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    • 12. 发明申请
    • Skew detection device
    • 偏斜检测装置
    • US20050206430A1
    • 2005-09-22
    • US10878444
    • 2004-06-28
    • Jun Gi Choi
    • Jun Gi Choi
    • G11C8/00G01R31/26H03L5/00
    • G01R31/2621G01R31/2628
    • The present invention discloses a skew detection device which can detect a skew of a transistor changed due to a driving voltage, a size and a process variable. The skew detection device includes a first potential level generator for outputting a first voltage, a second potential level generator for outputting a second voltage, a first level shifter for receiving the first voltage and outputting a first shift voltage, a second level shifter for receiving the second voltage and outputting a second shift voltage, and a comparator for comparing the first shift voltage with the second shift voltage. The first voltage is determined according to a drain-source current of a first MOS transistor operated in a linear region, and the second voltage is determined according to a drain-source current of a second MOS transistor operated in a saturation region.
    • 本发明公开了一种可以检测由于驱动电压,尺寸和过程变量而改变的晶体管的偏斜的偏斜检测装置。 偏斜检测装置包括用于输出第一电压的第一电位电平发生器,用于输出第二电压的第二电位电平发生器,用于接收第一电压并输出第一移位电压的第一电平移位器,用于接收第一电压的第二电平移位器 第二电压并输出第二移位电压;以及比较器,用于将第一移位电压与第二移位电压进行比较。 根据在线性区域中工作的第一MOS晶体管的漏 - 源电流来确定第一电压,并且根据在饱和区域中操作的第二MOS晶体管的漏 - 源电流来确定第二电压。
    • 14. 发明授权
    • Method for fabricating a semiconductor device
    • US06333249B2
    • 2001-12-25
    • US09751941
    • 2001-01-02
    • Seon Soon KimJun Gi Choi
    • Seon Soon KimJun Gi Choi
    • H01L213205
    • H01L27/10894H01L21/823842H01L27/10873
    • A method for fabricating a semiconductor device is disclosed. In a process for fabricating a CMOS transistor of a high integrated semiconductor device and a cell of a DRAM, a process for forming a dual gate electrode having a layered structure of a tungsten layer and a polysilicon layer includes the steps of forming a gate electrode shape from an undoped polysilicon layer, forming an insulating film spacer at sidewalls of the polysilicon layer, forming an LDD region, removing a portion of the undoped polysilicon layer to leave a predetermined thickness and to form an opening in which the tungsten layer will be formed, and respectively implanting different impurity ions into the undoped polysilicon layer respectively formed in the PMOS region and the NMOS region before forming the tungsten layer. Thus, it is possible to prevent etching residue from occurring and also prevent the semiconductor substrate from being damaged. In addition, it is possible to prevent the tungsten layer from being oxidized due to a high temperature process such as an ion plantation process for forming the LDD region and the source/drain region, thereby improving operational characteristics of the device and process yield.
    • 19. 发明申请
    • SEMICONDUCTOR APPARATUS AND CHIP SELECTING METHOD THEREOF
    • 半导体器件和芯片选择方法
    • US20110246104A1
    • 2011-10-06
    • US12839356
    • 2010-07-19
    • Jae Bum KOJun Gi CHOI
    • Jae Bum KOJun Gi CHOI
    • G06F19/00
    • G11C8/12G11C29/785G11C29/883H01L2225/06527
    • A semiconductor apparatus includes an individual chip designating code setting block configured to generate a plurality of individual chip designating code of different values; an individual chip activation block configured to enable an individual chip activation signal among a plurality of individual chip activation signals, which corresponds to individual chip designating code, when the individual chip designating code matches the individual chip control code; and a control block configured to set the individual chip control code or output chip selection address as the individual chip control code in response to chip selection fuse signals and test fuse signals.
    • 一种半导体装置,包括单独的芯片指定代码设置块,其被配置为生成不同值的多个独立芯片指定代码; 单个芯片激活块,其被配置为当各个芯片指定代码与单独的芯片控制代码匹配时,使多个独立芯片激活信号中的各个芯片激活信号对应于各个芯片指定代码; 以及控制块,被配置为响应于芯片选择熔丝信号和测试熔丝信号,将单独的芯片控制代码或输出芯片选择地址设置为单独的芯片控制代码。