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1. 发明专利

JP2005139516A Plating method and plating device 审中-公开
标题翻译：电镀方法和镀层装置
公开(公告)号：JP2005139516A
公开(公告)日：2005-06-02
申请号：JP2003377719
申请日：2003-11-07
申请人： Ebara Corp , Ebara Udylite Kk , 株式会社荏原製作所 , 荏原ユージライト株式会社
发明人： SAHODA TAKESHI , NAKADA TSUTOMU , MISHIMA KOJI , KIMIZUKA RYOICHI
IPC分类号： C25D3/38 , C25D7/12 , C25D21/12 , H01L21/288 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To reduce chloride ions taken into a copper plating film.
SOLUTION: In the copper plating method using a leveller containing a nitrogen-containing polymer compound, the leveller is beforehand subjected to dechlorination treatment before plating treatment. The dechlorination treatment at this time is performed in such a manner that the weight ratio of chloride ions to 1g of the nitrogen-containing polymer compound is controlled to ≤0.1 g. Further, the plating device provided with: a plating liquid control tank; a dechlorination apparatus for subjecting the leveller to chlorination treatment; a leveller feed part for feeding the leveller subjected to the dechlorination treatment to the plating liquid control tank; and a plating treatment part is used.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：减少进入镀铜膜中的氯离子。解决方案：在使用含有含氮高分子化合物的矫正机的镀铜方法中，在镀覆处理之前，预先对整平剂进行脱氯处理。此时的脱氯处理以将氯离子与1g含氮高分子化合物的重量比控制为≤0.1g的方式进行。另外，电镀装置具备：电镀液控制槽; 用于使整平剂进行氯化处理的脱氯装置; 用于将进行脱氯处理的矫平机供给到电镀液控制箱的矫平机进料部; 并使用电镀处理部。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005126803A Plating method 审中-公开
标题翻译：涂层方法
公开(公告)号：JP2005126803A
公开(公告)日：2005-05-19
申请号：JP2003366162
申请日：2003-10-27
申请人： Ebara Corp , Ebara Udylite Kk , 株式会社荏原製作所 , 荏原ユージライト株式会社
发明人： SAHODA TAKESHI , NAKADA TSUTOMU , MISHIMA KOJI , KIMIZUKA RYOICHI
IPC分类号： C25D3/38 , C25D7/12
摘要： PROBLEM TO BE SOLVED: To provide a plating technique capable of applying uniform plating even to the part of an extremely thin copper seed film, and capable of realizing embedment free from voids.
SOLUTION: In the plating method, a plating film is formed on an electrical conductor layer formed at least on part of an electronic circuit board having vias or grooves, and copper is embedded in the vias or grooves to form circuit wiring. As a plating solution, an acidic copper plating solution containing copper ions, an organic acid or an inorganic acid, chlorine ions, a sulfur-containing saturated organic compound and a high molecular weight surfactant that controls electrodeposition at a concentration of ≥500 ppm is used.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种即使对极薄的铜种子膜的一部分进行均匀电镀并能够实现无空隙的嵌入的电镀技术。解决方案：在电镀方法中，在形成有具有通孔或凹槽的电子电路板的至少一部分上的电导体层上形成镀膜，并且将铜嵌入通孔或沟槽中以形成电路布线。作为电镀液，使用含有铜离子，有机酸或无机酸的酸性镀铜液，氯离子，含硫饱和有机化合物和控制浓度≥500ppm的电沉积的高分子量表面活性剂。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2006152415A Plating apparatus and plating method 审中-公开
标题翻译：电镀设备和电镀方法
公开(公告)号：JP2006152415A
公开(公告)日：2006-06-15
申请号：JP2004348248
申请日：2004-12-01
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAITO NOBUTOSHI , YOSHIOKA JUNICHIRO , KURIYAMA FUMIO , ONOZAWA MASUNOBU , SAHODA TAKESHI
IPC分类号： C25D7/12 , C25D5/08 , C25D5/18 , C25D21/10 , H01L21/288 , H01L21/768
CPC分类号： H01L2924/01029 , H01L2924/01047 , H01L2924/01078
摘要： PROBLEM TO BE SOLVED: To provide a plating apparatus and a plating method which, with a relatively simple construction, can surely fill in via holes or the like with a metal film without the formation of voids in the embedded metal film even when the via holes or the like have a high aspect ratio and a deep depth.
SOLUTION: The plating apparatus comprises:a plating tank 186 for holding a plating solution 188; a holder 160 for holding an object W to be plated, feeding electricity to the object to be plated, and bringing a surface to be plated of the object to be plated into contact with the plating solution in the plating tank; an anode 214 disposed in the plating solution in the plating tank; a plating solution stirring section 220, 224, disposed between the anode and the object to be plated held by the holder, for stirring the plating solution in the plating tank; and a plating power source 230 for periodically applying a voltage between the object to be plated and the anode; wherein the plating solution is stirred by the plating solution stirring section when no voltage is applied between the object to be plated and the anode, whereas the stirring of the plating solution by the plating solution stirring section is stopped when the voltage is applied between the object to be plated and the anode.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电镀装置和电镀方法，其结构相对简单，即使在嵌入金属膜中也不会形成空隙的情况下，可以用金属膜可靠地填充通孔等，通孔等具有高纵横比和深度。电镀装置包括：用于保持镀液188的镀槽186; 用于保持要镀覆的物体W的保持器160，向被镀物体供电，并且使待镀物体的镀层表面与镀液中的镀液接触; 布置在镀槽中的镀液中的阳极214; 电镀溶液搅拌部220,224，设置在由保持器保持的阳极和待电镀物体之间，用于搅拌电镀槽中的电镀液; 以及用于在被镀物体与阳极之间周期性地施加电压的电镀电源230; 其中当在被镀物体和阳极之间没有施加电压时，通过电镀液搅拌部分搅拌镀液，而当电极施加在物体之间时，电镀溶液搅拌部分的电镀溶液的搅拌被停止被镀和阳极。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2004225119A Plating method and plating apparatus used for this method 有权
标题翻译：用于本方法的镀层方法和镀层装置
公开(公告)号：JP2004225119A
公开(公告)日：2004-08-12
申请号：JP2003015235
申请日：2003-01-23
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KURASHINA KEIICHI , SAHODA TAKESHI , NAKADA TSUTOMU , MISHIMA KOJI
IPC分类号： C25D7/12 , C25D17/14 , C25D21/12 , H01L21/288 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To produce a technique for selectively depositing copper plating into circuit-shaped fine groove and fine holes with a mechanical means.
SOLUTION: In an electric-plating method, with which an electric conductive layer is formed on a substrate having the fine groove and/or the fine holes and metal is filled up into the fine groove and/or the fine holes by performing the metal plating on this electric conductive layer, the metal-plating is performed while bringing a hard contacting surface having high flatness degree and a contacting body having fine penetrated holes possible to pass the plating solution, into contact with an electric conductive layer. Further, in the plating apparatus having a plating vessel for holding plating solution, an anode, a holding means for giving cathodic potential while holding the substrate having the fine groove and/or the fine holes formed as the electric conductive layer and a power source, the hard conducting surface having high flatness which can supply the plating solution while bringing into contact with the electric conductive layer on the substrate, and the contacting body having fine penetrating holes possible to pass through the plating solution, are disposed between an anode and the held substrate.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：制造一种用机械方式将铜镀层选择性地沉积到电路形细槽和细孔中的技术。解决方案：在电镀方法中，在具有细槽的基板和/或细孔和金属上形成导电层的电镀方法通过执行以下方式填充到细槽和/或细孔中在该导电层上的金属电镀，进行金属电镀，同时使具有高平坦度的硬接触表面和具有细孔的接触体可能通过电镀液与导电层接触。此外，在具有用于保持电镀液的电镀容器的电镀装置中，阳极，保持具有形成为导电层的微细孔的基板和/或形成为导电层的微细孔的电源的电源，所述硬导电表面具有高的平坦度，其能够在与基板上的导电层接触的同时供应电镀液，并且具有可能穿过电镀液的细孔的接触体设置在阳极和被保持的基质。版权所有（C）2004，JPO＆NCIPI

5. 发明专利

JP2008223144A Plating method and plating apparatus used for the same 审中-公开
标题翻译：用于其的镀覆方法和镀膜设备
公开(公告)号：JP2008223144A
公开(公告)日：2008-09-25
申请号：JP2008116542
申请日：2008-04-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： KURASHINA KEIICHI , SAHODA TAKESHI , NAKADA TSUTOMU , MISHIMA KOJI
IPC分类号： C25D5/02 , C25D5/18
摘要： PROBLEM TO BE SOLVED: To provide a method for selectively depositing copper plating in circuit-shaped microgrooves and/or microholes.
SOLUTION: The electroplating method of filling metal into the microgrooves and/or microholes 105 by performing metal plating on a conductor layer includes performing the metalplating while bringing a hard contact surface having high smoothness and a contact body 110 having minute through-holes through which the plating liquid 106 can pass and are 10
5 to 10
9 pieces per 1 cm
2 in the number of pieces per unit area into contact with the conductor layer. Also, the plating equipment has a plating bath for holding the plating liquid, an anode, a holding means for applying a cathode potential to a substrate which is formed with the conductor layer and has the microgrooves and/or microholes holding and a power source. The contact body having the hard contact surface capable of supplying the plating liquid and the minute through-holes 111 is arranged between the anode and the substrate while contacting with the conductive layer on the substrate.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在电路形微槽和/或微孔中选择性地沉积铜电镀的方法。解决方案：通过在导体层上进行金属电镀将金属填充到微槽和/或微孔105中的电镀方法包括在提供具有高平滑度的硬接触表面的同时进行金属镀层以及具有微小通孔的接触体110 电镀液106可以通过它们，每单位面积的数量，每1厘米 2 分别为10个SP＆lt; SP＆gt;到10个SP＆gt; 9＆lt; SP＆gt; 与导体层接触。此外，电镀设备具有用于保持电镀液的电镀液，阳极，用于向形成有导体层并具有微槽和/或微孔保持的基板和电源施加阴极电位的保持装置。具有能够供应电镀液的硬接触表面和微小通孔111的接触体布置在阳极和基板之间，同时与基板上的导电层接触。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2005139519A Plating liquid management system, and plating apparatus 审中-公开
标题翻译：涂料液体管理系统和涂装设备
公开(公告)号：JP2005139519A
公开(公告)日：2005-06-02
申请号：JP2003377952
申请日：2003-11-07
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAHODA TAKESHI , NAKADA TSUTOMU , MISHIMA KOJI
IPC分类号： C25D21/14
摘要： PROBLEM TO BE SOLVED: To provide a plating liquid management system where the concentration of a surfactant in a plating liquid can be easily measured, and further, maintenance can be easily performed, to provide a plating device provided with the system, and to provide a plating liquid management method.
SOLUTION: The plating liquid management system is provided with: a plating liquid control tank; a surfactant concentration measurement part; a surfactant feed part; and a control part, wherein the surfactant concentration measurement part has a stalagmometer. As the stalagmometer, preferably, Traube's stalagmometer is used. The plating apparatus for forming a metal plating film on a seed layer of the surface of a substrate is provided with: a load/unload part; a substrate conveyance apparatus: a cleaning unit for cleaning the substrate; a plating application apparatus; a plating liquid control tank; a surfactant concentration measurement part; and a surfactant feed part, wherein the concentration of a surfactant is measured by the stalagmometer, and, based on the result, the surfactant feed part adds a surfactant to a plating liquid, thereby controlling the concentration of the surfactant in the plating liquid.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电镀液管理系统，其中可以容易地测量电镀液中的表面活性剂的浓度，并且还可以容易地进行维护，以提供具有该系统的电镀装置，以及提供电镀液管理方法。电解液管理系统设有：电镀液控制箱; 表面活性剂浓度测定部; 表面活性剂进料部分; 和对照部分，其中所述表面活性剂浓度测量部分具有定标仪。作为标定仪，最好使用Traube的标定仪。在基板的表面的种子层上形成金属电镀膜的电镀装置具备：负载/卸载部; 基板输送装置;清洗基板的清洗单元; 电镀应用装置; 电镀液控制罐; 表面活性剂浓度测定部; 和表面活性剂进料部分，其中通过标定仪测量表面活性剂的浓度，并且基于结果，表面活性剂进料部分向电镀液中加入表面活性剂，由此控制表面活性剂在电镀液中的浓度。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004363422A Plating method 审中-公开
公开(公告)号：JP2004363422A
公开(公告)日：2004-12-24
申请号：JP2003161666
申请日：2003-06-06
申请人： Ebara Corp , Ebara Udylite Kk , 株式会社荏原製作所 , 荏原ユージライト株式会社
发明人： NAKADA TSUTOMU , SAHODA TAKESHI , MISHIMA KOJI , KIMIZUKA RYOICHI , KOBAYASHI TAKESHI
IPC分类号： C25D3/38 , C25D7/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide a plating method capable of imparting a superior in-plane uniformity and a superior embedability for a micro damascene structure to a thin-film seed layer.
SOLUTION: The plating method for forming a plating film on a conductive material layer comprises the steps of giving a cathode potential to a conductive material layer formed on at least a part of a structure having an unevenly shaped pattern formed on a semiconductor substrate, and supplying a plating solution electrically contacting an anode to the conductive material layer. The plating solution includes a copper ion of 25 to 75 g/l and an organic acid or an inorganic acid of not less than 0.4 mol/l, and an electrical resistor is provided between the conductive material layer and the anode.
COPYRIGHT: (C)2005,JPO&NCIPI

8. 发明专利

JP2007009247A Substrate processing apparatus and substrate processing method 审中-公开
标题翻译：基板处理装置和基板处理方法
公开(公告)号：JP2007009247A
公开(公告)日：2007-01-18
申请号：JP2005188959
申请日：2005-06-28
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKADA TSUTOMU , SAHODA TAKESHI
IPC分类号： C25D17/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which, when filling recesses, such as wiring trough and contact holes formed in a surface of a substrate, with a plated metal, can avoid the formation of voids in the plated metal without a decrease in the production efficiency.
SOLUTION: The substrate processing apparatus comprises: a liquid application section for applying a liquid containing a dissolved plating inhibiting material to the substrate to be processed; a drying section for drying the liquid which has been applied to the substrate in the liquid application section; and a plating section for carrying out plating of the substrate which has been dried-in the drying section.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种基板处理装置和基板处理方法，当填充形成在基板的表面中的布线槽和接触孔的凹槽与电镀金属时，可以避免形成电镀金属中的空隙不会降低生产效率。基板处理装置包括：液体施加部，其将含有溶解的抑镀材料的液体施加到待加工的基板; 用于干燥已经施加到所述液体施加部中的所述基板的液体的干燥部; 以及在干燥部中进行已干燥的基板的电镀的电镀部。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2006131961A Plating method and device for substrate 审中-公开
标题翻译：基板的镀层方法和装置
公开(公告)号：JP2006131961A
公开(公告)日：2006-05-25
申请号：JP2004322958
申请日：2004-11-05
申请人： Ebara Corp , 株式会社荏原製作所
发明人： SAIJO YASUHIKO , HAYAFUSA KEISUKE , SAHODA TAKESHI , HAYASE KIMINORI
IPC分类号： C25D7/12 , C25D5/10 , C25D17/00 , H01L21/288 , H01L21/3205
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for plating a substrate where, in a process of closely and uniformly plating fine cavities such as fine grooves for wiring formed on a substrate with copper, a copper alloy or the like, the abnormal rising phenomenon (over plate) of a plating film as the harmful effect of bottom up film deposition (preferential growth from trench or via bottoms) can be suppressed.
SOLUTION: In the plating method for a substrate where metal is filled into fine cavities on a substrate W, after first plating treatment is performed in a plating liquid with a plating accelerator added thereto, a plating accelerator removing treatment where the surface to be plated is brought into contact with a removal agent for removing or reducing the plating accelerator stuck to the surface to be plated is performed, and further, second plating treatment is performed.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于电镀基板的方法和装置，其中在使用铜，铜合金等在基板上形成的用于布线的细槽的精细空腔如此紧密且均匀地镀覆的过程中可以抑制电镀膜的异常上升现象（过板）作为自底向下沉积（从沟槽或底部的优先生长）的有害影响。解决方案：在将金属填充到基板W上的细小空腔中的基板的电镀方法中，在添加有电镀促进剂的电镀液中进行第一次电镀处理后，进行电镀促进剂去除处理，使电镀与去除或除去附着在被镀表面上的电镀加速剂的除去剂接触，进一步进行第二电镀处理。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005171288A Plating device and plating method 审中-公开
标题翻译：镀层装置和镀层方法
公开(公告)号：JP2005171288A
公开(公告)日：2005-06-30
申请号：JP2003409942
申请日：2003-12-09
申请人： Ebara Corp , 株式会社荏原製作所
发明人： NAKADA TSUTOMU , SAHODA TAKESHI , KUBOTA MAKOTO , MISHIMA KOJI
IPC分类号： C25D7/12 , C25D17/00 , C25D17/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To bury metal such as copper in recessed parts such as via holes, e.g., with an inside diameter of several tens μm formed on the surface of a substrate by plating without generating voids and thus deteriorating productive efficiency.
SOLUTION: The device comprises: a substrate holder 20 holding a substrate 10 in which an electric conductor layer is formed at least on a part of the surface; an anode 30 arranged at the position confronted with the electric conductor layer 14 of the substrate 10 held by the substrate holder 20; and auxiliary anodes 50 with fine hollow shape projecting toward the electric conductor layer 14 through the anode 30, and electrically connected with the anode 30 so as to be fixed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过电镀而不产生空隙，将诸如铜之类的金属掩埋在诸如形成在基板表面上的数十μm内径的通孔等凹陷部分中，从而降低生产效率。解决方案：该装置包括：保持基板10的基板保持件20，其中至少在表面的一部分上形成导电体层; 布置在与衬底保持器20保持的衬底10的导电体层14相对的位置处的阳极30; 以及具有通过阳极30向导电体层14突出的细中空形状的辅助阳极50，并且与阳极30电连接以被固定。版权所有（C）2005，JPO＆NCIPI

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