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    • 16. 发明授权
    • Method for fabricating chalcogenide-applied memory
    • 制备硫族化物应用记忆的方法
    • US07381982B2
    • 2008-06-03
    • US11213533
    • 2005-08-26
    • Ming-Hsiang Hsueh
    • Ming-Hsiang Hsueh
    • H01L47/00
    • H01L45/1273H01L27/2409H01L45/04H01L45/1233H01L45/141H01L45/1666H01L45/1683Y10S438/90
    • A chalcogenide memory cell includes a lower electrode, a chalcogenide layer, and an upper electrode. The lower electrode includes a tapered cavity. The chalcogenide layer is formed in the tapered cavity of the lower electrode. One side of the chalcogenide layer is adjacent to the lower electrode. The upper electrode is formed in a second cavity formed by the chalcogenide layer so that the upper electrode substantially fills the second cavity. The upper electrode is adjacent to the other side of the chalcogenide layer. Information is stored and retrieved by passing current between the upper electrode and the lower electrode. The tapered cavity of the lower electrode is formed through anisotropic etching or through sidewall-application. Undesired currents are prevented using an additional dielectric layer or by using an additional conductive layer that forms a p-n junction with the lower electrode.
    • 硫族化物存储单元包括下电极,硫族化物层和上电极。 下电极包括锥形腔。 硫族化物层形成在下电极的锥形空腔中。 硫属化物层的一侧与下电极相邻。 上电极形成在由硫族化物层形成的第二空腔中,使得上电极基本上填充第二腔。 上电极与硫族化物层的另一侧相邻。 通过在上部电极和下部电极之间传递电流来存储和检索信息。 下电极的锥形腔通过各向异性蚀刻或通过侧壁施加形成。 使用额外的电介质层或通过使用与下电极形成p-n结的附加导电层来防止不期望的电流。
    • 18. 发明授权
    • Memory structure and operating method thereof
    • 存储器结构及其操作方法
    • US07593262B2
    • 2009-09-22
    • US11637155
    • 2006-12-12
    • Chao-I WuMing-Hsiang Hsueh
    • Chao-I WuMing-Hsiang Hsueh
    • G11C16/04
    • G11C16/10
    • A method for operating memory used for enabling the memory device to have a first threshold voltage or a second threshold voltage is provided. The method includes the following procedures. First, an operating voltage is applied to a gate of the memory device for a first time period, such that the memory device has the first threshold voltage. Next, the same operating voltage is applied to the gate of the memory for a second time period, such that the memory device has a second threshold voltage. The duration of the first time period is different from the duration of the second time period.
    • 提供了一种用于操作用于使存储器件具有第一阈值电压或第二阈值电压的存储器的方法。 该方法包括以下步骤。 首先,将操作电压施加到存储器件的栅极第一时间段,使得存储器件具有第一阈值电压。 接下来,将相同的工作电压施加到存储器的栅极第二时间段,使得存储器件具有第二阈值电压。 第一时间段的持续时间与第二时间段的持续时间不同。
    • 20. 发明申请
    • METHOD OF MANUFACTURING NON-VOLATILE MEMORY
    • 制造非易失性存储器的方法
    • US20080057651A1
    • 2008-03-06
    • US11468575
    • 2006-08-30
    • Ming-Hsiang Hsueh
    • Ming-Hsiang Hsueh
    • H01L21/8234
    • H01L27/105H01L27/11521
    • A method of manufacturing a non-volatile memory including the following steps is provided. First, a dielectric layer, a first conductive layer and a patterned mask layer are sequentially formed on a substrate. A portion of the first conductive layer is removed using the patterned mask layer as a mask to form a plurality of first gates. An oxidation process is performed to form an oxide layer on the sidewalls of the first gates. The patterned mask layer is removed. A plurality of second gates is formed between two adjacent first gates so that the first gates and the second gates co-exist to form a memory cell column. A doped region is formed in the substrate adjacent to the memory cell column.
    • 提供一种制造包括以下步骤的非易失性存储器的方法。 首先,在基板上依次形成电介质层,第一导电层和图案化掩模层。 使用图案化掩模层作为掩模去除第一导电层的一部分以形成多个第一栅极。 执行氧化处理以在第一栅极的侧壁上形成氧化物层。 去除图案化的掩模层。 在两个相邻的第一栅极之间形成多个第二栅极,使得第一栅极和第二栅极共存以形成存储单元列。 在与存储单元列相邻的衬底中形成掺杂区域。