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1. 发明申请

WO2018026237A1 인쇄 회로 기판의 검사 및 불량 교정 장치와 그 방법 审中-公开
标题翻译：印刷电路板的检查和缺陷校正装置及其方法
公开(公告)号：WO2018026237A1
公开(公告)日：2018-02-08
申请号：PCT/KR2017/008450
申请日：2017-08-04
申请人： 주식회사 고영테크놀러지
发明人： 박영호 , 서금호 , 김반석 , 신재득 , 김용
IPC分类号： H05K13/08 , H05K13/04
CPC分类号： H05K13/0815 , H05K13/0486 , H05K13/0817
摘要： 인쇄 회로 기판의 검사 및 불량 교정 장치 및 방법이 개시된다. 인쇄 회로 기판의 검사 및 불량 교정 장치는 리플로우 전 공정에서 부품이 배치된 인쇄 회로 기판을 검사하여 기판상에 존재하는 불량을 검출한다. 인쇄 회로 기판의 검사 및 불량 교정 장치는 검출된 불량과 연관된 부품들을 기판으로부터 분리하고, 신규한 부품을 재배치할 수 있다. 부품을 분리하고 재배치하는 과정에서, 인쇄 회로 기판의 검사 및 불량 교정 장치는 솔더를 보납하거나, 또는 잔존 솔더를 제거한 이후 솔더를 재납할 수 있다.
摘要翻译：公开了用于印刷电路板的检查和缺陷校正的设备和方法。用于印刷电路板的检查和缺陷校正装置在预回流工艺中检查布置有部件的印刷电路板，以检测存在于基板上的缺陷。印刷电路板的检查和故障校正装置可以将与检测到的缺陷相关的部件从基板分离并重新定位新的部件。在分离和重新安置部件的过程中，印刷电路板的检查和故障校正可以取代焊料，或者在去除剩余的焊料后重新提供焊料。

2. 发明申请

WO2012143951A4 METHOD AND APPARATUS FOR COMPONENT REMOVAL 审中-公开
标题翻译：用于部件移除的方法和设备
公开(公告)号：WO2012143951A4
公开(公告)日：2013-07-11
申请号：PCT/IN2012000288
申请日：2012-04-20
申请人： ATTERO RECYCLING PVT LTD , DAS PRANAMESH , GUPTA NITIN
发明人： DAS PRANAMESH , GUPTA NITIN , SINGH KHADAK , REHMAN ABDUL
IPC分类号： H05K13/04
CPC分类号： B07B1/46 , B07B1/28 , H05K13/0486
摘要： The proposed invention relates to an apparatus and a method of separating all the parts including but not limited to electronic components, mechanical components, and electromechanical components, modules etc either individually or in sections and modular parts from the main input PCB. The proposed invention is an apparatus and method for component removal during recycling of an electronic device comprising in combination an isothermal system; heating to achieve desired range of temperature within the said isothermal system; at least one system for mechanical handling of the object being recycled; at least one system for selective separation of components being removed.
摘要翻译：所提出的发明涉及一种单独地或部分地分离所有部件（包括但不限于电子部件，机械部件和机电部件，模块等）以及来自主输入PCB的模块化部件的设备和方法。所提出的发明是一种用于在电子设备的再循环期间用于部件去除的设备和方法，所述电子设备包括组合等温系统; 加热以在所述等温系统内达到期望的温度范围; 至少一个用于对被再循环的物体进行机械处理的系统; 至少一个用于选择性分离被移除的组件的系统。

3. 发明申请

WO2012021120A1 REMOVING AND SEGREGATING COMPONENTS FROM PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：从印刷电路板移除和分离组件
公开(公告)号：WO2012021120A1
公开(公告)日：2012-02-16
申请号：PCT/US2010/044860
申请日：2010-08-09
申请人： MELONI, Mark , EMPIRE TECHNOLOGY DEVELOPMENT LLC
发明人： MELONI, Mark
IPC分类号： B23K3/00 , H05K3/00
CPC分类号： H05K13/0486 , B23K1/018 , Y10T29/49819 , Y10T29/49821 , Y10T29/5137 , Y10T29/53274 , Y10T156/1137 , Y10T156/1153 , Y10T156/19 , Y10T156/1911 , Y10T156/1939
摘要： A method for removing components from a printed circuit board by securing the printed circuit board and directing air onto the surface of the printed circuit board using a parameter such that the directed air source removes the a first component from the printed circuit board and leaves the second component intact. Additionally, a system and article comprising a computer program product for removing components from a printed circuit board using the above method is disclosed.
摘要翻译：一种用于通过固定印刷电路板并将空气引导到印刷电路板的表面上的参数，使得定向空气源从印刷电路板移除第一部件并离开第二个组件完好无损。另外，公开了一种包括用于使用上述方法从印刷电路板移除组件的计算机程序产品的系统和制品。

4. 发明申请

WO2008006239A1 光热式解焊机审中-公开
公开(公告)号：WO2008006239A1
公开(公告)日：2008-01-17
申请号：PCT/CN2006/001328
申请日：2006-06-14
申请人：萧玉如
发明人：萧玉如
IPC分类号： B23K1/018 , B23K3/04
CPC分类号： B23K1/018 , H05K13/0486
摘要：一种光热式解焊机，包括：一机箱（1）；一上盖板（2），盖合于机箱的开口，于各镂空部底侧分别固定多个风扇（211、222）；一加热罩（4），于凹陷部位底面设有一通风口（42）对应于上盖板的部份风扇，加热罩底侧与上盖板间形成具有间隙的结合；一电路板定位机构（3），设置于上盖板上，能夹持不同长宽尺寸的待解焊电路板。

5. 发明申请

WO03103861A8 MATERIAL RECYCLING APPARATUS USING LASER STRIPPING OF COATINGS 审中-公开
标题翻译：使用激光剥离涂料的材料回收设备
公开(公告)号：WO03103861A8
公开(公告)日：2005-01-06
申请号：PCT/US0317732
申请日：2003-06-05
申请人： MATSUSHITA ELECTRIC IND CO LTD , HOGAN DANIEL
发明人： HOGAN DANIEL
IPC分类号： B08B5/04 , A61K8/04 , A61Q5/06 , B08B7/00 , B09B5/00 , B23K26/03 , B23K26/073 , B23K26/36 , B65F5/00 , H05K13/04 , B23K26/10
CPC分类号： B23K26/032 , A61K8/046 , A61Q5/06 , B08B7/0042 , B09B5/00 , B23K26/03 , B23K26/0732 , H05K13/0486
摘要： An apparatus for recycling waste (100), which includes both recyclable material and non-recyclable material (104) coupled to the recyclable material. The apparatus includes a laser (200) to ablate the non-recyclable material (104) from the recyclable material (102), a detector (204) to detect the relative position of waste and the laser, a sensor (206) to determine the absorptivity of the non-recyclable material (104), positioning means (110, 214, 216) to move the laser (200) and/or the waste (100), and laser control circuitry to control the fluence of the laser source (200). The laser (200) emits light having a peak wavelength and the sensor (206) determines the absorptivity of the non-recyclable material (104) for light having a wavelength approximately equal to this peak wavelength. The positioning means (110, 214, 216) moves the laser and/or the waste (100) such that the laser light irradiates at least a portion of the waste (100), and the laser control circuitry controls the fluence of the laser light on the waste (100) based on the absorptivity of the non-recyclable material (104).
摘要翻译：一种用于回收废物（100）的设备，其包括可再循环材料和与可再循环材料相连的不可回收材料（104）。该装置包括从可再循环材料（102）烧蚀不可再循环材料（104）的激光器（200），用于检测废物和激光器的相对位置的检测器（204），用于确定废物不可回收材料（104）的吸收率，用于移动激光器（200）和/或废物（100）的定位装置（110,214,216）以及激光控制电路以控制激光源（200）的能量密度）。激光器（200）发射具有峰值波长的光，并且传感器（206）确定具有大致等于该峰值波长的波长的光的不可再循环材料（104）的吸收率。定位装置（110,214,216）使激光和/或废物（100）移动，使得激光照射废物（100）的至少一部分，并且激光控制电路控制激光的注量基于不可再循环材料（104）的吸收性而在废物（100）上。

6. 发明申请

WO9712714A2 DEVICE FOR THE SELECTIVE, CONTACTLESS SOLDERING AND UNSOLDERING OF COMPONENTS 审中-公开
标题翻译：设备非接触，选择性或焊下组件
公开(公告)号：WO9712714A2
公开(公告)日：1997-04-10
申请号：PCT/DE9601820
申请日：1996-09-18
申请人： HAHN MEITNER INST BERLIN GMBH
发明人： GERLOFF ULRICH
IPC分类号： B23K1/018 , H05K13/04
CPC分类号： B23K1/018 , B23K2201/40 , H05K13/0486
摘要： A device for the selective, contactless soldering or unsoldering of selected components has a soldering and precision positioning head for further processing, mounting or repairing boards with a high packing density of electronic components. The soldering and precision positioning head has as heating unit a halogen infrared radiator (HS) in a support (SH) for transmitting energy from the halogen infrared radiator (HS) to the component (BE) to be soldered or unsoldered, as well as a quartz glass capillary tube (QK) united with means for depositing and lifting a selected component. The top face of the quartz glass capillary tube (QK) is arranged in the focal point of the halogen infrared radiator (HS), inside a closed chamber (K) provided with a vacuum connection (VA). The top surface of the closed chamber (K) is a quartz glass pane (QS) arranged away from the focal point of the halogen infrared radiator (HS). The halogen infrared radiator (HS) is driven by a thermoelement (TE) connected to a temperature regulator (RT). This device may be used for processing very diverse components and is suitable as hand tool, in particular for servicing and repairing. It may be built as a compact arrangement into already known equipment with little mechanical outlay.
摘要翻译：精加工用在用于非接触的设备高密度电子元件的印刷电路板/改造/维修，选择性地开启或所选组件的脱焊焊料和Feinplazierkopf被提供作为所述加热单元中的发射器保持器中的卤素红外线辐射体（HS）（SH ），作为用于从卤素红外线辐射体（HS能量的传递），用于一个或auszulötenden设备（BE），和一个装置 - 具有的焦点其上端面上的Quarzglaskapillarrohr（QC） - 具有用于所选择的部件的掉落或提升相关联的卤素红外线辐射体被布置（HS）和在封闭的腔室提供，与真空连接（VA）（K）所在的位置。上层甲板区域是卤素红外线辐射体（HS）设置石英玻璃板（QS）的焦点之外。被连接到连接到温度控制器（RT）的热电偶（TE）中，卤素红外线辐射体的触发（HS）而发生。本发明的装置，其适用于加工各种不同的部件，是适合作为特别是对于服务和维修区手持机和可以安装为与在先前已知的装置的小的机械力的紧凑布置。

7. 发明申请

WO1996001972A1 SYSTEM FOR SALVAGE AND RESTORATION OF ELECTRICAL COMPONENTS FROM A SUBSTRATE 审中-公开
标题翻译：电子元件从基板上取出和恢复系统
公开(公告)号：WO1996001972A1
公开(公告)日：1996-01-25
申请号：PCT/US1995008693
申请日：1995-07-11
申请人： KRUEGER, Ellison, F.
IPC分类号： F27D11/00
CPC分类号： B23K1/018 , B23K2101/40 , H05K13/0486 , Y10T29/49757
摘要： A salvage system (10) for on-site removal and recovery of electrical components such as IC's from PC boards. The unit (12) may be mobile having at least two heating stations (32, 34), each of which includes a mounting apparatus (50) which positions the PCB above an array of infrared heating sources (100). Initial heating occurs at the first station (32) and subsequent heating to above the eutectic point of the solder occurs at the second station (34). The unit (12) is designed so that a minimum of workers can attend to the initial sorting, cleaning, sequential heating, extracting and sorting of removed components. The heating apparatus includes a fan (55), baffle (110) and deflector arrangement (120, 122, 124) which helps to maintain even heating and avoidance of hot spots.
摘要翻译：一种救援系统（10），用于从PC板上现场拆卸和恢复诸如IC的电气部件。单元（12）可以是移动的，具有至少两个加热站（32,34），每个加热站（32,34）包括将PCB定位在红外加热源阵列（100）上方的安装设备（50）。在第一站（32）处发生初始加热，并且随后在第二站（34）处加热到焊料的共晶点以上。设备（12）设计成使得最少的工人可以参加初始的分类，清洁，连续加热，提取和分离已拆卸的部件。加热装置包括有助于保持均匀加热和避免热点的风扇（55），挡板（110）和偏转器装置（120,122,124）。

8. 发明申请

WO1995016538A1 DEVICE FOR REMOVING EXCESS SOLDER FROM ITEMS BEING SOLDERED AT A SOLDERING STATION 审中-公开
标题翻译： DEVICE FOR REMOVING焊料的不需要很多一种焊接系统
公开(公告)号：WO1995016538A1
公开(公告)日：1995-06-22
申请号：PCT/EP1994004139
申请日：1994-12-14
申请人： LEICHT, Helmut, W.
IPC分类号： B23K03/06
CPC分类号： B23K1/018 , B23K2101/36 , H05K3/3468 , H05K13/0486 , H05K2203/0746 , H05K2203/0776
摘要： Proposed is a device (fluid-type knife) for the removal of solder at a soldering station. The device has a nozzle for a liquid which flows round the items being soldered. The advantages of the invention are that it reliably prevents or considerably reduces the formation of spatter or jumpers, the spatter and jumpers being removed at a very early stage. At the same time, the device can be used to provide a liquid to form a protective coat over the soldered items.
摘要翻译：提供了一种用于在焊接去除焊料的设备（ID）。该装置包括一个喷嘴，这促进了其周围的Lotgut流动的液体。本发明的优势在于可靠的预防或焊球和焊桥的显著减少，其中所述焊料桥和焊料球可以在非常早的阶段被去除。同时，该设备可以提供的液体作为用于Lotgut可用盖平台。

9. 发明申请

WO1995015073A1 A METHOD AND DEVICE FOR REMOVING A SURFACE MOUNTED COMPONENT FROM A CIRCUIT BOARD 审中-公开
标题翻译：一种用于从电路板移除表面安装组件的方法和装置
公开(公告)号：WO1995015073A1
公开(公告)日：1995-06-01
申请号：PCT/SE1994001124
申请日：1994-11-24
申请人： XICON AB , WIKSTRÖM, Bo
发明人： XICON AB
IPC分类号： H05K13/00
CPC分类号： H05K13/0486
摘要： A method and a device for removing a surface mounted component (11) from a circuit board (10), the component being attached by means of an adhesive joint. According to the method the component and the adhesive joint are subjected to a thermal shock by being cooled down and are imparted with such internal mechanical stresses that the component is loosened. The device comprises means (16, 17, 18) for supplying cooling medium to the component (11), shielding means (15) for shielding the component (11) from other components (12) and control means (19) for controlling the supply of the cooling medium and for positioning the shielding means (15) in relation to the component (11).
摘要翻译：一种用于从电路板（10）去除表面安装部件（11）的方法和装置，所述部件通过粘合接头附接。根据该方法，通过冷却来对部件和粘合接头进行热冲击，并赋予部件松动的内部机械应力。该装置包括用于向组件（11）供应冷却介质的装置（16,17,18），用于将部件（11）与其他部件（12）进行屏蔽的屏蔽装置（15）和用于控制供应并且用于将屏蔽装置（15）相对于部件（11）定位。

10. 发明申请

WO1989004589A1 WELDING DEVICE 审中-公开
标题翻译：焊接设备
公开(公告)号：WO1989004589A1
公开(公告)日：1989-05-18
申请号：PCT/EP1988000812
申请日：1988-09-08
申请人： GAMMELIN, Peter
IPC分类号： H05K03/34
CPC分类号： H05K3/3494 , B23K1/012 , H05K13/0465 , H05K13/0486 , H05K2203/087 , H05K2203/304
摘要： A device for making or undoing welds between a component with several galvanic connections and a support is particularly suited for surface mounting. In order to direct a stream of hot gas or an infrared radiation accurately onto the connections of the component and corresponding weld surfaces, a mask is provided whose openings exactly match the configuration of the weld surface. Preferably, in the case of hot-air operation, a light source is arranged behind the mask in such a way that the predetermined pattern is reproduced exactly on the substrate in the form of points of light for positioning purposes.
摘要翻译：用于在具有多个电流连接的部件和支撑件之间制造或拆除焊接的装置特别适用于表面安装。为了将热气流或红外辐射流精确地引导到部件和相应焊接表面的连接处，提供了其开口与焊接表面的构造完全匹配的掩模。优选地，在热空气操作的情况下，光源被布置在掩模的后面，使得预定图案以用于定位的光点的形式精确地再现在基板上。

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