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    • 12. 发明授权
    • Single electron transistor using porous silicon and manufacturing method thereof
    • 使用多孔硅的单电子晶体管及其制造方法
    • US06479365B2
    • 2002-11-12
    • US10090169
    • 2002-03-05
    • Jo-won LeeChung-woo KimByong-man KimMoon-kyung Kim
    • Jo-won LeeChung-woo KimByong-man KimMoon-kyung Kim
    • H01L2176
    • H01L29/7613B82Y10/00H01L29/16Y10S438/96Y10S977/937
    • A single electron transistor using porous silicon, which is fabricated by applying porous silicon having a size of several tens of nanometers obtained by electrochemically etching silicon, and a fabrication method thereof, are provided. In the single electron transistor using porous silicon, silicon pores, each of which has a diameter of 5 nm or less, are fabricated by electrochemically etching a silicon on insulator (SOI) substrate having silicon dioxide (SiO2) in its lower portion using an HF-based solution, and serve as islands of a single electron transistor. Also, a source and a drain are formed of silicon on which metal is deposited or silicon doped with impurities. Hence, formation of islands and tunnel barriers is easy, mass production is possible, and the sizes of islands can be controlled by oxidation, so that single electron transistors capable of operating at room temperature can be easily fabricated.
    • 提供了通过使用通过电化学蚀刻硅获得的尺寸为几十纳米的多孔硅制造的使用多孔硅的单电子晶体管及其制造方法。 在使用多孔硅的单电子晶体管中,通过使用HF在其下部电化学蚀刻其下部具有二氧化硅(SiO 2)的绝缘体上硅(SOI)衬底,制造每个具有5nm或更小直径的硅孔。 的溶液,并且用作单电子晶体管的岛。 此外,源极和漏极由其上沉积有金属的硅或掺杂有杂质的硅形成。 因此,岛和隧道壁垒的形成是容易的,批量生产是可能的,并且可以通过氧化来控制岛的尺寸,使得能够容易地制造能够在室温下操作的单电子晶体管。
    • 14. 发明授权
    • Method and apparatus for inspecting target defects on a wafer
    • 用于检查晶片上的目标缺陷的方法和装置
    • US07426031B2
    • 2008-09-16
    • US11461726
    • 2006-08-01
    • Moon-Kyung KimChung-Sam JunYu-Sin Yang
    • Moon-Kyung KimChung-Sam JunYu-Sin Yang
    • G01B9/08G01N21/00
    • G01N21/9501
    • A defect inspecting apparatus includes a first support unit supporting a standard sample having standard defects, a second support unit supporting a wafer having target defects, a light source irradiating an incident light to the standard sample or the wafer, a light receiving part collecting reflection light reflected from the standard sample and the wafer, a detection part detecting the standard defects and the target defects by using the reflection light, a comparing part comparing information obtained using the reflection light reflected from the standard sample with a predetermined standard information of the standard defects to confirm a reliability of a step for detecting the target defects and a determination portion determining whether the step is allowed to be performed or not.
    • 缺陷检查装置包括支撑具有标准缺陷的标准样品的第一支撑单元,支撑具有目标缺陷的晶片的第二支撑单元,向标准样品或晶片照射入射光的光源,收集反射光的光接收部 从标准样品和晶片反射的检测部分,通过使用反射光检测标准缺陷和目标缺陷的检测部分,将使用从标准样品反射的反射光获得的信息与标准缺陷的预定标准信息进行比较的比较部分 以确认用于检测目标缺陷的步骤的可靠性,并且确定部分确定是否允许执行该步骤。
    • 19. 发明授权
    • SONOS memory device
    • SONOS存储设备
    • US07187030B2
    • 2007-03-06
    • US10867706
    • 2004-06-16
    • Soo-doo ChaeChung-woo KimJo-won LeeMoon-kyung Kim
    • Soo-doo ChaeChung-woo KimJo-won LeeMoon-kyung Kim
    • H01L29/792
    • H01L29/792G11C16/0466
    • A SONOS memory device, and a method of erasing data from the same, includes injecting charge carriers of a second sign into a trapping film, which traps charge carriers of a first sign to store data therein. The charge carriers of the second sign are generated by an electric field formed between one of a first and second electrodes contacting at least one bit line and a gate electrode contacting a word line. A blocking film may be provided between the gate electrode and the trapping film. The charge carriers of the second sign may be hot holes. This erasing improves erasing speed, thereby improving performance of the SONOS memory device.
    • SONOS存储器件和从其中擦除数据的方法包括将第二符号的电荷载体注入陷阱膜,捕获膜俘获第一符号的电荷载体以在其中存储数据。 第二符号的电荷载体由形成在与至少一个位线接触的第一和第二电极中的一个与接触字线的栅电极之间的电场产生。 可以在栅电极和捕获膜之间设置阻挡膜。 第二标志的电荷载体可能是热孔。 这种擦除提高了擦除速度,从而提高了SONOS存储器件的性能。