst and pre-rinsing to a substrate with an optimized treatment liquid. SOLUTION: In the substrate treatment method, at the time of selectively forming a metal film on the exposed surface of a base metal formed on the surface of a substrate by electroless plating, pretreatment to the surface of the base metal is performed with a treatment liquid comprising components forming a complex with the base metal and catalyst metal ions. COPYRIGHT: (C)2005,JPO&NCIPI

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