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1. 发明申请

US20080164513A1 NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND A METHOD OF FABRICATING A NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE 有权
标题翻译：非挥发性半导体存储器件以及制造非易失性半导体存储器件的方法
公开(公告)号：US20080164513A1
公开(公告)日：2008-07-10
申请号：US11693716
申请日：2007-03-30
申请人： Yen-Hao Shih , Ming-Hsiang Hsueh , Erh-Kun Lal , Chia-Wei Wu , Chi-Pin Lu , Jung-Yu Hsieh
发明人： Yen-Hao Shih , Ming-Hsiang Hsueh , Erh-Kun Lal , Chia-Wei Wu , Chi-Pin Lu , Jung-Yu Hsieh
IPC分类号： H01L29/792 , H01L21/336
CPC分类号： H01L29/42332 , H01L21/28273 , H01L21/28282 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： The present invention relates to a memory device and a method of fabricating the same. The memory device comprises a substrate, a tunnel dielectric film on the substrate, pairs of source and drain regions formed in the substrate, and a number of separate storage blocks between each pair of the source and drain regions. Each storage wire block includes a storage medium and a silicon dioxide layer. Two storage blocks are separated by an interval of at least 100 angstroms.
摘要翻译：本发明涉及一种存储器件及其制造方法。存储器件包括衬底，衬底上的隧道电介质膜，形成在衬底中的源区和漏区对，以及在每对源区和漏区之间的多个分开的存储块。每个存储线块包括存储介质和二氧化硅层。两个存储块以至少100埃的间隔分开。

2. 发明授权

US07521321B2 Method of fabricating a non-volatile semiconductor memory device 有权
标题翻译：制造非易失性半导体存储器件的方法
公开(公告)号：US07521321B2
公开(公告)日：2009-04-21
申请号：US11693716
申请日：2007-03-30
申请人： Yen-Hao Shih , Ming-Hsiang Hsueh , Erh-Kun Lai , Chia-Wei Wu , Chi-Pin Lu , Jung-Yu Hsieh
发明人： Yen-Hao Shih , Ming-Hsiang Hsueh , Erh-Kun Lai , Chia-Wei Wu , Chi-Pin Lu , Jung-Yu Hsieh
IPC分类号： H01L21/336
CPC分类号： H01L29/42332 , H01L21/28273 , H01L21/28282 , H01L29/42348 , H01L29/7887 , H01L29/7923
摘要： The present invention relates to a memory device and a method of fabricating the same. The memory device comprises a substrate, a tunnel dielectric film on the substrate, pairs of source and drain regions formed in the substrate, and a number of separate storage blocks between each pair of the source and drain regions. Each storage wire block includes a storage medium and a silicon dioxide layer. Two storage blocks are separated by an interval of at least 100 angstroms.
摘要翻译：本发明涉及一种存储器件及其制造方法。存储器件包括衬底，衬底上的隧道电介质膜，形成在衬底中的源区和漏区对，以及在每对源区和漏区之间的多个分开的存储块。每个存储线块包括存储介质和二氧化硅层。两个存储块以至少100埃的间隔分开。

3. 发明授权

US07795088B2 Method for manufacturing memory cell 有权
标题翻译：制造存储单元的方法
公开(公告)号：US07795088B2
公开(公告)日：2010-09-14
申请号：US11753850
申请日：2007-05-25
申请人： Tzu-Hsuan Hsu , Ming-Hsiang Hsueh , Yen-Hao Shih , Chia-Wei Wu
发明人： Tzu-Hsuan Hsu , Ming-Hsiang Hsueh , Yen-Hao Shih , Chia-Wei Wu
IPC分类号： H01L21/8238
CPC分类号： H01L21/28282 , H01L29/42352 , H01L29/66833 , H01L29/792
摘要： A method for manufacturing memory cells is provided. First, a substrate is provided, wherein a liner layer and a material layer have already been sequentially formed on the substrate. Thereafter, a patterned mask layer is formed on the substrate. Then, the patterned mask layer is trimmed. Subsequently, a portion of the material layer, a portion of the liner layer and a portion of the substrate are removed by using the patterned mask layer as a mask to define a plurality of fin-structures in the substrate. Afterward, the patterned mask layer is removed and a plurality of isolation structures among the fin structures is formed. The surface of the isolation structures is lower than that of the fin structures. Following that, charge trapping structures are formed on the substrate, covering the fin structures. Succeeding, a portion of the charge trapping structures is removed to expose the material layer. Then, the treatment process turns the material layer into a protection layer. Subsequently, a gate is formed on the substrate and straddles the protection layer, the charge trapping structures and the fin structure. Afterward, source/drain regions are formed in the fin-structure exposed by both sides of the gate.
摘要翻译：提供一种用于制造存储器单元的方法。首先，提供衬底，其中衬底层和材料层已经顺序形成在衬底上。此后，在衬底上形成图案化掩模层。然后，修整图案化的掩模层。随后，通过使用图案化掩模层作为掩模来去除材料层的一部分，衬垫层的一部分和衬底的一部分，以在衬底中限定多个鳍结构。之后，去除图案化的掩模层，并且形成翅片结构中的多个隔离结构。隔离结构的表面比翅片结构的表面低。之后，在基片上形成电荷俘获结构，覆盖翅片结构。成功地，去除一部分电荷捕获结构以暴露材料层。然后，处理过程将材料层转变成保护层。随后，在基板上形成栅极，跨越保护层，电荷捕获结构和鳍结构。之后，源极/漏极区域形成在由栅极两侧暴露的鳍状结构中。

4. 发明申请

US20080290397A1 MEMORY CELL AND METHOD FOR MANUFACTURING AND OPERATING THE SAME 有权
标题翻译：存储单元及其制造和操作的方法
公开(公告)号：US20080290397A1
公开(公告)日：2008-11-27
申请号：US11753850
申请日：2007-05-25
申请人： Tzu-Hsuan Hsu , Ming-Hsiang Hsueh , Yen-Hao Shih , Chia-Wei Wu
发明人： Tzu-Hsuan Hsu , Ming-Hsiang Hsueh , Yen-Hao Shih , Chia-Wei Wu
IPC分类号： H01L29/792 , H01L21/336
CPC分类号： H01L21/28282 , H01L29/42352 , H01L29/66833 , H01L29/792
摘要： A memory cell is disposed on a substrate having plurality of isolation structures that define at least a fin structure in the substrate, wherein the surface of the fin structure is higher than that of the isolation structures. The memory cell includes a gate, a charge trapping structure, a protection layer and two source/drain regions. The gate is disposed on the substrate,and straddled the fin structure. The charge trapping structure is disposed between the gate and the fin structure. The protection layer is disposed between the upper portion of the fin structure and the gate separating the charge trapping structure. The source/drain regions are disposed in the fin structure at both sides of the gate.
摘要翻译：存储单元设置在具有多个隔离结构的衬底上，所述隔离结构在衬底中至少限定翅片结构，其中鳍结构的表面高于隔离结构的表面。存储单元包括栅极，电荷俘获结构，保护层和两个源极/漏极区域。栅极设置在基板上，并跨接在翅片结构上。电荷捕获结构设置在栅极和鳍结构之间。保护层设置在翅片结构的上部和分离电荷捕获结构的栅极之间。源极/漏极区域设置在栅极两侧的鳍结构中。

5. 发明授权

US09246015B2 Vertical channel transistor structure and manufacturing method thereof 有权
标题翻译：垂直沟道晶体管结构及其制造方法
公开(公告)号：US09246015B2
公开(公告)日：2016-01-26
申请号：US12892044
申请日：2010-09-28
申请人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
发明人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
IPC分类号： H01L29/66 , H01L29/792 , H01L27/115 , H01L29/423 , H01L27/12
CPC分类号： H01L29/792 , H01L27/115 , H01L27/11568 , H01L27/1203 , H01L29/42352
摘要： A vertical channel transistor structure is provided. The structure includes a substrate, a channel, a cap layer, a charge trapping layer, a source and a drain. The channel is formed in a fin-shaped structure protruding from the substrate. The cap layer is deposited on the fin-shaped structure. The cap layer and the fin-shaped structure have substantially the same width. The charge trapping layer is deposited on the cap layer and on two vertical surfaces of the fin-shaped structure. The gate is deposited on the charge trapping layer and on two vertical surfaces of the fin-shaped structure. The source and the drain are respectively positioned on two sides of the fin-shaped structure and opposite the gate.
摘要翻译：提供了垂直沟道晶体管结构。该结构包括基板，通道，盖层，电荷捕获层，源极和漏极。通道形成为从基板突出的鳍状结构。盖层沉积在鳍状结构上。盖层和鳍状结构具有基本上相同的宽度。电荷俘获层沉积在盖层上和鳍状结构的两个垂直表面上。栅极沉积在电荷捕获层上并在鳍状结构的两个垂直表面上沉积。源极和漏极分别位于鳍状结构的两侧并与栅极相对。

6. 发明申请

US20110012192A1 Vertical Channel Transistor Structure and Manufacturing Method Thereof 审中-公开
标题翻译：垂直沟道晶体管的结构及制造方法
公开(公告)号：US20110012192A1
公开(公告)日：2011-01-20
申请号：US12892044
申请日：2010-09-28
申请人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
发明人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
IPC分类号： H01L29/78
CPC分类号： H01L29/792 , H01L27/115 , H01L27/11568 , H01L27/1203 , H01L29/42352
摘要： A vertical channel transistor structure is provided. The structure includes a substrate, a channel, a cap layer, a charge trapping layer, a source and a drain. The channel is formed in a fin-shaped structure protruding from the substrate. The cap layer is deposited on the fin-shaped structure. The cap layer and the fin-shaped structure have substantially the same width. The charge trapping layer is deposited on the cap layer and on two vertical surfaces of the fin-shaped structure. The gate is deposited on the charge trapping layer and on two vertical surfaces of the fin-shaped structure. The source and the drain are respectively positioned on two sides of the fin-shaped structure and opposite the gate.
摘要翻译：提供了垂直沟道晶体管结构。该结构包括基板，通道，盖层，电荷捕获层，源极和漏极。通道形成为从基板突出的鳍状结构。盖层沉积在鳍状结构上。盖层和鳍状结构具有基本上相同的宽度。电荷俘获层沉积在盖层上和鳍状结构的两个垂直表面上。栅极沉积在电荷捕获层上并在鳍状结构的两个垂直表面上沉积。源极和漏极分别位于鳍状结构的两侧并与栅极相对。

7. 发明授权

US07811890B2 Vertical channel transistor structure and manufacturing method thereof 有权
标题翻译：垂直沟道晶体管结构及其制造方法
公开(公告)号：US07811890B2
公开(公告)日：2010-10-12
申请号：US11545575
申请日：2006-10-11
申请人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
发明人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
IPC分类号： H01L21/336
CPC分类号： H01L29/792 , H01L27/115 , H01L27/11568 , H01L27/1203 , H01L29/42352
摘要： A vertical channel transistor structure is provided. The structure includes a substrate, a channel, a cap layer, a charge trapping layer, a source and a drain. The channel is formed in a fin-shaped structure protruding from the substrate. The cap layer is deposited on the fin-shaped structure. The cap layer and the fin-shaped structure have substantially the same width. The charge trapping layer is deposited on the cap layer and on two vertical surfaces of the fin-shaped structure. The gate is deposited on the charge trapping layer and on two vertical surfaces of the fin-shaped structure. The source and the drain are respectively positioned on two sides of the fin-shaped structure and opposite the gate.
摘要翻译：提供了垂直沟道晶体管结构。该结构包括基板，通道，盖层，电荷捕获层，源极和漏极。通道形成为从基板突出的鳍状结构。盖层沉积在鳍状结构上。盖层和鳍状结构具有基本上相同的宽度。电荷俘获层沉积在盖层上和鳍状结构的两个垂直表面上。栅极沉积在电荷捕获层上并在鳍状结构的两个垂直表面上沉积。源极和漏极分别位于鳍状结构的两侧并与栅极相对。

8. 发明申请

US20080087946A1 Vertical channel transistor structure and manufacturing method thereof 有权
标题翻译：垂直沟道晶体管结构及其制造方法
公开(公告)号：US20080087946A1
公开(公告)日：2008-04-17
申请号：US11545575
申请日：2006-10-11
申请人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
发明人： Tzu-Hsuan Hsu , Yen-Hao Shih , Chia-Wei Wu
IPC分类号： H01L29/76
CPC分类号： H01L29/792 , H01L27/115 , H01L27/11568 , H01L27/1203 , H01L29/42352
摘要： A vertical channel transistor structure is provided. The structure includes a substrate, a channel, a cap layer, a charge trapping layer, a source and a drain. The channel is protruded from the substrate. The cap layer is deposited on the channel. The cap layer and the channel substantially have the same width. The charge trapping layer is deposited on the cap layer and on two vertical surfaces of the channel. The gate is deposited on the charge trapping layer and on two vertical surfaces of the channel. The source and the drain are respectively positioned on two sides of the channel and opposing to the gate.
摘要翻译：提供了垂直沟道晶体管结构。该结构包括基板，通道，盖层，电荷捕获层，源极和漏极。通道从基板突出。盖层沉积在通道上。盖层和通道基本上具有相同的宽度。电荷捕获层沉积在封盖层上和通道的两个垂直表面上。栅极沉积在电荷捕获层上和通道的两个垂直表面上。源极和漏极分别位于通道的两侧并与栅极相对。

9. 发明申请

US20060148197A1 Method for forming shallow trench isolation with rounded corners by using a clean process 审中-公开
标题翻译：通过使用清洁工艺形成具有圆角的浅沟槽隔离的方法
公开(公告)号：US20060148197A1
公开(公告)日：2006-07-06
申请号：US11134372
申请日：2005-05-23
申请人： Chia-Wei Wu , Cheng-Shun Chen , Jung-Yu Hsieh , Ling Yang
发明人： Chia-Wei Wu , Cheng-Shun Chen , Jung-Yu Hsieh , Ling Yang
IPC分类号： H01L21/76 , H01L21/302
CPC分类号： H01L21/30608 , H01L21/76232
摘要： In a method for forming STI in a silicon substrate having a pad oxide over the substrate, a hard mask is formed over the pad oxide, the hard mask and the pad oxide are patterned to form an opening, the silicon substrate is etched through the opening to form a trench, a liner oxide is formed over the trench, an STI insulator is formed in the trench, and the hard mask and the pad oxide are removed. Before the formation of the liner oxide, a clean process is performed that comprises applying silicon-consuming solution to round the top corners of the trench.
摘要翻译：在用于在衬底上具有衬垫氧化物的硅衬底中形成STI的方法中，在衬垫氧化物上方形成硬掩模，对硬掩模和衬垫氧化物进行构图以形成开口，通过开口蚀刻硅衬底为了形成沟槽，在沟槽上形成衬垫氧化物，在沟槽中形成STI绝缘体，并且去除硬掩模和衬垫氧化物。在形成衬垫氧化物之前，执行清洁工艺，其包括将消耗硅消耗溶液施加到沟槽的顶角四周。

10. 发明申请

US20070298583A1 METHOD FOR FORMING A SHALLOW TRENCH ISOLATION REGION 审中-公开
标题翻译：形成浅层分离区的方法
公开(公告)号：US20070298583A1
公开(公告)日：2007-12-27
申请号：US11426650
申请日：2006-06-27
申请人： Chia-Wei Wu , Chen-Wei Liao , Jung-Yu Hsieh , Ling-Wuu Yang , Chin-Ta Su , Chi-Tung Huang
发明人： Chia-Wei Wu , Chen-Wei Liao , Jung-Yu Hsieh , Ling-Wuu Yang , Chin-Ta Su , Chi-Tung Huang
IPC分类号： H01L21/76
CPC分类号： H01L21/76224
摘要： A method for forming a shallow trench isolation region (STI) is disclosed. The method comprises the steps of sequentially forming a pad oxide layer and a nitride silicon layer over a provided substrate. Next, the pad oxide layer, the nitride silicon layer, and the substrate are partially etched to form a trench. An oxide liner and a nitride liner are then formed in the trench. Subsequently, a two-stage high-density plasma chemical vapor deposition process is performed to form a shallow trench isolation region.
摘要翻译：公开了一种用于形成浅沟槽隔离区域（STI）的方法。该方法包括以下步骤：在所提供的衬底上顺序地形成衬垫氧化物层和氮化硅层。接下来，对衬垫氧化物层，氮化物硅层和衬底进行部分蚀刻以形成沟槽。然后在沟槽中形成氧化物衬垫和氮化物衬垫。随后，进行两级高密度等离子体化学气相沉积工艺以形成浅沟槽隔离区域。

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