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    • 4. 发明申请
    • LIGA FABRICATION PROCESS
    • LIGA制造工艺
    • WO2017148394A1
    • 2017-09-08
    • PCT/CN2017/075351
    • 2017-03-01
    • MASTER DYNAMIC LIMITED
    • WANG, YingnanKONG, Ching Tom
    • G03F7/04C25D1/10
    • Provided is a process of forming a three-dimensional micro component, including the step of (i) forming a three-dimensional (3D) geometry contour within a photoresist material using two-photon absorption polymerization, wherein the three-dimensional geometry contour forms a cross-linked polymeric contour defining an outer surface portion of a micro component upon the three-dimensional geometry portion formed in the photoresist having been baked; and (ii) applying a UV (ultraviolet) polymerization process so as to cross-link polymeric material of the photoresist adjacent said three-dimensional geometry contour.
    • 提供了一种形成三维微型部件的方法,包括以下步骤:(i)使用双光子吸收聚合在光致抗蚀剂材料内形成三维(3D)几何轮廓,其中 所述三维几何轮廓形成交联聚合物轮廓,所述交联聚合物轮廓在所述光致抗蚀剂中形成的所述三维几何部分已经被烘焙之后限定微部件的外表面部分; 和(ii)施加UV(紫外线)聚合过程以交联邻近所述三维几何轮廓的光刻胶的聚合物材料。
    • 9. 发明申请
    • 微細電鋳用金型とその製造方法
    • 精细电铸模具及其制造方法
    • WO2003071006A1
    • 2003-08-28
    • PCT/JP2003/001686
    • 2003-02-18
    • 住友電気工業株式会社新田 耕司稲澤 信二細江 晃久
    • 新田 耕司稲澤 信二細江 晃久
    • C25D1/10
    • C25D1/10
    • A fine electroforming mold having a simple structure which can be manufactured easily. In order to improve productivity of a metal product composed of a metal thin film, electrode portions to function as cathodes during electroforming can be arranged with a higher density and a metal thin film formed on the electrode portions can easily be peeled off. The mold has a staying power and can be used a plurality of times. There is also disclosed a manufacturing method for manufacturing the fine electroforming mold with a higher accuracy by an easier way. The fine electroforming mold (M) has a conductive substrate (1) to function as a cathode during electroforming. On the surface of the conductive substrate (1), an insulation layer (2) having an opening (21) reaching the conductive substrate (1) and having a shape corresponding to a shape of a metal product (P) when viewed from above is formed of an inorganic insulation material with a thickness T2 not smaller than 10 nm and smaller than 1/2 of thickness T1 of the metal product (P). The surface of the conductive substrate (1) exposed at the portion of the opening (21) is made to serve as an electrode portion. The manufacturing method is as follows. On the region excluding the area where a resist film (R) is pattern-formed on the surface of the conductive substrate (1), a single-layered or multi-layered inorganic film (2') is formed to grow into the insulation layer (2) by the vapor phase growth method. After this, the resist film (R) is removed and the opening (21) having a shape corresponding to the shape of the metal product (P) viewed from above and reaching the conductive substrate (1) is formed in the inorganic thin film (2').
    • 具有易于制造的结构简单的精细电铸模具。 为了提高由金属薄膜构成的金属制品的生产率,可以以更高的密度设置电铸时用作阴极的电极部分,并且可以容易地剥离形成在电极部分上的金属薄膜。 模具具有保持力并可多次使用。 还公开了一种以更简单的方式制造具有更高精度的精细电铸模的制造方法。 精细电铸模具(M)具有在电铸期间用作阴极的导电基板(1)。 在导电性基板(1)的表面上,从上方观察到具有与金属制品(P)的形状对应的形状的具有到达导电性基板(1)的开口部(21)的绝缘层(2) 由不小于10nm且小于金属产品(P)的厚度T1的1/2的厚度T2的无机绝缘材料形成。 将在开口部21露出的导电性基板(1)的表面作为电极部。 制造方法如下。 在除了导电性基板(1)的表面上形成有抗蚀剂膜(R)的区域之外的区域上,形成单层或多层无机膜(2')以生长到绝缘层 (2)通过气相生长法。 之后,除去抗蚀剂膜(R),并且形成与从上方观察并到达导电性基板(1)的与金属制品(P)的形状对应的形状的开口(21)在无机薄膜 2' )。