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1. 发明申请

WO1996025264A1 SURFACE MOUNT DEVICE REMOVAL TOOL 审中-公开
标题翻译：表面安装设备拆卸工具
公开(公告)号：WO1996025264A1
公开(公告)日：1996-08-22
申请号：PCT/US1996002120
申请日：1996-02-14
申请人： COOPER INDUSTRIES, INC.
发明人： COOPER INDUSTRIES, INC. , URBAN, Paul, L.
IPC分类号： B23K01/018
CPC分类号： H05K13/0491 , B23K1/018 , B23K2101/40 , Y10T29/53283
摘要： A surface mount device desoldering and removal tool (10) including a flexible carrier plate (12) and a plurality of heated legs (14) attached to the flexible carrier plate (12) for contacting the leads (52) of an electrical component (50). The flexible carrier plate (12) is sufficiently flexible so that the flexing of the carrier plate (12) allows the plurality of legs (14) to deflect outward to accommodate electrical components (50) of varying sizes. The plurality of legs (14) are heated by electrical resistance heating elements (22) to melt the solder (56) which connects an electrical component (50) to a circuit board (54). The legs (14) provide a grip on the leads (52) of the electrical component (50) which allows the removal tool (10) to lift the electrical component (50) when all the solder connections have been melted. The flexible carrier plate (12) is advantageously provided with shoulders (66) which allow the electrical component (50) to be easily removed from the removal tool (10).
摘要翻译：表面安装装置拆焊和拆卸工具（10），包括柔性载体板（12）和附接到柔性载体板（12）的多个加热支腿（14），用于接触电气部件（50）的引线（52））。柔性承载板（12）具有足够的柔性，使得承载板（12）的弯曲允许多个腿部（14）向外偏转以适应不同尺寸的电气部件（50）。多个腿部（14）被电阻加热元件（22）加热以熔化将电气部件（50）连接到电路板（54）的焊料（56）。腿部（14）在电气部件（50）的引线（52）上提供抓地力，当所有焊接连接件已熔化时，允许移除工具（10）提升电气部件（50）。柔性承载板（12）有利地设置有允许电气部件（50）容易地从移除工具（10）移除的肩部（66）。

2. 发明申请

WO1997012714A3 DEVICE FOR THE SELECTIVE, CONTACTLESS SOLDERING AND UNSOLDERING OF COMPONENTS 审中-公开
公开(公告)号：WO1997012714A3
公开(公告)日：1997-04-10
申请号：PCT/DE1996001820
申请日：1996-09-18
申请人： HAHN-MEITNER-INSTITUT BERLIN GMBH
发明人： HAHN-MEITNER-INSTITUT BERLIN GMBH , GERLOFF, Ulrich
IPC分类号： B23K01/018

3. 发明申请

WO1990004481A1 UNSOLDERING IRON 审中-公开
标题翻译：不合格铁
公开(公告)号：WO1990004481A1
公开(公告)日：1990-05-03
申请号：PCT/EP1989001260
申请日：1989-10-20
申请人： COOPER INDUSTRIES, INC. , EISELE, Ernst , EISELE, Fritz
发明人： COOPER INDUSTRIES, INC.
IPC分类号： B23K01/018
CPC分类号： B23K3/029
摘要： An unsoldering iron has a heated unsoldering bit with a bore that communicates by means of a suction tube with the front end of an elongated tin collecting container, the rear end of which is linked by a suction tube with a vacuum source. The front end (7) of the tin collecting container (6) is conical and the suction tube (8) extends into the container through a bore (9) in the envelope of the conical end of the tin collecting container (6), projecting beyond the inner wall of the envelope over considerable distance, so that a tin collecting space is formed around the part (5) of the suction tube (8) that projects inside the conical end (7).

4. 发明申请

WO1995013161A1 DEVICE FOR MOVING AN OBJECT BY MEANS OF THERMAL CHANGE IN SHAPE OR VOLUME 审中-公开
标题翻译：器件用于移动目的是通过热表格所OR 体积变化
公开(公告)号：WO1995013161A1
公开(公告)日：1995-05-18
申请号：PCT/EP1994003645
申请日：1994-11-07
申请人： LEICHT, Helmut, Walter
IPC分类号： B23K01/018
CPC分类号： B23K1/018 , B23K2101/42
摘要： The invention provides a device for moving an object by means of thermal change in shape or volume, such that the object is moved when a predetermined process temperature has been reached. Preferably the device can be used in a soldering system on a printed circuit board. The advantage of the invention lies in a temperature-controlled movement of the object with a high-level precision that, for example, ensures a very sparing unsoldering.
摘要翻译：提供了一种用于通过移动在达到预定的处理温度的主题提供的热成型或体积变化的装置移动物体提供的装置。优选地，该装置可以在印刷电路板中使用的焊接使用。本发明的优点在于在一个对象的具有高精度，例如温度控制的运动一个很温柔的拆焊保证。

5. 发明申请

WO1995009065A1 SOLDER-REMOVAL DEVICE 审中-公开
标题翻译：单位拆焊
公开(公告)号：WO1995009065A1
公开(公告)日：1995-04-06
申请号：PCT/CH1994000190
申请日：1994-09-26
申请人： GIAMMARINO, Luigi , DEL BASSO, Vittorio
IPC分类号： B23K01/018
CPC分类号： B23K1/018 , B23K2101/36
摘要： Described is a device for removing solder from the vicinity of welds by aplications of an underpressure, the device having a handle (1) containing a pump consisting of a cylinder (2) and a piston (3) with a piston rod (4) connected to a spring (6). The pump is designed to generate an underpressure when the initially tensioned spring (6) is allowed to expand by removing a locking pin (9) to release the piston rod (4). Located inside the handle (1) is a chamber (14) designed to collect the solder. The front end of the chamber has a tubular tip (16) made of a heat-resistant, flexible material, preferably silicon, capable of bending to adapt itself to any surface irregularities so that air is excluded while the device is being used, even when the device is held at an angle, thus optimizing the suction action. The chamber (14) has an unobstructed cross-section from the tubular tip (16) back to the rear wall, and the pump (2, 3) is connected to the chamber (14) by a line (13) which opens out on one side of the chamber (14), near the front end, so that the solder which collects at the back of the chamber (14) does not obstruct the line. The device can therefore be used for long periods without the need for frequent interruptions to clean it.
摘要翻译：一种用于通过负压装置除去焊点焊料装置包括手柄（1）的气缸（2）和活塞（3）与用于通过产生负压活塞杆（4）的现有泵中的预张紧，并通过将后一个锁定销（9）锁定活塞杆（4）延伸放松压力弹簧（6）。布置在手柄一（1）收集室（14），用于焊料具有耐热，弹性材料的前端，优选硅酮现有管状末梢（16），所述弹性同时保持气封在处理期间适应于装置的任何表面凹凸和倾斜并且由此容许最佳吸力。真空源（2,3）通入在方向的前端的连接线（13），套筒状端头（16）到后端壁连续开放截面包括收集从所述侧腔室（14），这样，在后到增压壁收集焊料不能移动的空气。因此，该设备是无需频繁中断的清洁目的长期使用。

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