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    • 1. 发明申请
    • METHOD AND APPARATUS FOR INSPECTING TARGET DEFECTS ON A WAFER
    • 用于检测波峰的目标缺陷的方法和装置
    • US20070030478A1
    • 2007-02-08
    • US11461726
    • 2006-08-01
    • Moon-Kyung KIMChung-Sam JUNYu-Sin YANG
    • Moon-Kyung KIMChung-Sam JUNYu-Sin YANG
    • G01N21/88
    • G01N21/9501
    • A defect inspecting apparatus includes a first support unit supporting a standard sample having standard defects, a second support unit supporting a wafer having target defects, a light source irradiating an incident light to the standard sample or the wafer, a light receiving part collecting reflection light reflected from the standard sample and the wafer, a detection part detecting the standard defects and the target defects by using the reflection light, a comparing part comparing information obtained using the reflection light reflected from the standard sample with a predetermined standard information of the standard defects to confirm a reliability of a step for detecting the target defects and a determination portion determining whether the step is allowed to be performed or not.
    • 缺陷检查装置包括支撑具有标准缺陷的标准样品的第一支撑单元,支撑具有目标缺陷的晶片的第二支撑单元,向标准样品或晶片照射入射光的光源,收集反射光的光接收部 从标准样品和晶片反射的检测部分,通过使用反射光检测标准缺陷和目标缺陷的检测部分,将使用从标准样品反射的反射光获得的信息与标准缺陷的预定标准信息进行比较的比较部分 以确认用于检测目标缺陷的步骤的可靠性,并且确定部分确定是否允许执行该步骤。