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    • 103. 发明公开
    • Optical projection systems and methods of producing optical images
    • 光学投影系统和光学图像的制作方法
    • EP0097831A3
    • 1986-05-07
    • EP83105435
    • 1983-06-01
    • International Business Machines Corporation
    • Lin, Burn Jeng
    • G03F07/20G03F01/00
    • G03F7/70283G03F1/50G03F7/20G03F7/2002
    • (D Semiconductor fabrication using optical projection apparatus is enhanced in an arrangement having means for producing exposures tailored to the patterns on the conventional photo-mask. A predetermined correction photo-mask capable of producing different exposure levels according to the original mask pattern is superimposed with the original mask on the semiconductor wafer by sequential double exposure using an additional mask change and alignment. The drawings show an original mask pattern and a correction mask pattern. A better arrangement provides two beams simultaneously illuminating the two masks; the two beams are recombined with a high quality beam splitter arrangement before reaching the imaging lens. The two masks only have to be aligned to each other once. Afterwards, the wafer is exposed regularly. Therefore, an uncorrected image has the lowest threshold for an isolated opening, medium threshold for equal lines and spaces, high threshold for an isolated opaque line. After the correction scheme, all thresholds are made equal. The correction mask is made of grainless dyes of different light transmission or of one semitransparent substance of different thickness, such as thin layers of iron oxide, chromium or silicon. Standard lithographic patterning techniques, such as substractive etching, lift off or plating are used to fabricate the correction mask.
    • 108. 发明公开
    • Photomask blank and photomask
    • 光掩模空白和光掩模
    • EP0049799A3
    • 1982-11-17
    • EP81107702
    • 1981-09-28
    • DAI NIPPON INSATSU KABUSHIKI KAISHA
    • Kaneki, SatoruTabuchi, Kazuhiro
    • G03F01/00
    • G03F1/50G03F1/40
    • A photomask (B) is fabricated by forming, in a photomask (hard mask) produced by forming a patternized film (3a) of a masking material such as metallic chromium, a chromium oxide, a chromium nitride, metallic silicon, a silicon oxide or a mixture thereof on a transparent substrate (1), a metallic film (2) of a translucent and electroconductive material selected from Mo, Nb, Ta, Ti, V, W, Cr, Au and Zr between the masking film (3a) and the transparent substrate (1). At the time of pattern transferring by photolithography, dropping off of parts of the pattern of this photomask does not occur even when it includes isolated island-like parts, and, at the time of inspection by electron-beam exposure, the precision of inspection does not lower. The photomask, by further comprising a chemically resistant and translucent protective film (5) between the electroconductive film (2) and the masking film (3a), is free of destruction of the electroconductive film (2) during the repeated washing between the repeated use of the photomask.
    • 通过在通过形成掩模材料(例如金属铬,氧化铬,氮化铬,金属硅,氧化硅或氧化硅)形成图案化膜(3a)而制成的光掩模(硬掩模)中形成光掩模(B) (1)上的混合物,在掩蔽膜(3a)和掩模膜(3a)之间的选自Mo,Nb,Ta,Ti,V,W,Cr,Au和Zr的半透明导电材料的金属膜(2) 透明基板(1)。 在通过光刻法进行图案转印时,即使在包含孤立的岛状部分的情况下,也不会发生该光掩模的图案的一部分脱落,在利用电子束曝光进行检查时,检查精度 不低。 通过在导电膜(2)和掩蔽膜(3a)之间进一步包括耐化学品且半透明的保护膜(5),光掩模在重复清洗期间不会破坏导电膜(2) 的光罩。
    • 109. 发明公开
    • Method of fabricating X-ray lithographic masks
    • 制备X射线光刻掩模的方法
    • EP0057268A3
    • 1982-11-10
    • EP81109153
    • 1981-10-29
    • International Business Machines Corporation
    • Hofer, Donald Clifford
    • G03F01/00
    • G03F1/22
    • A method is disclosed for fabricating an improved x-ray mask which has a high aspect ratio and vertical side walls. First, a thin electrically conductive film (12) is deposited on top of an x-ray mask substrate (10). The conductive film will later act as an electroplating base but it is also sufficiently thin to be substantially x-ray transparent. A resist pattern (18) is then formed on top of the electroplating base film using an electron beam to expose the resist. The electron beam resist patternwise masks the electroplating base film during subsequent electroplating deposition of an x-ray absorbing layer (20) to form a first x-ray absorbing pattern. An x-ray sensitive resist (40) is then deposited on top of the first x-ray absorbing pattern and exposed to x-rays from the bottom. The first x-ray absorbing pattern thus patternwise shields the x-ray resist. The patternwise exposed x-ray resist is then developed to form an x-ray resist pattern (46). Finally, another layer (48) of x-ray absorbing material is deposited through the x-ray resist pattern by electroplating to form a second x-ray absorbing pattern. In the preferred embodiment, the x-ray resist is positive acting and the first and second x-ray absorbing patterns are complementary. After the second x-ray absorbing pattern is deposited in this embodiment, the first x-ray absorbing pattern is removed.
    • 公开了一种用于制造具有高纵横比和垂直侧壁的改进的x射线掩模的方法。 首先,在x射线掩模基板(10)的顶部上沉积薄导电膜(12)。 导电膜随后将用作电镀基底,但其也足够薄以使其基本上为x射线透明。 然后使用电子束在电镀基底膜的顶部上形成抗蚀剂图案(18)以暴露抗蚀剂。 在随后的x射线吸收层(20)的电镀沉积期间,电子束抗蚀剂以图形方式掩蔽电镀基膜,以形成第一x射线吸收图案。 然后将x射线敏感抗蚀剂(40)沉积在第一x射线吸收图案的顶部上并从底部暴露于x射线。 因此,第一x射线吸收图案图案地屏蔽x射线抗蚀剂。 然后显影图案曝光的x射线抗蚀剂以形成x射线抗蚀剂图案(46)。 最后,通过电镀将X射线吸收材料的另一层(48)穿过X射线抗蚀剂图案沉积以形成第二x射线吸收图案。 在优选实施例中,x射线抗蚀剂是正作用的,并且第一和第二X射线吸收图案是互补的。 在本实施例中沉积第二X射线吸收图案之后,去除第一X射线吸收图案。