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1. 发明申请

WO1992017757A1 DIFFERENTIAL PRESSURE DEVICE 审中-公开
标题翻译：差压装置
公开(公告)号：WO1992017757A1
公开(公告)日：1992-10-15
申请号：PCT/US1992002744
申请日：1992-04-03
申请人： MARK IV TRANSDUCER CORPORATION
发明人： MARK IV TRANSDUCER CORPORATION , MEI, Daniel, L. , TACK, Peter, C.
IPC分类号： G01L09/06
CPC分类号： G01L19/0618 , G01L13/025 , G01L19/0645
摘要： A pressure sensing transmitter (10) is provided that has high overpressure protection. The transmitter (10) includes a housing (12) having a first cell(14), a second cell (16), a sensing chamber (18), first and second pressure signal receiving means (26, 28), and a differential sensor chip (22) for measuring the pressure differential between the first and second pressure signal receiving means (26, 28). Each cell further includes a cylinder (30, 38) with a clearance of an overpressure diaphragm (32, 40) mounted on the housing, an isolation diaphragm (34, 42) mounted on the other face, and a channel (36, 44) coupling the overpressure (32, 40) and isolation diaphragms (34, 42) and further coupling one cell to the first pressure signal receiving means (26) and the other cell to the second pressure signal receiving means (28). Each overpressure diaphragm (32, 40) is positioned such that an overpressure protection cavity (46, 48) is formed between it and the housing. The first cell cavity is further coupled to the second pressure signal receiving means (28) and the second cell cavity is further coupled to the first pressure signal receiving means (26).
摘要翻译：提供具有高过压保护的压力传感发射器（10）。发射器（10）包括具有第一单元（14），第二单元（16），感测室（18），第一和第二压力信号接收装置（26,28）以及差动传感器用于测量第一和第二压力信号接收装置（26,28）之间的压力差的芯片（22）。每个单元还包括具有安装在壳体上的超压隔膜（32,40）的间隙的圆柱体（30,38），安装在另一个面上的隔离隔膜（34,42）和通道（36,44）耦合过压（32,40）和隔离隔膜（34,42），并且将一个电池进一步耦合到第一压力信号接收装置（26），另一个电池耦合到第二压力信号接收装置（28）。每个过压隔膜（32,40）被定位成使得在其与壳体之间形成过压保护腔（46,48）。第一电池腔室还耦合到第二压力信号接收装置（28），并且第二电池腔室还耦合到第一压力信号接收装置（26）。

2. 发明申请

WO1986002446A1 PRESSURE TRANSDUCER 审中-公开
标题翻译：压力传感器
公开(公告)号：WO1986002446A1
公开(公告)日：1986-04-24
申请号：PCT/US1985001957
申请日：1985-10-08
申请人： AMETEK, INC.
发明人： AMETEK, INC. , FRANK, Thomas, P. , PECHTER, David , McFADDEN, Harold, Edward
IPC分类号： G01L09/06
CPC分类号： G01L19/142 , A61B5/0215 , A61B2562/0247 , G01L19/0023 , G01L19/0038 , G01L19/0645 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A transducer includes a fluid inlet port (152) formed with a passageway (154) permitting flow of fluid therethrough and a pedestal (136) having a base (158) and also formed with a passageway (138) permitting flow of fluid therethrough. A resilient seal (140) is disposed between the pedestal (136) and the fluid inlet port (152) so that fluid communication is permitted between the passageways of the port and pedestal. The relationship of the pedestal, port and seal is maintained by a support member (150) which is secured to the fluid inlet port and which contacts the base (158) of the pedestal so as to clamp the pedestal to the port with the seal (140) located therebetween. A pressure sensing element (130) is mounted to the pedestal so that the fluid contacts the sensing element and an indication of the pressure of the fluid is provided. The transducer is part of a pressure sensor used in a hemodynamic blood pressure monitoring system which includes a pressurized IV fluid which is conveyed to the blood stream of a patient, to sense the pressure of the pressurized fluid. A display is coupled to the pressure sensor for displaying the patient's blood pressure.
摘要翻译：传感器包括形成有允许流体流过的通道（154）的流体入口（152），以及具有基部（158）并且还形成有允许流体流过其中的通道（138）的基座（136）。弹性密封件（140）设置在基座（136）和流体入口（152）之间，使得允许在端口和基座的通道之间进行流体连通。基座，端口和密封件的关系由固定到流体入口并与基座的基座（158）接触的支撑构件（150）保持，以便将基座与密封件（ 140）。压力感测元件（130）安装到基座，使得流体接触感测元件并且提供流体的压力的指示。换能器是用于血液动力学血压监测系统中的压力传感器的一部分，其包括被输送到患者的血流的加压IV流体，以感测加压流体的压力。显示器联接到压力传感器以显示患者的血压。

3. 发明申请

WO1985002677A1 PRESSURE TRANSDUCER 审中-公开
标题翻译：压力传感器
公开(公告)号：WO1985002677A1
公开(公告)日：1985-06-20
申请号：PCT/US1984002007
申请日：1984-12-07
申请人： ROSEMOUNT INC.
发明人： ROSEMOUNT INC. , KNECHT, Thomas, A.
IPC分类号： G01L09/06
CPC分类号： G01L9/0075 , G01L13/025
摘要： A transducer (10) has a first (22) and second (24) sensing diaphragm configured such that a first pressure (P1) is applied to the first diaphragm (22) and a second pressure (P2) is applied to the second diaphragm (24) and wherein both diaphragms (22, 24) are formed on the same substantially flat face of a diaphragm wafer (20). The transducer (10) is configured such that each diaphragm (22, 24) responsive to (P1) or (P2) respectively also affects a fluid in a closed common fluid cavity (56) such that the deflection of the diaphragm (22, 24) is representative of the pressure differential (P1 - P2).

4. 发明申请

WO1998005935A1 METHOD FOR PACKAGING MICROSENSORS 审中-公开
标题翻译：包装微型传感器的方法
公开(公告)号：WO1998005935A1
公开(公告)日：1998-02-12
申请号：PCT/US1997013811
申请日：1997-08-07
申请人： INTEGRATED SENSING SYSTEMS, INC.
发明人： INTEGRATED SENSING SYSTEMS, INC. , NAJAFI, Nader , MASSOUD-ANSARI, Sonbol
IPC分类号： G01L09/06
CPC分类号： B81C1/00301 , B81B2207/097 , B81C1/00269 , B81C2203/0109 , B81C2203/019 , G01L19/147 , G01L19/148 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2924/00014 , H01L2924/01322 , H01L2924/00 , H01L2224/45099
摘要： A method for packaging and protection of sensors, particularly so-called microsensors is disclosed. A sensor unit (either a sensor chip or sensor package) is flip chip bonded to a substrate having a through hole, such that the sensing element is placed above the through hole. An underfill material is applied in such a way that due to capillary forces, the entire common area between the sensor and the substrate is completely filled, while the sensing element is not covered by the underfill material. This provides an effective way of sealing the sensing element from the side of the package containing the electronics. For a sensor chip that has been through a first level packaging process, the above mentioned method can still be used for bonding the sensor package to a substrate containing an access hole. For some applications, one or multiple layers of protective coatings can be deposited on either one side or both sides of the sensor package for protection against the operating environment. For applications where the sensor is required to operate in a controlled pressure/controlled gas environment, a cavity can be created into the substrate, and the sensor chip can be flip chip bonded (and/or sealed) to the substrate in a controlled environment. An alternative method of packaging is disclosed where the sensor chip is fixed onto the substrate, and a cap is bonded to this substrate using dummy bumps for mechanical strength.
摘要翻译：公开了用于包装和保护传感器的方法，特别是所谓的微传感器。传感器单元（传感器芯片或传感器封装）被倒装贴合到具有通孔的基板上，使得感测元件放置在通孔的上方。以这样的方式施加底部填充材料，即由于毛细作用力，传感器和基底之间的整个公共区域被完全填充，而感测元件未被底部填充材料覆盖。这提供了从包含电子器件的封装侧密封感测元件的有效方式。对于已经通过第一级封装处理的传感器芯片，上述方法仍然可以用于将传感器封装结合到包含访问孔的基板。对于一些应用，可以在传感器封装的一侧或两侧沉积一层或多层保护涂层，以防止操作环境。对于需要传感器在受控压力/受控气体环境中操作的应用，可以在衬底中形成空腔，并且传感器芯片可以在受控环境中倒装芯片（和/或密封）到衬底。公开了一种替代的包装方法，其中将传感器芯片固定到基板上，并且使用用于机械强度的虚拟凸块将盖接合到该基板。

5. 发明申请

WO1996026423A1 PIEZO-RESISTIVE PRESSURE SENSOR OR PRESSURE DETECTOR 审中-公开
标题翻译：压阻式压力传感器和压力传感器
公开(公告)号：WO1996026423A1
公开(公告)日：1996-08-29
申请号：PCT/EP1996000202
申请日：1996-01-18
申请人： KELLER AG FÜR DRUCKMESSTECHNIK , KELLER, Hans, W.
发明人： KELLER AG FÜR DRUCKMESSTECHNIK
IPC分类号： G01L09/06
CPC分类号： G01L19/0645
摘要： The invention concerns an improved piezo-resistive pressure sensor or piezo-resistive pressure detector with a pressure measurement cell (13), a transmission diaphragm housing (7) comprising an outer casing section, a transmission diaphragm (17) and a back plate (21), and with a fluid pressure chamber (19) situated on the measurement diaphragm side. The proposed sensor is characterised by the fact that the outer casing section of the transmission diaphragm housing (7) has a pressure chamber sleeve (33); the pressure chamber sleeve (33) and back plate (21) are made from weldable steel; the transmission diaphragm housing (7) and thus also the pressure chamber sleeve (33) are or can be sealingly fitted in an annular recess (31) in the connection housing (3); the connection housing (3) consists of non-weldable or poorly weldable material; and the pressure chamber sleeve (33) and back plate (21) are permanently welded together, thus sealing off the pressure transmission medium in the inner pressure chamber (15) so formed of the measurement cell.
摘要翻译：一种改进的压阻式压力传感器或者具有压力测量单元（13），转印膜外壳（7），它由一个护套外壳部，转印膜（17）和后板（21）的改进的压阻压力换能器，和（具有测量膜侧卧流体压力室 19）的特征在于以下特点：所述传输膜外壳（7）的所述护套壳体部分包括一个压力室套筒（33）中，压力室套筒（33）和背面板（21）是由可焊接钢的，转印膜外壳（7）和使得压力腔室套筒（33）密封地在（31）中使用的环形凹部或在连接壳体（3）可插入，该端子壳体（3）是没有，或者不能很好焊接的材料，并且该压力腔室套筒（33）和背面板（21）预见下文中这样形成的测量单元内压力的gedichtetem完成（15） 1S压力传输介质永久地紧包装。

6. 发明申请

WO1993010430A1 SILICON CHIP FOR USE IN A FORCE-DETECTION SENSOR 审中-公开
标题翻译：用于强力检测传感器的硅芯片
公开(公告)号：WO1993010430A1
公开(公告)日：1993-05-27
申请号：PCT/DE1992000870
申请日：1992-10-16
申请人： ROBERT BOSCH GMBH , HERDEN, Werner , MAREK, Jiri , WEIBLEN, Kurt , BANTIEN, Frank , KUESELL, Matthias , SCHMIDT, Steffen
发明人： ROBERT BOSCH GMBH
IPC分类号： G01L09/06
CPC分类号： G01L1/18 , G01L9/0054 , G01L23/18 , Y10S73/04
摘要： Proposed is a silicon chip for use in a force-detection sensor. The chip has circuits (22), piezo-resistive elements (21), an intermediate element (36) and a force-application zone (23). The chip (20) is mounted on a support (38). The piezo-resistive elements (21) are disposed in a zone of high mechanical stress and the circuits (22) in a zone of low mechanical stress. The stress distribution within the chip (20) is modified by, for instance, grooves (122) in the chip.

7. 发明申请

WO1998013679A1 COMPENSATION TECHNIQUE FOR RESISTIVE BRIDGE 审中-公开
标题翻译：电阻桥补偿技术
公开(公告)号：WO1998013679A1
公开(公告)日：1998-04-02
申请号：PCT/US1997017438
申请日：1997-09-29
申请人： HONEYWELL INC.
发明人： HONEYWELL INC. , JOHNSON, Russell, L.
IPC分类号： G01L09/06
CPC分类号： G01L1/2281 , G01L9/065
摘要： Span compensation of a bridge circuit is provided over a wide range of temperatures using only passive resistor elements.
摘要翻译：仅使用无源电阻元件，在宽温度范围内提供桥式电路的跨距补偿。

8. 发明申请

WO1996019719A1 EXCITATION OF POLYSILICON-BASED PRESSURE SENSORS 审中-公开
标题翻译：基于多晶硅的压力传感器的激发
公开(公告)号：WO1996019719A1
公开(公告)日：1996-06-27
申请号：PCT/US1995016200
申请日：1995-12-15
申请人： THE FOXBORO COMPANY
发明人： THE FOXBORO COMPANY , MCHALE, Edward, J. , FUNG, Clifford, D.
IPC分类号： G01L09/06
CPC分类号： G01L9/06 , G01L9/0055
摘要： The object of this invention is to eliminate long-term transient behavior upon electrical excitation of polycrystalline silicon and provide electrical excitation with a minimal stabilization period and utilizing micro-power consumption. This invention comprises an electronic excitation circuit for a polycrystalline silicon sensor that detects the pressure of a process flow. The sensor consists of polycrystalline silicon piezoresistors (22) deposited onto a polycrystalline silicon sensing diaphragm (14) having a dielectric layer (18) interposed in between. Electrical excitation of the piezoresistors is accomplished by an alternating electrical waveform having a constant amplitude of less than 10 volts and at a frequency of less than 100k Hz. The waveform is applied to a first input terminal (40a) of a Wheatstone bridge with an opposite polarity to a second input terminal (40b) of the bridge. The resultant voltage difference between the output terminals is used to detect an imbalance in the electrical resistors induced by applied pressure. The voltage level and frequency range chosen is such that the circuit utilized approximately 1 mW of power.
摘要翻译：本发明的目的是消除多晶硅电激发时的长期瞬态特性，并以最小的稳定周期提供电激励并利用微功耗。本发明包括用于多晶硅传感器的电子激励电路，其检测工艺流程的压力。传感器由多晶硅压敏电阻器（22）组成，沉积在多晶硅感测隔膜（14）上，该多晶硅感测隔膜（14）具有介于其间的电介质层（18）。压敏电阻器的电激励是通过具有小于10伏的恒定振幅并且频率小于100kHz的交流电波形实现的。波形被施加到惠斯通电桥的第一输入端子（40a），其具有与桥的第二输入端子（40b）相反的极性。输出端子之间的合成电压差用于检测施加压力引起的电阻器的不平衡。选择的电压电平和频率范围使得电路使用大约1mW的功率。

9. 发明申请

WO1990015976A1 SINGLE DIAPHRAGM TRANSDUCER WITH MULTIPLE SENSING ELEMENTS 审中-公开
标题翻译：具有多个传感元件的单透镜传感器
公开(公告)号：WO1990015976A1
公开(公告)日：1990-12-27
申请号：PCT/US1990003494
申请日：1990-06-20
申请人： IC SENSORS, INC.
发明人： IC SENSORS, INC. , TERRY, Stephen, Clark , JERMAN, John, Hallock
IPC分类号： G01L09/06
CPC分类号： G01L9/0054 , G01L1/18 , G01L9/0042
摘要： A transducer (200) having a plurality of sensing elements (231) disposed in a single diaphragm (210) wherein each of the sensing elements is spaced from every other of the sensing elements a predetermined distance so as to control interference among the sensing elements. Each of the sensing elements preferably comprises a purality of piezoresistors (301, 303, etc.) each of which are coupled in a Wheatstone bridge configuration. This transducer achieves sensitive, accurate, high spatial resolution measurements of non-uniform pressures.

10. 发明申请

WO1997032190A1 PRESSURE SENSOR 审中-公开
标题翻译：压力传感器
公开(公告)号：WO1997032190A1
公开(公告)日：1997-09-04
申请号：PCT/NO1997000053
申请日：1997-02-20
申请人： NYFOTEK A/S , MERINGDAL, Frode , SEEBERG, Bjorn, Erik
发明人： NYFOTEK A/S
IPC分类号： G01L09/06
CPC分类号： G01L9/0002
摘要： Pressure sensor in particular for very high pressures, preferably adapted to act externally on a measuring element (1), said measuring element having a central cavity (3) and being composed of two parts (1A-B) which are sealingly joined in order to form the cavity, and comprising sensor means (11-14) for the mechanical stress condition of the measuring element when subjected to pressure. The two parts (1A-B) of the measuring element are manufactured in planar technology, preferably of silicium or quartz, and have a substantially larger length than lateral dimensions, with the cavity oriented in the longitudinal direction. Said sensor means (11-14) are in the form of piezo-resistive elements lying adjacent to an external (5) or an internal surface of the measuring element.
摘要翻译：压力传感器特别是用于非常高的压力，优选地适于在测量元件（1）上向外作用，所述测量元件具有中心空腔（3），并且由两部分（1A-B）组成，所述两个部分（1A-B）密封地接合，以便形成空腔，并且包括当经受压力时测量元件的机械应力状态的传感器装置（11-14）。测量元件的两个部分（1A-B）以平面技术制造，优选为硅或石英，并且具有比侧向尺寸大得多的长度，其中空腔沿纵向取向。所述传感器装置（11-14）具有邻近测量元件的外部（5）或内部表面的压阻元件的形式。

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