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    • 1. 发明申请
    • 3D PHOTONIC INTEGRATION WITH LIGHT COUPLING ELEMENTS
    • 三维光子整合与光耦合元件
    • WO2016011002A1
    • 2016-01-21
    • PCT/US2015/040344
    • 2015-07-14
    • BIOND PHOTONICS INC.
    • KLAMKIN, JonathanRISTIC, Sasa
    • G02B6/13
    • H01S5/0224G02B6/12002G02B6/12004G02B6/124G02B6/13G02B6/14G02B6/34G02B6/4214G02B2006/12061G02B2006/12078G02B2006/12104G02B2006/12121G02B2006/12147H01S3/107H01S5/0085H01S5/021H01S5/02292H01S5/026H01S5/0287H01S5/1032H01S5/1085H01S5/141H01S5/142H01S5/4062
    • Methods for realizing integrated lasers and photonic integrated circuits on complimentary metal-oxide semiconductor (CMOS)-compatible silicon (Si) photonic chips, potentially containing integrated electronics, are disclosed. The integration techniques rely on light coupling with integrated light coupling elements such as turning mirrors, lenses, and surface grating couplers. Light is coupled from between two or more substrates using the light coupling elements. The technique can realize integrated lasers on Si where a gain flip chip (the second substrate) is bonded to a Si chip (the first substrate) and light is coupled between a waveguide in the gain flip chip to a Si waveguide by way of a turning mirror or grating coupler in the flip chip and a grating coupler in the Si chip. Integrated lenses and other elements such as spot-size converters can also be incorporated to alter the mode from the gain flip chip to enhance the coupling efficiency to the Si chip. The light coupling integration technique also allows for the integration of other components such as modulators, amplifiers, and photodetectors. These components can be waveguide-based or non-waveguide based, that is to say, surface emitting or illuminating.
    • 公开了在可能包含集成电路的互补金属氧化物半导体(CMOS)兼容硅(Si)光子芯片上实现集成激光器和光子集成电路的方法。 集成技术依赖于与诸如转向镜,透镜和表面光栅耦合器的集成光耦合元件的光耦合。 光使用光耦合元件从两个或更多个基板之间耦合。 该技术可以在Si上实现集成的激光器,其中增益倒装芯片(第二衬底)被结合到Si芯片(第一衬底),并且光通过转动将增益倒装芯片中的波导耦合到Si波导 倒装芯片中的反射镜或光栅耦合器以及Si芯片中的光栅耦合器。 还可以集成透镜和诸如点尺寸转换器的其它元件来改变来自增益倒装芯片的模式,以增强对Si芯片的耦合效率。 光耦合集成技术还允许其他组件如调制器,放大器和光电检测器的集成。 这些组件可以是基于波导或非波导的,也就是表面发射或照明。
    • 7. 发明申请
    • METHOD FOR PRODUCING AN INTEGRATED OPTICAL CIRCUIT
    • 用于生产一体化光电路的方法
    • WO2016023498A1
    • 2016-02-18
    • PCT/CN2015/086800
    • 2015-08-12
    • HUAWEI TECHNOLOGIES CO., LTD.
    • COLLINS, ThomasTASSAERT, Martijn
    • G02B6/12
    • G02B6/1228G02B6/12002G02B6/12004G02B6/13G02B6/131G02B6/4257G02B2006/12078G02B2006/12128G02B2006/12173G02B2006/12176G02B2006/12178H01S3/0637H01S5/021H01S5/026H01S5/1032H01S5/22H01S5/2206H01S5/2207H01S5/2209
    • A method for producing an integrated optical circuit comprising an active device and a passive waveguide circuit includes: applying (501) an active waveguide structure (510, 511, 512) on a source wafer substrate (514); exposing (502) a portion (522) of the source wafer substrate (514) by selectively removing the active waveguide structure (510, 511, 512); applying (503) a passive waveguide structure (531, 532, 533) on the exposed portion (522) of the source wafer substrate (514), wherein an aggregation of the active waveguide structure (510, 511, 512) and the passive waveguide structure (531, 532, 533) forms the active device (550), the active device (550) having a bottom surface facing the source wafer substrate (514); removing (505) the source wafer substrate (514) from the active device (550); and attaching (506) the active device (550) to a target substrate (562) comprising the passive waveguide circuit such that the bottom surface of the active device (550) faces the target substrate (562).
    • 一种包括有源器件和无源波导电路的集成光电路的制造方法,包括:在源晶片衬底(514)上施加(501)有源波导结构(510,511,512); 通过选择性地去除有源波导结构(510,511,512)来暴露(502)源晶片衬底(514)的一部分(522); 在源晶片衬底(514)的暴露部分(522)上施加(503)无源波导结构(531,532,533),其中有源波导结构(510,511,512)和无源波导 结构(531,532,533)形成有源器件(550),有源器件(550)具有面向源晶片衬底(514)的底表面; 从源器件(550)去除(505)源晶片衬底(514); 以及将所述有源器件(550)(506)附接(506)到包括所述无源波导电路的目标衬底(562),使得所述有源器件(550)的底表面面向所述目标衬底(562)。