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    • 2. 发明授权
    • Three-dimensional semiconductor structure
    • 三维半导体结构
    • US08304755B2
    • 2012-11-06
    • US12372860
    • 2009-02-18
    • Ming-Chang Kuo
    • Ming-Chang Kuo
    • H01L47/00
    • G11C11/5685G11C13/0007G11C2213/34G11C2213/71G11C2213/72H01L27/0688H01L27/2409H01L27/2481H01L45/04H01L45/1233H01L45/146H01L45/1633
    • A three-dimensional (3D) semiconductor structure with high density and method of fabricating the same are disclosed. The 3D semiconductor structure comprises at least a first memory cell and a second memory cell stacked on the first memory cell. The first memory cell comprises a first conductive line and a second conductive line. The second memory cell comprises another first conductive line opposite to the first conductive line of the first memory cell, and the second conductive line formed between said two first conductive lines of the first and second memory cells. The first and second memory cells share the second conductive line when the 3D semiconductor structure is programming and erasing, and each of the first and second memory cells has a diode.
    • 公开了一种具有高密度的三维(3D)半导体结构及其制造方法。 3D半导体结构包括至少第一存储单元和堆叠在第一存储单元上的第二存储单元。 第一存储单元包括第一导线和第二导线。 第二存储单元包括与第一存储单元的第一导线相对的另一第一导线,以及形成在第一和第二存储单元的所述两个第一导线之间的第二导线。 当3D半导体结构编程和擦除时,第一和第二存储单元共享第二导线,并且第一和第二存储单元中的每一个具有二极管。
    • 3. 发明授权
    • Non-volatile memory
    • 非易失性存储器
    • US07936607B2
    • 2011-05-03
    • US12465872
    • 2009-05-14
    • Ming-Chang Kuo
    • Ming-Chang Kuo
    • G11C11/34G11C16/04
    • G11C16/3404
    • A non-volatile memory includes a plurality of cells on a substrate of a first conductivity type, each cell including a portion of the substrate, a control gate, a charge-storing layer between the portion of the substrate and the control gate, and two S/D regions of a second conductivity type in the portion of the substrate. A circuit provides a first voltage to the substrate and a second voltage to both S/D regions of each cell, wherein the difference between the first and second voltages is sufficient to cause band-to-band tunneling hot holes. The circuit also provides a voltage to the control gate and the period of applying the voltages are controlled such that the threshold voltages of all the cells converge in a tolerable range.
    • 非挥发性存储器包括在第一导电类型的衬底上的多个单元,每个单元包括衬底的一部分,控制栅极,在衬底的部分和控制栅极之间的电荷存储层,以及两个 第二导电类型的S / D区域在衬底的该部分中。 电路向基板提供第一电压,并向每个单元的两个S / D区域提供第二电压,其中第一和第二电压之间的差值足以引起带对隧道的热孔。 电路还向控制栅极提供电压,并且控制施加电压的周期使得所有单元的阈值电压在可容许的范围内收敛。
    • 5. 发明授权
    • Method for performing operations by applying periodic voltage pulses to control gate of an ono memory cell
    • 通过施加周期性电压脉冲来控制存储单元的栅极来执行操作的方法
    • US07778081B2
    • 2010-08-17
    • US11945181
    • 2007-11-26
    • Ming-Chang Kuo
    • Ming-Chang Kuo
    • G11C11/34G11C16/04
    • G11C16/0466G11C16/3468G11C16/3477G11C16/3486
    • A method for performing operations on a memory cell is described. The memory cell includes a substrate, a first doping region and a second doping region. The first doping region and the second doping region are formed on the substrate with a channel region therebetween. A dielectric layer is formed above the channel region and a conductive gate is formed over the dielectric layer. The method includes applying a first constant voltage for a first period to the conductive gate followed by applying a second constant voltage for a second period to the conductive gate repeatedly. The value of the first constant voltage is different from the value of the second constant voltage. A third constant voltage and a fourth voltage are applied to the first doping region and the second doping region respectively.
    • 描述了对存储器单元执行操作的方法。 存储单元包括衬底,第一掺杂区和第二掺杂区。 第一掺杂区域和第二掺杂区域形成在衬底上,其间具有沟道区域。 介电层形成在沟道区上方,导电栅极形成在电介质层的上方。 该方法包括将第一周期的第一恒定电压施加到导电栅极,然后将第二周期的第二恒定电压重复施加到导电栅极。 第一恒定电压的值与第二恒定电压的值不同。 第三恒定电压和第四电压分别施加到第一掺杂区域和第二掺杂区域。
    • 8. 发明授权
    • Reset method of non-volatile memory
    • 非易失性存储器的复位方法
    • US07554851B2
    • 2009-06-30
    • US11620450
    • 2007-01-05
    • Ming-Chang Kuo
    • Ming-Chang Kuo
    • G11C11/34G11C16/04
    • G11C16/3404
    • A reset method of a non-volatile memory is described. The non-volatile memory includes a plurality of cells on a substrate of a first conductivity type, each including a portion of the substrate, a control gate, a charge-storing layer between the portion of the substrate and the control gate, and two S/D regions of a second conductivity type in the portion of the substrate. The reset method utilizes a DSB-BTBTHH effect. A first voltage is applied to the substrate and a second voltage to both S/D regions of each cell, wherein the difference between the first and second voltages is sufficient to cause band-to-band tunneling hot holes. A voltage applied to the control gate and the period of applying the voltages are controlled such that the threshold voltages of all the cells converge in a tolerable range.
    • 描述非易失性存储器的复位方法。 非易失性存储器包括在第一导电类型的衬底上的多个单元,每个单元包括衬底的一部分,控制栅极,在衬底的部分和控制栅极之间的电荷存储层,以及两个S / D区域的第二导电类型。 复位方法使用DSB-BTBTHH效果。 向基板施加第一电压,对每个单元的两个S / D区域施加第二电压,其中第一和第二电压之间的差异足以引起带对隧道的热孔。 控制施加到控制栅极的电压和施加电压的周期,使得所有单元的阈值电压在可容许的范围内收敛。