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1. 发明申请

WO2006009524A1 PRINTER OR OTHER MEDIA PROCESSOR WITH ON-DEMAND SELECTIVE MEDIA CONVERTER AND VARIABLE PEELER 审中-公开
标题翻译：具有选择性媒体转换器和可变皮肤的打印机或其他媒体处理器
公开(公告)号：WO2006009524A1
公开(公告)日：2006-01-26
申请号：PCT/US2003/029218
申请日：2003-09-15
申请人： ZIH CORP. , HOHBERGER, Clive, P. , DONATO, Daniel, F. , CHIN, Wai , HAMMAN, William, J.
发明人： HOHBERGER, Clive, P. , DONATO, Daniel, F. , CHIN, Wai , HAMMAN, William, J.
IPC分类号： B32B31/00
CPC分类号： B65C9/1869 , B41J3/4075 , B41J3/44 , B65C9/1803 , B65C9/1865 , B65C2009/0003 , B65C2009/0093 , B65C2009/404 , B65H37/002 , B65H2701/194 , G06K19/07716 , G06K19/07718 , G06K19/07749 , G06K19/0776 , G06K19/07779 , G06K19/07783 , G06K19/07786 , Y10T156/1105 , Y10T156/171 , Y10T156/1906
摘要： On demand apparatus for use in a printer, printer-module, stand-alone media converter, or other media processor comprises a print device and a converting system. The print device (18) receives a series of labels, tickets, tags, cards, or other media samples (14) and responds to a set of form and content print instructions which direct the print device (18) regarding what and where to print on selected media samples (14). The converting system includes an applicator (50) which receives the series of media samples (14) from the print device (18) and a series of value-adding elements (52). The applicator (50) responds to a set of application instructions which direct the applicator (50) to apply a value-adding element (52) to selected media samples (14). A corresponding method is disclosed.
摘要翻译：用于打印机，打印机模块，独立媒体转换器或其他媒体处理器的按需设备包括打印设备和转换系统。打印设备（18）接收一系列标签，票证，标签，卡片或其他媒体样本（14），并响应一组表格和内容打印指令，指导打印设备（18）关于什么和在哪里打印在选定的媒体样本（14）上。转换系统包括从打印装置（18）接收一系列介质样本（14）的一个施加器（50）和一系列增值元件（52）。涂抹器（50）响应一组应用指令，其指导施加器（50）将增值元件（52）应用于所选择的介质样品（14）。公开了相应的方法。

2. 发明申请

WO2004112096A2 METHOD AND SYSTEM FOR HIGH VOLUME TRANSFER OF DIES TO SUBSTRATES 审中-公开
标题翻译：用于衬底高速转移的方法和系统
公开(公告)号：WO2004112096A2
公开(公告)日：2004-12-23
申请号：PCT/US2004/018577
申请日：2004-06-14
申请人： Matrics, Inc. , ARNESON, Michael R. , BANDY, William R.
发明人： ARNESON, Michael R. , BANDY, William R.
IPC分类号： H01L
CPC分类号： H01L24/95 , G06K7/0095 , G06K19/041 , G06K19/045 , G06K19/077 , G06K19/07718 , G11B7/26 , G11B23/0021 , G11B23/0042 , H01L21/67132 , H01L21/67144 , H01L21/68 , H01L21/6835 , H01L21/78 , H01L24/75 , H01L24/81 , H01L2221/68322 , H01L2221/68354 , H01L2223/54473 , H01L2224/16 , H01L2224/75 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , Y10S438/976 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49798 , Y10T29/49833 , Y10T29/53178 , Y10T29/53187 , Y10T29/5327 , Y10T29/53422 , Y10T156/1075 , Y10T156/1142 , Y10T156/1179 , Y10T156/1906 , Y10T156/1978 , Y10T156/1983 , H01L2924/00 , H01L2224/0401
摘要： A method, system, and apparatus transfer of dies from wafers to substrates is described. Large quantities of dies can be transferred directly from a wafer to corresponding substrates of a web of substrates. In another aspect, large quantities of dies can be transferred from a support surface to corresponding substrates of a web of substrates. In another aspect, large quantities of dies can be transferred from a wafer or support surface to an intermediate surface, such as a die plate. The die plate may have cells formed therein in which the dies reside. Otherwise, the dies can reside on a surface of the die plate. The dies of the die plate can then be transferred to corresponding substrates of a web of substrates. A punch plate, punch roller, or expandable material can be used to transfer dies from the die plate to substrates.
摘要翻译：描述了从晶片到基板的模具的方法，系统和装置传递。大量的模具可以直接从晶片转移到基板的相应的基板上。在另一方面，大量的模具可以从支撑表面转移到基板的相应的基板上。在另一方面，大量的模具可以从晶片或支撑表面转移到诸如模板的中间表面。模板可以在其中形成有其中模具所在的单元。否则，模具可以驻留在模板的表面上。然后将模板的模具转移到基底的相应基底上。冲压板，冲压辊或可膨胀材料可用于将模具从模板转移到基板。

3. 发明申请

WO1988001432A1 DEVICE FOR TAKING AND ASSEMBLING IDENTIFICATION ELEMENTS OF CABLES AND ELECTRIC APPLIANCES 审中-公开
标题翻译：用于获取和组装电缆和电器的识别元件的装置
公开(公告)号：WO1988001432A1
公开(公告)日：1988-02-25
申请号：PCT/FR1987000318
申请日：1987-08-12
申请人： MOROSINI, Flavio
IPC分类号： H01B13/00
CPC分类号： H01B13/344 , Y10S156/937 , Y10S269/90 , Y10S269/909 , Y10T156/1105 , Y10T156/1195 , Y10T156/19 , Y10T156/1906
摘要： The device comprises a comb (14) comprised of two dismountable halves (14A, 14B) of which the successive teeth belong alternatingly to one half and to the other half and are separated, on the assembled comb, by a pitch (P2) equal to the pitch which separates two branches of a prehension means for taking identification elements (4) which may be threaded in the supports (5) carried by both teeth (13A, 13B) of the assembled comb so that two coded messages (TX1) are simultaneously composed and are separated by dismounting the comb, for the two ends of an electric wire.
摘要翻译：该装置包括由两个可拆卸的半部（14A，14B）组成的梳子（14），其中连续的齿交替地属于一半并且另一半在组合的梳上分开，间距等于分离出分离装置的两个分支的节距，用于采集识别元件（4），所述识别元件（4）可以拧入组装的梳子的两个齿（13A，13B）所承载的支撑件（5）中，使得两个编码消息（TX1）同时通过拆卸电线将电线组合并分离，用于电线的两端。

4. 发明申请

WO2004112096A3 METHOD AND SYSTEM FOR HIGH VOLUME TRANSFER OF DIES TO SUBSTRATES 审中-公开
标题翻译：用于衬底高速转移的方法和系统
公开(公告)号：WO2004112096A3
公开(公告)日：2006-08-03
申请号：PCT/US2004018577
申请日：2004-06-14
申请人： SYMBOL TECHNOLOGIES INC , ARNESON MICHAEL R , BANDY WILLIAM R
发明人： ARNESON MICHAEL R , BANDY WILLIAM R
IPC分类号： B23P19/00 , B29C65/00 , B65C9/46 , G06K19/077 , G08B13/14 , H01L21/00 , H01L21/44 , H01L21/60 , H01L21/68 , H01L21/78 , H01L29/06 , H01R43/00 , H04Q5/22 , H05K3/00 , H05K3/30 , H05K3/34 , H05K3/36
CPC分类号： H01L24/95 , G06K7/0095 , G06K19/041 , G06K19/045 , G06K19/077 , G06K19/07718 , G11B7/26 , G11B23/0021 , G11B23/0042 , H01L21/67132 , H01L21/67144 , H01L21/68 , H01L21/6835 , H01L21/78 , H01L24/75 , H01L24/81 , H01L2221/68322 , H01L2221/68354 , H01L2223/54473 , H01L2224/16 , H01L2224/75 , H01L2224/81801 , H01L2224/83192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01057 , H01L2924/01075 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3011 , H01L2924/3025 , Y10S438/976 , Y10T29/49018 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T29/49798 , Y10T29/49833 , Y10T29/53178 , Y10T29/53187 , Y10T29/5327 , Y10T29/53422 , Y10T156/1075 , Y10T156/1142 , Y10T156/1179 , Y10T156/1906 , Y10T156/1978 , Y10T156/1983 , H01L2924/00 , H01L2224/0401
摘要： A method, system, and apparatus transfer of dies from wafers to substrates is described. Large quantities of dies can be transferred directly from a wafer to corresponding substrates of a web of substrates. In another aspect, large quantities of dies can be transferred from a support surface to corresponding substrates of a web of substrates. In another aspect, large quantities of dies can be transferred from a wafer or support surface to an intermediate surface, such as a die plate. The die plate may have cells formed therein in which the dies reside. Otherwise, the dies can reside on a surface of the die plate. The dies of the die plate can then be transferred to corresponding substrates of a web of substrates. A punch plate, punch roller, or expandable material can be used to transfer dies from the die plate to substrates.
摘要翻译：描述了从晶片到基板的模具的方法，系统和装置传递。大量的模具可以直接从晶片转移到基板的相应基板上。在另一方面，大量的模具可以从支撑表面转移到基板的相应基板。在另一方面，大量的模具可以从晶片或支撑表面转移到诸如模板的中间表面。模板可以具有形成在其中的细胞，其中管芯位于其中。否则，模具可以驻留在模板的表面上。然后可以将模板的模具转移到基片的相应基底上。可以使用冲压板，冲压辊或可膨胀材料将模具从模板转移到基板。

5. 发明申请

WO2004095542A3 APPARATUS AND METHOD FOR PICKING UP SEMICONDUCTOR CHIP 审中-公开
标题翻译：拾取半导体芯片的装置和方法
公开(公告)号：WO2004095542A3
公开(公告)日：2006-06-01
申请号：PCT/JP2004005133
申请日：2004-04-09
申请人： MATSUSHITA ELECTRIC IND CO LTD , KASAI TERUAKI
发明人： KASAI TERUAKI
IPC分类号： H01L21/00 , H01L21/68 , H01L21/683
CPC分类号： H01L21/67132 , H01L21/681 , H01L21/6838 , Y10S438/976 , Y10T156/1105 , Y10T156/1179 , Y10T156/1906 , Y10T156/1944 , Y10T156/1978 , Y10T156/1983
摘要： A semiconductor chip pick-up apparatus includes: a pick-up head for picking up the chip on a sheet; a holding table for holding the sheet; a recognition means for recognizing the chip; a positioning means for positioning the chip relatively to the pick-up head on the basis of the recognition result by the recognition means; and a sheet separating mechanism for separating the sheet from the chip by sucking the sheet from a suction plane brought in contact with a lower surface of the sheet. The sheet separating mechanism includes: a plurality of sucking grooves formed in the suction plane; a plurality of boundary zones, each of which separates the sucking grooves adjacent to each other and supports the sheet in their contact with the lower surface of the sheet during sucking; suction members movably arranged in the sucking grooves, respectively so that when they are moved toward lower surface of the sheet, they are brought into contact with the lower surface of the sheet to suck the sheet; a moving means for moving the suction members; and a sucking means for sucking the sheet from said plurality of sucking grooves.
摘要翻译：半导体芯片拾取装置包括：拾取头，用于拾取片上的芯片; 一张拿着桌子的桌子; 用于识别芯片的识别装置; 基于所述识别装置的识别结果，将所述芯片相对于所述拾取头定位的定位装置; 以及片材分离机构，用于通过从与片材的下表面接触的抽吸平面吸取片材来从片材分离片材。片材分离机构包括：形成在吸入面中的多个吸入槽; 多个边界区域，每个边界区域彼此相邻地分隔吸引槽并且在吸入期间使片材与片材的下表面接触地支撑; 吸引构件分别可移动地布置在吸入槽中，使得当它们向片材的下表面移动时，它们与片材的下表面接触以吸收片材; 用于移动抽吸构件的移动装置; 以及用于从所述多个吸入槽吸取片材的吸入装置。

6. 发明申请

WO2005120962A1 LABEL APPLICATOR SYSTEM WITH A PEEL INHIBITING APPARATUS FOR RFID LABELS 审中-公开
标题翻译：标签应用程序系统，用于RFID标签的剥离设备
公开(公告)号：WO2005120962A1
公开(公告)日：2005-12-22
申请号：PCT/EP2005/006291
申请日：2005-06-12
申请人： VIDEOJET TECHNOLOGIES LIMITED , CARVER, Ian , HERMAN, Troy
发明人： CARVER, Ian , HERMAN, Troy
IPC分类号： B65C9/00
CPC分类号： G06K7/0095 , B65C9/0006 , B65C9/42 , B65C2009/0003 , B65C2009/0093 , B65C2009/404 , G06K17/00 , G06K2017/0041 , Y10T156/1105 , Y10T156/1195 , Y10T156/1707 , Y10T156/171 , Y10T156/1906 , Y10T156/1983
摘要： An apparatus (100) and method for inhibiting the peeling of labels (115) from a web (110) is disclosed. A web with a plurality of labels is pulled towards a peeling edge (140). An antenna examines at least one of the labels. Based at least in part on the antenna's examination of at least one label, one or more of a peel inhibiting device (130) and a peeling edge (140) is moved towards or away from the other. The combination of the edge and device forms a rounded surface over which the web and labels are pulled. As the web and label(s) pass across the combination of the edge and device, the separation of at least one of the labels from the web is inhibited.
摘要翻译：公开了一种用于抑制从卷筒纸（110）剥离标签（115）的装置（100）和方法。具有多个标签的网被拉向剥离边缘（140）。天线检查至少一个标签。至少部分地基于天线对至少一个标签的检查，一个或多个剥离抑制装置（130）和剥离边缘（140）朝向或远离另一个移动。边缘和装置的组合形成一个圆形的表面，网状物和标签被拉过。当纸幅和标签穿过边缘和装置的组合时，至少一个标签与纸幅的分离被抑制。

7. 发明申请

WO2003098665A1 VERFAHREN ZUM VERARBEITEN VON ELEKTRISCHEN BAUTEILEN, INSBESONDERE ZUM VERARBEITEN VON HALBLEITERCHIPS SOWIE ELEKTRISCHEN BAUELEMENTEN, SOWIE VORRICHTUNG ZUM DURCHFÜHREN DES VERFAHRENS. 审中-公开
标题翻译：一种用于处理电器元件，特别是用于加工半导体芯片和电器元件及设备技术实现的过程。
公开(公告)号：WO2003098665A1
公开(公告)日：2003-11-27
申请号：PCT/DE2003/001152
申请日：2003-04-09
申请人： SILLNER, Georg, Rudolf
发明人： SILLNER, Georg, Rudolf
IPC分类号： H01L21/00
CPC分类号： H01L21/67144 , H01L21/67132 , H01L21/6838 , Y10T156/1906 , Y10T156/1978
摘要： Die Erfindung bezieht sich auf ein neuartiges Verfahren zum Verarbeiten von elektrischen Bauteilen, insbesondere zum Verarbeiten von Halbleiterchips sowie elektrischen Bauelementen, sowie eine Vorrichtung zum Durchführen des Verfahrens.
摘要翻译：本发明涉及一种处理的电气部件，特别是用于半导体芯片，以及电气部件的处理的新方法，以及用于执行该方法的装置。

8. 发明申请

WO2002076714A2 CARD LAMINATOR AND METHOD OF CARD LAMINATION 审中-公开
标题翻译：卡片层压机和卡片层压方法
公开(公告)号：WO2002076714A2
公开(公告)日：2002-10-03
申请号：PCT/US2002/008016
申请日：2002-03-18
申请人： CARD TECHNOLOGY CORPORATION
发明人： ASHLEY, Keith, R. , PANKIW, Igor , BURROWES, Wesley, L.
IPC分类号： B30B3/00
CPC分类号： B32B37/0007 , B29C53/18 , B32B37/0015 , B32B2425/00 , Y10T156/17 , Y10T156/1705 , Y10T156/1734 , Y10T156/1906
摘要： The invention is a laminator and a method of lamination of a plastic card (14). A laminator (10, 100) in accordance with the invention includes an infeed (12) which supplies plastic cards which are to be laminated with a plastic laminating material on a first side (18) of each card; a laminating station (20) having a heated roller (22, 114) and a card support (24, 112), opposed to the heated roller, which supports a second side of each card and is separated from the heated roller to define a card opening (28, 116) through which each plastic card passes when being laminated; a laminate source (32) which feeds plastic laminating material into the card opening between the heated roller and the first side of each plastic card with heat from the heated roller heating the plastic laminating material and each plastic card in the card opening to fuse the plastic laminating material to the first surface of each plastic card; and a card bowing the station (40), which bows each card sufficiently in a portion thereof to cause each card when cooled to be substantially flat.
摘要翻译：本发明是层压机和层压塑料卡（14）的方法。根据本发明的层压机（10,100）包括一个进料器（12），该进料器（12）在每个卡片的第一侧（18）上提供要与塑料层压材料层压的塑料卡片; 具有加热辊（22,114）和与所述加热辊相对的卡支撑件（24,112）的层压站（20），所述加热辊支撑每个卡的第二侧并与加热辊分离以限定卡打开（28,116）每个塑料卡在层压时通过该开口（28,116）; 层压源（32），其将来自加热辊的加热辊和每个塑料卡的第一侧之间的卡片开口中的塑料层压材料加热，从而加热塑料层压材料和卡片开口中的每个塑料卡以熔化塑料将每个塑料卡的第一表面层压材料; 以及弯曲站（40）的卡片，其在其一部分中充分地弯曲每张卡片，以使得每个卡片被冷却至基本平坦。

9. 发明申请

WO1995014572A1 METHOD AND APPARATUS FOR AUTOMATIC FABRICATION OF THREE-DIMENSIONAL OBJECTS 审中-公开
标题翻译：自动制作三维物体的方法和装置
公开(公告)号：WO1995014572A1
公开(公告)日：1995-06-01
申请号：PCT/IB1994000421
申请日：1994-11-21
申请人： BURNS, Marshall
IPC分类号： B32B31/00
CPC分类号： B32B38/185 , B22F3/005 , B22F2998/00 , B29C64/141 , B29C64/40 , B31D5/00 , B32B2038/1891 , B33Y10/00 , B33Y30/00 , Y10T156/1064 , Y10T156/1082 , Y10T156/1322 , Y10T156/1705 , Y10T156/1906 , B22F3/008
摘要： Disclosed is a method and apparatus for automatically fabricating a three-dimensional object from individual layers of fabrication material having a predetermined configuration. Successive layers are stacked in a predetermined sequence and affixed together to form the object. The fabrication material is carried on a substrate to a stacker station. At this station the indivicual layers are stacked together, with successive layers being affixed to each other, with the substrate removed after affixation.
摘要翻译：公开了一种用于从具有预定构造的制造材料的各个层自动制造三维物体的方法和装置。连续层以预定顺序堆叠并固定在一起以形成物体。制造材料在基板上承载到堆垛台。在这个台上，单独的层叠在一起，连续的层彼此固定，固定后去除衬底。

10. 发明申请

WO2015170210A1 SEPARATION APPARATUS FOR THIN FILM STACKED BODY 审中-公开
标题翻译：薄膜堆叠体的分离装置
公开(公告)号：WO2015170210A1
公开(公告)日：2015-11-12
申请号：PCT/IB2015/052898
申请日：2015-04-21
申请人： SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
发明人： OHNO, Masakatsu , IDOJIRI, Satoru , TAKESHIMA, Koichi , KUMAKURA, Kayo , HIRAKATA, Yoshiharu , YOKOYAMA, Kohei
IPC分类号： H01L21/02 , H01L21/683
CPC分类号： B32B38/10 , B32B38/1858 , B32B43/006 , B32B2457/00 , H05K13/0486 , Y10T156/1105 , Y10T156/1132 , Y10T156/1906 , Y10T156/1944
摘要： A separation apparatus (1) for separating a thin-film flexible stacked body (3) from a component (16) where the thin-film flexible stacked body (3) including an element layer is formed over a rigid substrate (2) such as a glass substrate, a quartz substrate, a ceramic substrate, or a metal substrate is provided. The separation apparatus (1) mainly includes a fixing device (10) for fixing the substrate (2) of the component (16), suction jigs (11) for lifting the flexible stacked body (3) by suction to be separated, circular suction pads (13) that are brought into direct contact with the flexible stacked body (3) and attached to the flexible stacked body (3) by suction, and clamp jigs (9) for holding an edge of the flexible stacked body (3). A position sensor such as a laser measuring instrument for measuring or monitoring a separation state of the flexible stacked body may be used together.
摘要翻译：一种用于将薄膜柔性层叠体（3）从包括元件层的薄膜柔性层叠体（3）的部件（16）分离的分离装置（1）形成在刚性基板（2）上，例如玻璃基板，石英基板，陶瓷基板或金属基板。分离装置（1）主要包括用于固定部件（16）的基板（2）的固定装置（10），用于通过抽吸提升柔性堆叠体（3）以分离的吸附夹具（11），圆形抽吸与柔性层叠体（3）直接接触并通过抽吸附接到柔性层叠体（3）的垫（13）和用于保持柔性层叠体（3）的边缘的夹具（9）。可以一起使用诸如用于测量或监测柔性层叠体的分离状态的激光测量仪器的位置传感器。

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