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    • 9. 发明申请
    • DEFORMABLE END CAP FOR HEAT PIPE
    • 热管可变端盖
    • WO2003068626A1
    • 2003-08-21
    • PCT/US2003/004227
    • 2003-02-12
    • THERMAL CORP.
    • CONNORS, MatthewGOOD, Arthur, H.
    • B65D59/00
    • F28D15/0283F28D15/04F28F2220/00Y10T29/49353Y10T29/49377
    • A heat pipe (5) is provided having a vessel (10) with a closed first end, a second end (24), and a wick (15) on an inner surface that defines a passageway. A convex wall (20) is positioned at the second end (22) so as to block the passageway (26). The convex wall (20) is deformable so as to move from a first position wherein a portion of the wall is convex to a second position wherein the portion of the wall is concave. The convex wall may include at least one stress concentrator (42) so that upon an application of a force to the convex wall, the stress concentrator (42) causes the convex wall to buckle. A method for forming a heat pipe is also provided comprising coating the interior surface of the vessel with a wicking material and partially saturating the wick with a working fluid. The vessel is then partially evacuated. A portion of the vessel (10) is pinched-off so as to seal the vessel. Then, the pinched-off portion of the vessel (10) is pressed so as to move it from a first position wherein the portion is convex to a second position wherein the portion is concave.
    • 设置有热管(5),其具有封闭的第一端的容器(10),第二端(24)和限定通道的内表面上的芯(15)。 凸壁(20)位于第二端(22)处,以阻挡通道(26)。 凸壁(20)可变形,以便从第一位置移动,其中壁的一部分凸起到第二位置,其中壁的该部分是凹形的。 凸壁可以包括至少一个应力集中器(42),使得当对凸壁施加力时,应力集中器(42)使凸壁弯曲。 还提供了一种用于形成热管的方法,其包括用芯吸材料涂覆容器的内表面并且用工作流体部分地使芯吸收饱和。 然后将容器部分抽空。 容器(10)的一部分被夹紧以密封容器。 然后,将容器(10)的夹断部分按压以使其从第一位置移动,其中该部分是凸形的,其中该部分是凹形的。
    • 10. 发明申请
    • INTEGRATED THERMAL ARCHITECTURE FOR THERMAL MANAGEMENT OF HIGH POWER ELECTRONICS
    • 高功率电子热管理综合热结构
    • WO2003009663A1
    • 2003-01-30
    • PCT/US2002/003955
    • 2002-02-11
    • THERMAL CORP.
    • HOOVER, L., RonaldZUO, JonPHILLIPS, A., L.
    • H05K7/20
    • H05K7/20336F28D15/0266H05K7/20536
    • The present invention provides a thermal energy management architecture (5) for a functioning system of electronic components and subsystems (10) comprising a hierarchical scheme in whic thermal management components are: (i) operatively engaged with individual protions of the system of electronic components (22) and subsystems (24), in multiple defined levels and (ii) substantially only thermally driven, i.e., heat transfer devices (12, 14, 16, 18) that have no moving parts and require no external power for their operations. In one embodiment thermal management devices and technologies are divided into five separate levels within a functioning electronics system. In another embodiment, a sixth level is provided for bypassing one or more of the five levels.
    • 本发明提供了一种用于电子部件和子系统(10)的功能系统的热能管理架构(5),其包括在热管理部件中的分层方案:(i)可操作地与电子部件系统的各个保护件 22)和子系统(24),以及(ii)基本上只有热驱动的热传递装置(12,14,16,18),其不具有运动部件,并且不需要外部动力用于其操作。 在一个实施例中,热管理装置和技术在功能电子系统内分为五个独立的级别。 在另一个实施例中,提供了用于绕过五个等级中的一个或多个的第六级。